NXP Semiconductors MPC860DPZQ80D4

Overview

MPC860DPZQ80D4 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture™ communications processor integrating CPU core, CPM, Ethernet MAC, ATM interface, and system peripherals in a single PBGA357 package. It operates at 80 MHz CPU frequency with 16 KB instruction and 8 KB data cache, supports IEEE 802.3u 10/100 Mbps Ethernet and ATM UNI 4.0, and targets embedded networking control applications including DSLAMs, enterprise routers, and industrial gateways.

For engineers reviewing the MPC860DPZQ80D4 datasheet, MPC860DPZQ80D4 pinout, MPC860DPZQ80D4 application, or MPC860DPZQ80D4 equivalent, key selection criteria include its dual-bus architecture (CPU @ 80 MHz / bus @ 40 MHz), integrated FEC and UTOPIA interfaces, thermal limits (Tj max = 95°C), 3.3 V operation with 5 V-tolerant I/O, and BGA357 mechanical compatibility for high-density routing.

Technical Context

The MPC860DPZQ80D4 implements a superscalar Power Architecture™ core with MMU, 32 GPRs, and branch prediction, paired with an enhanced RISC-based Communications Processor Module (CPM) supporting up to eight serial channels. Its memory controller provides eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states, and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

It integrates IEEE 802.3u-compliant 10/100 Mbps Ethernet MAC (FEC), UTOPIA Level 1 ATM interface (50–70 Mbps cell processing), four SCCs, two SMCs, SPI, I²C, TSA, and real-time clock - all managed via a unified system integration unit (SIU) with JTAG debug, PIT, watchdog, and clock synthesizer.

Key Specifications

Pinout & Package

357-pin Plastic Ball Grid Array (PBGA), 25 mm × 25 mm body, 1.27 mm ball pitch, ZQ package code per Freescale case number 5058 (1103D-02). Thermal pad on underside requires solder connection to PCB ground plane for optimal heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC860DPZQ80D4, MPC860PZQ80D4 offers expanded serial I/O at the cost of layout redesign, while MPC855TZQ80D4 trades peripheral richness for lower cost and simpler firmware - making the MPC860DPZQ80D4 the optimal balance for mid-tier communications controllers needing both Ethernet and ATM in a fixed-pin-count package.

Availability

MPC860DPZQ80D4 is available at Aetrix Electronics and suitable for DSLAM development, industrial protocol gateways, enterprise branch routers, and secure remote terminal units requiring stable component supply across long-lifecycle embedded programs.

Supply support for MPC860DPZQ80D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture™ embedded processors.

The MPC860 family was designed as the foundational PowerQUICC™ platform for integrated communications controllers - targeting cost-sensitive, high-reliability networking infrastructure where CPU performance, peripheral integration, and thermal efficiency must coexist in constrained form factors.

FAQ

What is the maximum operating frequency of the MPC860DPZQ80D4 CPU core?

The MPC860DPZQ80D4 CPU core operates at a maximum frequency of 80 MHz. This requires configuration in 2:1 mode, where the internal bus clock runs at 40 MHz. The hardware specification confirms this speed is supported with VDDH/VDDL = 3.135–3.465 V and junction temperature maintained ≤95°C. Operation above 40 MHz bus speed is not permitted per AC timing validation.

Does the MPC860DPZQ80D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860DPZQ80D4 includes a fully compliant IEEE 802.3u 10/100 Mbps Ethernet MAC (FEC) with MII interface. It supports full-duplex operation, auto-negotiation, and standard frame formats. However, 100 Mbps operation requires proper PCB layout (controlled impedance, length matching) and external PHY selection aligned with MII timing specifications in the MPC860 hardware manual.

What package type and pin count does the MPC860DPZQ80D4 use?

The MPC860DPZQ80D4 uses a 357-ball Plastic Ball Grid Array (PBGA) package with 25 mm × 25 mm body size and 1.27 mm ball pitch, designated ZQ per Freescale case number 5058 (1103D-02). This package includes an exposed thermal pad on the underside that must be soldered to the PCB ground plane for thermal compliance.

Can the MPC860DPZQ80D4 operate in extended temperature ranges?

Yes, the MPC860DPZQ80D4 is qualified for extended temperature operation from –40°C to +85°C ambient. This is validated per Freescale's extended temperature rating in the hardware specifications, with junction temperature limited to 95°C. Designers must ensure adequate PCB thermal design (e.g., 4-layer board with ground/power planes) to maintain Tj ≤95°C under worst-case load.

What is the role of the Communications Processor Module (CPM) in the MPC860DPZQ80D4?

The CPM in the MPC860DPZQ80D4 is a dedicated RISC co-processor that handles serial communications protocols independently of the main CPU. It manages up to four SCCs and two SMCs, executes HDLC, UART, IrDA, and PPP frames, and uses 8 KB of on-chip dual-port RAM for zero-copy buffering - freeing the Power Architecture™ core for application-layer tasks and improving real-time determinism.