NXP Semiconductors MPC860DTVR50D4

Overview

MPC860DTVR50D4 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM) in a single PBGA357 package. It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, dual 10/100 Mbps Ethernet MACs, and integrated ATM UTOPIA Level 1 support - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways requiring deterministic real-time packet processing.

For engineers reviewing the MPC860DTVR50D4 datasheet, MPC860DTVR50D4 pinout, MPC860DTVR50D4 application, or MPC860DTVR50D4 equivalent, key selection considerations include its 357-pin PBGA thermal profile, IEEE 802.3u-compliant Ethernet timing at 50 MHz, UTOPIA 1.0 cell-rate scheduling for CBR/UBR traffic, and CPM-based offload of HDLC/PPP/UART protocols from the main CPU.

Technical Context

The MPC860DTVR50D4 implements a dual-core architecture: a 32-bit Power Architecture CPU with MMU, 4 KB instruction and 4 KB data caches, and a separate RISC CPM executing communication-specific instructions (e.g., GRACEFUL STOP TRANSMIT). The CPM manages four SCCs, two SMCs, one SPI, one I²C, and a TSA for TDM time-slot routing - enabling concurrent Ethernet, ATM, and serial protocol handling without CPU intervention.

Its memory subsystem supports eight banks with dynamic bus sizing (8/16/32-bit), up to 256 MB per bank, programmable wait states (0–15), and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA. Clock synthesis includes PLL with selectable multiplication factors; thermal design relies on junction-to-board (RθJB = 13°C/W) and junction-to-ambient (RθJA = 34°C/W) metrics under natural convection on a 4-layer board.

Key Specifications

Pinout & Package

357-ball plastic ball grid array (PBGA) package, ZQ/VR case code (5058, 1103D-02), 25 mm × 25 mm body, 1.2 mm height, 1.27 mm ball pitch. Thermal pad not exposed; solder mask defined pads recommended per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860DTVR50D4, MPC860PZP50D4 offers identical functionality in a thinner package for space-constrained designs, while MPC855TVR50D4 removes ATM and second Ethernet to reduce cost and power - both require validation of CPM firmware compatibility and thermal derating at 50 MHz.

Availability

MPC860DTVR50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, carrier-grade router control planes, and secure RTUs requiring stable component supply across extended product lifecycles.

Supply support for MPC860DTVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors, headquartered in Eindhoven, Netherlands, develops high-performance microcontrollers and processors for automotive, industrial, and networking applications.

The MPC860 PowerQUICC family was designed specifically for embedded communications infrastructure - integrating CPU, CPM, and peripheral interfaces to replace multi-chip controller solutions in routers, switches, and access equipment.

FAQ

What is the maximum operating frequency of the MPC860DTVR50D4?

The MPC860DTVR50D4 is rated for a maximum system clock frequency of 50 MHz, as confirmed by AC timing specifications in Table 7 of the Rev. 10 hardware specification. At this frequency, it meets all IEEE 802.3u 100BASE-TX timing requirements and supports UTOPIA Level 1 cell rates up to 51 Mbps. Operation above 50 MHz is not supported - the MPC860DTVR50D4 must be configured in half-speed bus mode if used with higher CPU clocks.

Does the MPC860DTVR50D4 support dual Ethernet interfaces?

Yes, the MPC860DTVR50D4 integrates two fully independent 10/100 Mbps Ethernet MACs compliant with IEEE 802.3u, as documented in Table 1 and Section 4 of the hardware specification. Both MACs support MII interface, full-duplex operation, and auto-negotiation. They share no internal resources - enabling simultaneous traffic on separate physical ports without contention.

What package type does the MPC860DTVR50D4 use?

The MPC860DTVR50D4 uses a 357-ball plastic BGA (PBGA) package with ZQ/VR case code (5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height. This matches the thermal resistance values in Table 4 (RθJB = 13°C/W, RθJA = 34°C/W) and requires a 4-layer PCB with dedicated VDD/GND planes per Layout Practices section.

Can the MPC860DTVR50D4 operate in low-power modes?

Yes, the MPC860DTVR50D4 supports five power modes: Full On, Doze, Sleep, Deep Sleep, and Power Down. In Doze mode, the CPU halts but CPM, RTC, PIT, and memory controller remain active - enabling sub-50 µs wake-up for packet interrupts. Deep Sleep disables all units except RTC and PIT, reducing current draw to <100 µA while preserving timekeeping.

Is the MPC860DTVR50D4 pin-compatible with other MPC860 variants?

The MPC860DTVR50D4 shares the same 357-ball PBGA footprint and pinout with all MPC860 family members in ZQ/VR packaging (e.g., MPC860DP, MPC860T), as confirmed by mechanical data in Section 14. However, functional differences exist - for example, MPC860DT lacks the 16 KB instruction cache of MPC860DP and does not support ATM in all configurations. Pin compatibility does not guarantee functional drop-in replacement.