NXP Semiconductors MPC860ENCVR50D4

Overview

MPC860ENCVR50D4 from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM). It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, IEEE 802.3-compliant 10/100 Mbps Ethernet on SCC1–4, and up to four serial communications controllers for HDLC, UART, and transparent protocols - deployed in telecom access equipment, industrial gateways, and legacy network edge routers.

For engineers reviewing the MPC860ENCVR50D4 datasheet, MPC860ENCVR50D4 pinout, MPC860ENCVR50D4 application, or MPC860ENCVR50D4 equivalent, key selection considerations include its 357-pin PBGA package, 3.3 V core/I/O supply with 5 V-tolerant inputs (except EXTAL/EXTCLK), support for DRAM/SRAM/Flash memory interfaces, and dual-mode operation (1:1 or 2:1 CPU-to-bus ratio) enabling deterministic real-time packet processing in embedded networking systems.

Technical Context

The MPC860ENCVR50D4 integrates a Power Architecture™ CPU core with MMU, instruction/data caches, and a dedicated CPM handling protocol offload for Ethernet, HDLC, ATM (via UTOPIA), and serial interfaces. Its memory controller supports eight banks with programmable wait states, glueless interfacing to DRAM, SRAM, Flash, and PCMCIA sockets.

Timing-critical subsystems include four baud-rate generators (independent, runtime configurable), time-slot assigner (TSA) for TDM routing across SCCs/SMCs, and IEEE 1149.1 JTAG debug interface with eight hardware comparators. The device operates at 50 MHz system clock with 3.135–3.465 V supply requirement and junction temperature up to 95 °C.

Key Specifications

Pinout & Package

Package: 357-pin Plastic Ball Grid Array (PBGA), ZP designation (Case No. 5050-1103-01), 25 mm × 25 mm body, 1.27 mm ball pitch, 0.85 mm mold thickness. Thermal pad not electrically connected; requires solder mask defined thermal land pattern per JEDEC MO-251.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC855T, the MPC860ENCVR50D4 provides optimal balance of Ethernet capability, serial interface count, and memory subsystem flexibility for mid-tier embedded networking - retaining full CPM offload and cache performance while excluding ATM-specific logic that increases die area and power without benefit in non-ATM deployments.

Availability

MPC860ENCVR50D4 is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial protocol gateways, and legacy edge routers requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial embedded programs.

Supply support for MPC860ENCVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains the PowerQUICC™ portfolio for legacy industrial and telecom infrastructure applications.

The MPC860 family was designed as a highly integrated communications controller targeting cost-sensitive, real-time embedded networking - combining CPU, CPM, memory controller, and multiple serial interfaces in a single 357-pin PBGA package.

FAQ

What is the maximum operating frequency of the MPC860ENCVR50D4?

The MPC860ENCVR50D4 is rated for 50 MHz system clock operation in both 1:1 (CPU = bus) and 2:1 (CPU = 2× bus) modes per die revision D.4. At this frequency, it delivers typical power dissipation of 656 mW and supports deterministic real-time packet processing for Ethernet and serial protocols. The device must be operated within 3.135–3.465 V supply range when running at 50 MHz.

Does the MPC860ENCVR50D4 support IEEE 802.3 10/100 Mbps Ethernet?

Yes, the MPC860ENCVR50D4 supports full IEEE 802.3u-compliant 10/100 Mbps Ethernet on SCC1–SCC4, implemented in hardware by the FEC (Fast Ethernet Controller) module. This capability is enabled in specially programmed versions of the MPC860EN variant and does not require ATM functionality. The Ethernet MAC operates independently of the CPM's HDLC/ATM engines.

What package type and pin count does the MPC860ENCVR50D4 use?

The MPC860ENCVR50D4 uses a 357-pin Plastic Ball Grid Array (PBGA) package with ZP designation (Case No. 5050-1103-01), measuring 25 mm × 25 mm with 1.27 mm ball pitch. It features a 0.85 mm mold compound thickness and requires standard PBGA reflow profiles and thermal land design per JEDEC MO-251.

How does the MPC860ENCVR50D4 handle memory interfacing?

The MPC860ENCVR50D4 integrates an eight-bank memory controller supporting DRAM, SRAM, Flash, EPROM, SIMMs, and PCMCIA sockets - all without external glue logic. Each bank supports programmable wait states (up to 15), variable block sizes (32 KB to 256 MB), and selectable write protection. Boot configuration is configurable for 8-, 16-, or 32-bit memory width.

Is the MPC860ENCVR50D4 compatible with the MPC860T or MPC855T?

The MPC860ENCVR50D4 shares pin compatibility and software architecture with the MPC860T but omits ATM UTOPIA functionality. It is not pin-compatible with the MPC855T due to differing pin count (357 vs. 256), bus width (32-bit vs. 16-bit), and peripheral set (e.g., no PCMCIA or TSA in MPC855T). Migration between MPC860 variants is feasible; migration to MPC855T requires board redesign.