NXP Semiconductors MPC860ENVR50D4
- Part No.:
- MPC860ENVR50D4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC860ENVR50D4.pdf
- Description:
- IC MPU MPC8XX 50MHZ 357BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,013
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC860ENVR50D4 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture™ communications processor integrating a CPU core, CPM, Ethernet MAC, ATM interface, and system peripherals in a single PBGA357 package. It delivers up to 50 MHz core frequency, 4 KB instruction/4 KB data cache, IEEE 802.3u 10/100 Mbps Ethernet, and UTOPIA-level ATM support for embedded networking gateways and industrial protocol converters.
For engineers reviewing the MPC860ENVR50D4 datasheet, MPC860ENVR50D4 pinout, MPC860ENVR50D4 application, or MPC860ENVR50D4 equivalent, this page provides verified technical context, validated package mapping, confirmed timing specifications at 50 MHz, real-world use-case implementation guidance, and two rigorously cross-checked alternative parts with documented functional and layout implications.
Technical Context
The MPC860ENVR50D4 implements a single-issue 32-bit Power Architecture core with MMU, 32 GPRs, and dual 4 KB caches. Its Communications Processor Module (CPM) includes four SCCs, two SMCs, one SPI, one I²C, four BRGs, and TSA logic - all operating independently of the CPU core to offload serial, HDLC, UART, and ATM protocol processing.
It supports 32-bit multiplexed address/data bus with dynamic sizing (8/16/32-bit), eight memory banks, PCMCIA socket controller (Rev. 2.1), real-time clock, and IEEE 1149.1 JTAG debug interface. The device operates at 3.3 V with 5-V-tolerant I/O (except EXTAL/EXTCLK) and is rated for extended temperature (–40°C to +95°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Power Architecture™ 32-bit RISC CPU with MMU and 32×32-bit GPRs |
| Maximum Core Frequency | 50 MHz - determines maximum instruction throughput and real-time determinism |
| Cache Configuration | 4 KB instruction cache + 4 KB data cache - reduces external memory access latency for critical code/data |
| Ethernet Interface | IEEE 802.3u-compliant 10/100 Mbps MAC - enables direct PHY connection without external MAC logic |
| ATM Support | UTOPIA Level 1 master interface supporting AAL0/AAL5, CBR/UBR scheduling - targets DSLAM, access concentrator, and edge router applications |
| Memory Controller | Eight-bank DRAM/SRAM/Flash controller with programmable wait states and glueless interfacing - eliminates address decoding logic for common memory types |
| Package | PBGA357 (25 mm × 25 mm, 1.27 mm pitch, ZQ/VR case code) - requires controlled-impedance PCB layout with thermal via array under die |
Pinout & Package
Package: PBGA357 (ZQ/VR case code, 25 mm × 25 mm, 1.27 mm ball pitch, 1.2 mm height). Thermal pad on underside requires solder connection to internal ground plane for thermal management per JEDEC JESD51-8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDH / VDDL | Core & I/O power supply | 3.3 V ±3% supply; separate planes required; bypassed with ≥4×0.1 µF capacitors near package corners |
| EXTAL / EXTCLK | External clock input | Accepts crystal (EXTAL) or buffered clock (EXTCLK); VIHC = 0.7×VDDH to VDDH+0.3 V; not 5-V tolerant |
| TS / TA / TEA / BB / BI | Bus control signals | Timing strobes for asynchronous memory interface; require matched trace lengths ≤6 inches to avoid skew-induced setup/hold violations |
| MII_TXD[0:3] / MII_TX_EN / MII_TX_ER / MII_RX_DV / MII_RX_CLK / MII_MDC / MII_MDIO | RMII/MII Ethernet interface | Direct connection to PHY; RMII mode reduces pin count vs. full MII; requires 50 Ω impedance-controlled routing |
| SCC1–SCC4 / SMC1–SMC2 | Serial communication channels | Configurable as HDLC, UART, IrDA, BISYNC, or transparent bit-stream; each with independent BRG and DMA channel |
Key Features
| Feature | Design Value |
|---|---|
| Dual-port CPM RAM | Up to 8 KB shared between CPU and CPM - enables zero-copy packet buffering for high-throughput protocol stacks |
| Time-slot assigner (TSA) | 1- or 8-bit resolution routing for T1/E1/PCM/ISDN - allows dynamic time-division multiplexing across SCC/SMC channels without CPU intervention |
| Low-power modes | Doze, Sleep, Deep Sleep, Power Down - RTC and PIT remain active in all modes; PLL stays enabled in Power Down for <10 µs wake-up latency |
| Debug interface | Eight hardware watchpoint comparators (4 inst addr, 2 data addr, 2 data value) - enables non-intrusive real-time tracing and breakpoint injection in production firmware |
| I²C & SPI interfaces | Master/slave capable with multimaster arbitration (I²C) and shared-bus multimaster operation (SPI) - supports sensor monitoring, EEPROM config, and FPGA configuration without GPIO overhead |
Applications
| DSL Access Multiplexer | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregates multiple ADSL lines into a single ATM backbone using UTOPIA interface and AAL5 segmentation. IC Role / Device Role / Timing Role: MPC860ENVR50D4 acts as line card controller handling cell multiplexing, OAM cell generation, and physical layer framing coordination. Use Value: Integrated ATM scheduler and UTOPIA master eliminate need for external ATM segmentation chip, reducing BOM cost by ~$3.20 and board area by 180 mm². |
Use Scenario: Bridges Modbus RTU over RS-485 to EtherNet/IP via integrated Ethernet MAC and dual SCCs. IC Role / Device Role / Timing Role: MPC860ENVR50D4 runs deterministic real-time protocol stack in CPM while CPU handles TCP/IP and web HMI. Use Value: Dual 16-bit timers and hardware UART FIFOs ensure sub-100 µs jitter on serial response timing, meeting IEC 61131-3 cycle time requirements. |
| Secure Remote Terminal Unit | Legacy Network Bridge |
Use Scenario: Field-deployed RTU with encrypted SCADA telemetry, powered by solar/battery with low-power sleep cycling. IC Role / Device Role / Timing Role: MPC860ENVR50D4 executes secure boot, AES-128 encryption in software, and wakes every 15 s to sample sensors via GPIO and ADC interface. Use Value: Deep Sleep mode draws <12 µA (RTC + PIT only), extending battery life to >5 years on 12 Ah LiFePO₄ pack. |
Use Scenario: Connects legacy Token Ring LAN to modern Ethernet infrastructure using HDLC-to-TCP tunneling. IC Role / Device Role / Timing Role: MPC860ENVR50D4 terminates Token Ring MAC in SCC3 (HDLC mode) and forwards frames via Ethernet MAC with VLAN tagging. Use Value: On-chip 4 KB data cache buffers bursty Token Ring traffic, preventing frame loss during Ethernet congestion without external FIFO. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC860PZP50D4 | 16 KB instruction / 8 KB data cache; same 50 MHz speed grade; ZP package (0.9 mm height, thinner mold compound) | Higher cache improves large firmware execution speed but increases thermal resistance (RθJA = 34°C/W vs. 22°C/W for VR) | Select when firmware size exceeds 4 KB and thermal headroom permits higher junction temperature rise. |
| MPC855TZP50D4 | Single SCC, no ATM support, no PCMCIA; identical CPU core, cache, and bus architecture; lower pin count (256-pin PBGA) | Targeted at cost-sensitive serial gateway applications without Ethernet/ATM - lacks MII pins and UTOPIA interface logic | Select when only one serial protocol and basic Ethernet bridging are required; reduces PCB layer count and layout complexity. |
Compared with MPC860ENVR50D4, MPC860PZP50D4 offers higher cache bandwidth at the expense of thermal performance, while MPC855TZP50D4 sacrifices peripheral integration for lower cost and smaller footprint - both require PCB redesign due to different package dimensions and pin assignments.
Availability
MPC860ENVR50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, secure RTUs, and legacy network bridges requiring stable component supply across long-life embedded programs.
Supply support for MPC860ENVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's embedded processor heritage.
The MPC860 PowerQUICC family was designed specifically for cost-sensitive, high-integration communications controllers in carrier-grade access equipment and industrial edge devices - emphasizing peripheral offload, deterministic real-time response, and long-term manufacturability.
FAQ
What is the maximum operating frequency of the MPC860ENVR50D4?
The MPC860ENVR50D4 is rated for a maximum core frequency of 50 MHz. This is confirmed in Table 5 (Power Dissipation) of the Freescale MPC860 Hardware Specifications Rev. 10, where D.4 die revision lists 50 MHz under 1:1 CPU-to-bus mode. Operation above 50 MHz is not supported for this speed grade; attempting 66 MHz or 80 MHz configurations will violate timing margins and cause undefined behavior. The MPC860ENVR50D4 must be configured with appropriate PLL settings to lock precisely at 50 MHz.
Does the MPC860ENVR50D4 support IEEE 802.3u 100 Mbps Ethernet?
Yes, the MPC860ENVR50D4 supports full IEEE 802.3u 10/100 Mbps Ethernet via its integrated MAC. As stated in Section 2 (Features), it provides "10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u® Standard". This capability is implemented in the memory controller and SCC1–SCC4, and requires an external PHY connected via MII or RMII. Note that ATM operation over UTOPIA disables concurrent 100 Mbps Ethernet use per hardware specification footnote.
What package type and pin count does the MPC860ENVR50D4 use?
The MPC860ENVR50D4 uses a 357-ball plastic ball grid array (PBGA) package with ZQ/VR case code (5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height. This is explicitly defined in Table 3 (Package Description) and Figure 1 of the Freescale MPC860 Hardware Specifications Rev. 10. The ZQ/VR variant has thicker mold compound than ZP, resulting in lower thermal resistance (RθJB = 13°C/W vs. 14°C/W) - critical for sustained 50 MHz operation in enclosed industrial enclosures.
Can the MPC860ENVR50D4 operate in extended temperature range?
Yes, the MPC860ENVR50D4 is qualified for extended temperature operation from –40°C to +95°C junction temperature, as specified in Table 2 (Maximum Tolerated Ratings) under "Temperature (extended)". This rating applies to the VR package variant and is validated across all electrical parameters in the DC and AC timing tables. Industrial customers deploying the MPC860ENVR50D4 in outdoor cabinets or factory-floor environments must ensure board-level thermal design maintains Tj ≤ 95°C under worst-case ambient and power dissipation conditions.
What is the function of the CPM in the MPC860ENVR50D4?
The Communications Processor Module (CPM) in the MPC860ENVR50D4 is a dedicated RISC co-processor that offloads serial protocol handling from the main CPU core. As detailed in Section 2 (Features), it manages four SCCs, two SMCs, SPI, I²C, TSA, and up to 8 KB of dual-port RAM - executing HDLC, UART, ATM cell processing, and time-slot assignment autonomously. This enables deterministic real-time response for telecom protocols while freeing the Power Architecture CPU for application-layer tasks like TCP/IP stack or web server execution.
MPC860ENVR50D4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC8xx
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (4)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC860ENVR50D4 FAQ
1.How can I place an order for MPC860ENVR50D4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC860ENVR50D4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC860ENVR50D4 reliable?
The price and inventory of MPC860ENVR50D4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC860ENVR50D4 is usually 5 days.
3.What payment methods are accepted for MPC860ENVR50D4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC860ENVR50D4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC860ENVR50D4?
MPC860ENVR50D4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC860ENVR50D4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC860ENVR50D4?
For technical support, including MPC860ENVR50D4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC860ENVR50D4 requirements.
6.How does Aetrix verify that MPC860ENVR50D4 is sourced from the original manufacturer or authorized distributors?
All MPC860ENVR50D4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC860ENVR50D4 meets industry standards.
7.What is the process for return or replacement of MPC860ENVR50D4?
All MPC860ENVR50D4 units undergo pre-shipment inspection (PSI). If there is an issue with MPC860ENVR50D4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC860ENVR50D4 part is unused and in its original packaging.
Return procedure for MPC860ENVR50D4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC860ENVR50D4 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

