NXP Semiconductors MPC860ENZQ50D4R2

Overview

MPC860ENZQ50D4R2 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM). It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, IEEE 802.3 10/100 Mbps Ethernet support on up to four SCCs, and ATM cell processing up to 70 Mbps - deployed in telecom access gateways, industrial protocol converters, and legacy network edge routers.

For engineers reviewing the MPC860ENZQ50D4R2 datasheet, MPC860ENZQ50D4R2 pinout, MPC860ENZQ50D4R2 application, or MPC860ENZQ50D4R2 equivalent, key selection considerations include its 357-pin PBGA package, dual-voltage 3.3 V core/I/O operation with 5 V-tolerant inputs, 95 °C junction temperature rating, and compatibility with UTOPIA Level 1 and T1/E1 serial interfaces for multi-protocol WAN connectivity.

Technical Context

The MPC860ENZQ50D4R2 implements a split-architecture design: a 32-bit Power Architecture CPU core with MMU, instruction/data caches, and branch prediction coexists with an autonomous CPM handling serial protocols (HDLC, UART, IrDA, BISYNC), ATM cell processing, and Ethernet MAC functions. Its memory controller supports eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states, and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

Timing-critical subsystems include four independent baud-rate generators, a time-slot assigner (TSA) supporting T1/CEPT/ISDN framing, and IEEE 1149.1 JTAG debug interface. The device operates in multiple low-power modes (Doze, Sleep, Deep Sleep, Power Down), with real-time clock, periodic interrupt timer, and watchdog managed by the System Integration Unit (SIU).

Key Specifications

Pinout & Package

Package: 357-ball Plastic Ball Grid Array (PBGA), case number 5058 (1103D-02), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm height. Thermal performance optimized via solder-connected thermal balls tied to internal ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860ENZQ50D4R2, MPC860PZQ50D4 offers higher cache capacity for memory-intensive networking stacks but shares identical timing, pinout, and power characteristics; MPC855TZQ50D4 trades Ethernet capability for USB host support, making it unsuitable for LAN/WAN bridging but viable for peripheral-centric control applications.

Availability

MPC860ENZQ50D4R2 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol conversion, and legacy network edge routing requiring stable component supply across extended product lifecycles.

Supply support for MPC860ENZQ50D4R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with heritage from Freescale's PowerQUICC portfolio.

The MPC860 family was designed specifically for cost-sensitive, high-reliability communications controllers in carrier-class access equipment and industrial gateways - emphasizing integration of CPU, CPM, and mixed-signal peripherals in a single die.

FAQ

What is the maximum operating frequency of the MPC860ENZQ50D4R2?

The MPC860ENZQ50D4R2 is rated for a maximum system clock frequency of 50 MHz, as indicated by the "50" in its part number suffix. This frequency governs CPU execution speed, CPM serial channel bit rates, and Ethernet MAC timing. Operation above 50 MHz is not supported; attempting higher frequencies violates AC timing specifications and may cause data corruption in memory or serial interfaces.

Does the MPC860ENZQ50D4R2 support IEEE 802.3 10/100 Mbps Ethernet?

Yes, the MPC860ENZQ50D4R2 supports full IEEE 802.3u 10/100 Mbps Ethernet via its SCC1–SCC4 serial communication controllers. Each SCC can be configured as an Ethernet MAC with MII or RMII interface; however, simultaneous 100 Mbps operation on all four channels is constrained by bus bandwidth and CPM resource allocation. Real-world deployment typically uses one or two SCCs for Ethernet uplinks.

What package type and pin count does the MPC860ENZQ50D4R2 use?

The MPC860ENZQ50D4R2 uses a 357-pin Plastic Ball Grid Array (PBGA) package, designated ZQ in Freescale/NXP ordering nomenclature, with dimensions 25 mm × 25 mm and 1.27 mm ball pitch. This package variant (case number 5058) features enhanced thermal performance over the ZP variant due to greater mold compound thickness (1.15 mm vs. 0.85 mm), critical for sustained 50 MHz operation in enclosed telecom enclosures.

Can the MPC860ENZQ50D4R2 operate with 5 V-tolerant I/Os?

Yes, most I/O pins on the MPC860ENZQ50D4R2 are 5 V-tolerant, with input high voltage (VIH) specified up to 5.5 V, provided the applied voltage does not exceed VDDH + 2.5 V during power-up or normal operation. Exceptions include EXTAL and EXTCLK pins, which require VIHC = 0.7 × VDDH to VDDH + 0.3 V. This tolerance simplifies interfacing with legacy 5 V logic without level shifters.

What low-power modes are available on the MPC860ENZQ50D4R2?

The MPC860ENZQ50D4R2 supports five low-power modes: Full On, Doze (CPU halted, CPM active), Sleep (CPM in standby, RTC/PIT running), Deep Sleep (PLL disabled, RTC/PIT active), and Power Down (only RTC, PIT, time base, decrementer active). In Deep Sleep mode, typical current draw drops below 100 µA, enabling battery-backed operation in remote telemetry applications where wake-up is triggered by external interrupt or RTC alarm.