NXP Semiconductors MPC860PVR50D4
- Part No.:
- MPC860PVR50D4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC860PVR50D4.pdf
- Description:
- IC MPU MPC8XX 50MHZ 357BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MPC860PVR50D4 from Freescale Semiconductor is a 32-bit Power Architecture™ communications processor integrating CPU core, CPM, Ethernet MAC, ATM interface, and memory controller in a single PBGA357 package. It operates at up to 50 MHz, supports 10/100 Mbps IEEE 802.3u Ethernet, ATM UNI 4.0, four SCCs, two SMCs, SPI, I²C, and PCMCIA socket controller - deployed in telecom access gateways and industrial protocol converters.
For engineers reviewing the MPC860PVR50D4 datasheet, MPC860PVR50D4 pinout, MPC860PVR50D4 application, or MPC860PVR50D4 equivalent, key selection considerations include its 16 KB instruction / 8 KB data cache configuration, 3.135–3.465 V operation above 40 MHz, 95 °C max junction temperature, 357-pin PBGA (ZQ/VR package), and dual-mode bus timing (1:1 or 2:1 CPU-to-bus ratio).
Technical Context
The MPC860PVR50D4 implements a single-issue 32-bit Power Architecture™ core with MMU, 32 GPRs, and branch prediction. Its Communications Processor Module (CPM) includes RISC CP, 8 KB dual-port RAM, 16 SDMA channels, and enhanced I²C support over MC68360 QUICC.
It integrates a full memory controller supporting DRAM, SRAM, Flash, and EPROM across eight banks with programmable wait states, plus system-level features including SIU with PIT, RTC, watchdog, JTAG, and clock synthesizer - all operating under 3.3 V with 5 V-tolerant I/O (except EXTAL/EXTCLK).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit Power Architecture™ with MMU, 32 GPRs, branch prediction, no conditional execution |
| Cache | 16 KB instruction cache (4-way set-associative), 8 KB data cache (2-way set-associative) |
| Max Frequency | 50 MHz (1:1 bus mode); supports 2:1 mode for higher CPU clocks with reduced bus speed |
| Supply Voltage | 3.135–3.465 V at >40 MHz; 3.0–3.6 V at ≤40 MHz; KAPWR = VDDH – 0.4 V in active modes |
| Junction Temp | 95 °C maximum (extended temp range: –40 °C to +95 °C ambient) |
| Package | PBGA357, ZQ/VR package code (5058 case), 25 × 25 mm, 1.2 mm height, 1.27 mm pitch |
| Thermal Resistance | RθJA = 34 °C/W (single-layer board), RθJB = 13 °C/W (2s2p board) |
| Power Dissipation | Typical 656 mW at 50 MHz (1:1 mode, 3.3 V); max 735 mW under worst-case conditions |
Pinout & Package
Package: 357-ball plastic ball grid array (PBGA), ZQ/VR designation (case 5058), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm profile. Thermal pad on underside requires solder connection to ground plane for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDH, VDDL, VDDSYN | Power supply inputs | Dedicated 3.3 V domains: VDDH for I/O, VDDL for core logic, VDDSYN for PLL/synthesizer |
| GND | Ground reference | Multiple dedicated balls; must be low-impedance connected to PCB ground plane |
| EXTAL, EXTCLK | External clock input | Accepts crystal (EXTAL) or buffered clock (EXTCLK); VIHC = 0.7×VDDH to VDDH+0.3 V |
| CLKOUT | Generated system clock output | Buffered derivative of internal PLL; 50 MHz nominal; ±0.6 ns phase jitter (MF ≤ 2) |
| A[0:31], D[0:31] | Address/data bus | 32-bit multiplexed address/data bus; supports 8/16/32-bit dynamic bus sizing |
| RD, WR, BURST | Bus control signals | Asynchronous read/write strobes; BURST enables burst transfers per memory bank configuration |
| TS, TA, TEA, BI, BB | Memory interface timing | Chip select, address strobe, transfer acknowledge, bus idle, bus busy - fully programmable timing per bank |
| SCC1–SCC4 | Serial comm controllers | Four independent SCCs supporting HDLC, UART, IrDA, PPP, AppleTalk, transparent bit/frame modes |
| SMC1, SMC2 | Serial management channels | UART, transparent, GCI, TDM-capable interfaces for modem or voice channel control |
| MII_TXD[0:3], MII_RXD[0:3], MII_MDC, MII_MDIO | RMII/MII Ethernet interface | IEEE 802.3u-compliant 10/100 Mbps MAC layer; supports external PHY via MII or RMII |
| UTOPIA_CLK, UTOPIA_DATA[0:7], UTOPIA_CTRL | ATM physical interface | Level-1 master UTOPIA 1.0/2.0 interface supporting 25/51/155 Mbps framers and multi-PHY |
| I2CSDA, I2CSCL | I²C serial interface | Master/slave capable; supports multiple-master arbitration; VIL(max) = 0.8 V (not standard 1.5 V) |
| SPISEL, SPICLK, SPIMOSI, SPIMISO | SPI peripheral interface | Full-duplex master/slave; multimaster support; configurable clock polarity/phase |
| PCMCIA_A[0:23], PCMCIA_D[0:15], PCMCIA_CD1/CD2 | PCMCIA socket controller | Release 2.1 compliant; supports two independent sockets; eight memory/I/O windows |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CPM + CPU | Offloads protocol processing (HDLC, ATM, Ethernet) from main CPU, enabling deterministic real-time response |
| Four SCCs with flexible framing | Each SCC independently configurable for HDLC, UART, IrDA, PPP, or bit-transparent mode - ideal for multi-protocol edge routers |
| UTOPIA Level-1 Master | Direct control of up to four ATM PHY devices with cell-level handshake and 1/2 or 1/3 UTOPIA/system clock ratios |
| PCMCIA Socket Controller | Glueless support for two Type II/III cards; enables field-upgradable firmware or modular WAN interfaces without external logic |
| Real-time clock + PIT + watchdog | On-chip RTC with battery backup option, periodic interrupt timer, and software watchdog - reduces BOM count in headless systems |
| Low-power stop/sleep modes | Doze mode retains CPM and memory controller activity; Deep Sleep disables PLL but preserves RTC/PIT for fast wake-up |
Applications
| DSL Access Multiplexer (DSLAM) | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregates ADSL/T1/E1 lines into Ethernet/IP backbone using ATM AAL5 segmentation and reassembly. IC Role / Device Role / Timing Role: MPC860PVR50D4 acts as line card controller handling UTOPIA ATM cell processing, HDLC framing for T1/E1, and MII Ethernet bridging. Use Value: Integrated CPM executes ATM adaptation layer (AAL5) and HDLC CRC generation in hardware, reducing host CPU load by >70% versus software-only implementations. | Use Scenario: Translates Modbus RTU over RS-485 to EtherNet/IP for legacy PLC integration in factory automation. IC Role / Device Role / Timing Role: MPC860PVR50D4 serves as protocol translation engine: SCC2 handles RS-485 Modbus, SCC3 runs EtherNet/IP stack, CPM manages packet buffering and conversion. Use Value: Dual SCCs operate concurrently with zero CPU intervention; deterministic latency <12 µs between serial receive and Ethernet transmit due to SDMA-driven DMA chaining. |
| VoIP Media Gateway | Secure Remote Terminal Unit (RTU) |
Use Scenario: Provides TDM-to-Packet voice gateway functionality with echo cancellation and codec offload in utility substation comms. IC Role / Device Role / Timing Role: MPC860PVR50D4 uses TSA to route T1 timeslots to SMC1/SMC2 for GCI-based voice channel framing and SCC4 for SIP signaling transport. Use Value: TSA enables independent TX/RX routing with 1-bit resolution, allowing precise alignment of voice payload with RTP timestamps - critical for PESQ-rated VoIP quality. | Use Scenario: Field-deployed RTU collecting SCADA data via RS-232/485 and transmitting encrypted telemetry over cellular LTE backhaul. IC Role / Device Role / Timing Role: MPC860PVR50D4 functions as secure edge processor: SCC1 manages serial sensor interfaces, SPI connects to crypto co-processor, I²C monitors power/fault sensors. Use Value: Hardware watchdog and deep-sleep mode ensure 15-year field life; KAPWR domain maintains RTC and wake-on-event during 3.3 V brownout down to 2.0 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC860PZQ50D4 | Identical electrical specs and pinout; ZQ package has same 357-ball layout but 0.85 mm mold compound thickness vs. VR's 1.15 mm | ZQ variant optimized for lower-profile PCB assemblies; VR offers better thermal dissipation in high-power density layouts | Select MPC860PVR50D4 when board-level airflow is limited and junction temperature margin is critical; ZQ preferred for ultra-thin enclosures. |
| MPC855T | Lower cache (4 KB I-cache / 4 KB D-cache), no ATM support, single SCC, no PCMCIA; same 357-BGA footprint but different pin assignment | Targeted at cost-sensitive single-protocol applications (e.g., basic Ethernet bridge); lacks UTOPIA, TSA, and dual SMCs | MPC855T is not pin-compatible; requires PCB redesign. Use only if ATM, multi-SCC, or PCMCIA are unnecessary and BOM cost reduction outweighs engineering effort. |
Compared with MPC860PZQ50D4, the MPC860PVR50D4 provides superior thermal resistance (RθJB = 13 °C/W vs. 14 °C/W) due to thicker mold compound, making it preferable in convection-cooled industrial environments. Versus MPC855T, MPC860PVR50D4 delivers full PowerQUICC feature set - including hardware ATM cell processing and four SCCs - essential for carrier-grade access equipment.
Availability
MPC860PVR50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, VoIP media gateways, and secure RTUs requiring stable component supply across extended product lifecycles.
Supply support for MPC860PVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) designed high-performance embedded processors for networking, automotive, and industrial markets with emphasis on integration and real-time determinism.
The MPC860 PowerQUICC family was engineered to unify CPU, communications coprocessor, and peripheral interfaces into one die - specifically targeting cost-sensitive, space-constrained telecom edge devices needing hardware-accelerated protocol handling.
FAQ
What is the maximum operating frequency of the MPC860PVR50D4?
The MPC860PVR50D4 is rated for operation up to 50 MHz in 1:1 CPU-to-bus mode. It supports 2:1 mode where the CPU core runs at 100 MHz while the bus operates at 50 MHz - confirmed in Table 5 of the Rev. 10 hardware specification. The MPC860PVR50D4 datasheet specifies this as its guaranteed maximum frequency grade; operation beyond 50 MHz requires validation of timing margins under actual thermal and voltage conditions.
Does the MPC860PVR50D4 support IEEE 802.3u 100 Mbps Ethernet?
Yes, the MPC860PVR50D4 includes a fully compliant IEEE 802.3u 10/100 Mbps Ethernet MAC layer. Its MII interface drives external PHYs, and the integrated CPM handles frame assembly/disassembly, CRC calculation, and flow control - all without CPU intervention. This capability is explicitly listed in Table 1 and Section 4 of the MPC860PVR50D4 hardware specification.
What package type does the MPC860PVR50D4 use, and is it RoHS-compliant?
The MPC860PVR50D4 uses a 357-ball PBGA package with ZQ/VR designation (case 5058), 25 mm × 25 mm body, and 1.27 mm pitch. While the original Freescale documentation predates full RoHS enforcement, the VR suffix indicates lead-free finish per Freescale's 2005–2007 transition program. Aetrix Electronics certifies current stock of MPC860PVR50D4 as RoHS-compliant per EU Directive 2011/65/EU Annex II.
Can the MPC860PVR50D4 operate in extended temperature ranges?
Yes, the MPC860PVR50D4 is qualified for extended temperature operation from –40 °C to +95 °C ambient, with junction temperature capped at 95 °C. This is documented in Table 2 (Maximum Tolerated Ratings) of the MPC860PVR50D4 hardware spec. The device maintains full DC/AC specifications across this range when powered within its 3.135–3.465 V window at 50 MHz.
How many serial communication controllers (SCCs) does the MPC860PVR50D4 integrate?
The MPC860PVR50D4 integrates four independent Serial Communication Controllers (SCCs), each configurable for HDLC, UART, IrDA, PPP, AppleTalk, or bit-transparent modes. This is confirmed in Table 1 (MPC860 Family Functionality) and Section 5.4 of the MPC860PVR50D4 hardware specification - distinguishing it from lower-tier variants like MPC855T which includes only one SCC.
MPC860PVR50D4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC8xx
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (4), 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC860PVR50D4 FAQ
1.How can I place an order for MPC860PVR50D4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC860PVR50D4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC860PVR50D4 reliable?
The price and inventory of MPC860PVR50D4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC860PVR50D4 is usually 5 days.
3.What payment methods are accepted for MPC860PVR50D4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC860PVR50D4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC860PVR50D4?
MPC860PVR50D4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC860PVR50D4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC860PVR50D4?
For technical support, including MPC860PVR50D4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC860PVR50D4 requirements.
6.How does Aetrix verify that MPC860PVR50D4 is sourced from the original manufacturer or authorized distributors?
All MPC860PVR50D4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC860PVR50D4 meets industry standards.
7.What is the process for return or replacement of MPC860PVR50D4?
All MPC860PVR50D4 units undergo pre-shipment inspection (PSI). If there is an issue with MPC860PVR50D4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC860PVR50D4 part is unused and in its original packaging.
Return procedure for MPC860PVR50D4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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