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NXP Semiconductors MPC860PVR66D4

Part No.:
MPC860PVR66D4
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
357-BBGA
Datasheet:
AetrixMPC860PVR66D4.pdf
Description:
IC MPU MPC8XX 66MHZ 357BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,383

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Product details

Overview

MPC860PVR66D4 from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core with a dedicated RISC communications processor module (CPM), 16 KB instruction cache, 8 KB data cache, and integrated Ethernet, ATM, SCC, SMC, I²C, SPI, and PCMCIA controllers. It operates at up to 66 MHz and targets embedded networking, telecom access equipment, and industrial gateways requiring deterministic real-time communication offload.

For engineers reviewing the MPC860PVR66D4 datasheet, MPC860PVR66D4 pinout, MPC860PVR66D4 application, or MPC860PVR66D4 equivalent, key selection considerations include its 357-pin PBGA package (ZQ/VR), 3.3 V core/I/O operation with 5 V-tolerant inputs, IEEE 802.3u 10/100 Mbps Ethernet support, UTOPIA-level ATM interface, and CPM-based hardware acceleration for HDLC, UART, and transparent serial protocols.

Technical Context

The MPC860PVR66D4 implements a dual-processor architecture: a 32-bit Power Architecture™ CPU core with MMU, instruction/data caches, and branch prediction, plus a separate RISC-based Communications Processor Module (CPM) handling protocol processing independently. The CPM includes 8 KB dual-port RAM, 16 SDMA channels, four BRGs, and supports concurrent HDLC, UART, IrDA, BISYNC, and transparent bit-stream modes across four SCCs and two SMCs.

Its system integration unit provides clock synthesis, real-time clock, watchdog, JTAG debug, and low-power modes (Doze, Sleep, Deep Sleep, Power Down). Memory controller supports eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states, and glueless interfacing to DRAM, SRAM, Flash, and EPROM - enabling flexible boot and runtime memory configurations in resource-constrained systems.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core32-bit Power Architecture™ with MMU, 32 GPRs, branch prediction, no conditional execution
Cache16 KB instruction cache (4-way set-associative), 8 KB data cache (2-way set-associative)
Max Frequency66 MHz CPU/bus (1:1 mode); supports 80 MHz CPU with 40 MHz bus (2:1 mode)
Supply Voltage3.135–3.465 V at >40 MHz; 3.0–3.6 V at ≤40 MHz; KAPWR = VDDH – 0.4 V in active modes
Thermal ResistanceRθJA = 34 °C/W (natural convection, single-layer board); RθJB = 13 °C/W (junction-to-board)
Power DissipationTypical 722 mW / max 762 mW at 66 MHz (2:1 mode, 3.3 V)
Package357-pin PBGA (ZQ/VR), 25 mm × 25 mm, 1.2 mm height, 1.27 mm pitch

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ/VR designation per Freescale case number 5058 (1103D-02), 25 mm × 25 mm footprint, 1.2 mm body height, 1.27 mm ball pitch, lead-free compatible.

Pin/TerminalCircuit RoleDesign Meaning
VDDH, VDDL, VDDSYNPower supply pinsDedicated 3.3 V domains for I/O, core, and PLL; require individual 0.1 µF bypassing near each group
EXTAL, EXTCLKExternal clock inputAccepts crystal (EXTAL) or buffered clock (EXTCLK); VIHC = 0.7×VDDH to VDDH+0.3 V
CLKOUTGenerated system clock outputBuffered derivative of internal PLL; 66 MHz max, ±0.9 ns phase skew, 4 ns max rise/fall time
A[0:31], D[0:31]Address/data multiplexed bus32-bit dynamic bus supporting 8/16/32-bit transfers; timing referenced to CLKOUT with setup/hold windows
TS, TA, TEA, BI, BBMemory control signalsChip select, address strobe, transfer acknowledge, bus idle, bus busy - enable precise DRAM/SRAM timing control
SCC1–SCC4, SMC1–SMC2Serial interface channelsFour independent SCCs support HDLC/UART/Ethernet; two SMCs handle UART/GCI/TDM with configurable baud rates
I2CSDA, I2CSCLI²C interfaceOpen-drain bidirectional lines supporting master/slave mode; VIL(max) = 0.8 V (not standard 1.5 V)
MII_MDC, MII_MDIO, MII_TXD[0:3], MII_TX_ER, MII_ENRMII/MII Ethernet interfaceDirect connection to 10/100 PHY; compliant with IEEE 802.3u; requires external PHY for physical layer

Key Features

FeatureDesign Value
CPM Offload EngineHardware-accelerated protocol processing (HDLC, UART, PPP, IrDA) frees CPU for application tasks
Flexible Memory ControllerEight independent banks with programmable wait states, CAS/WE line control, and boot-selectable 8/16/32-bit interface
Integrated PeripheralsFour SCCs, two SMCs, one SPI, one I²C, four BRGs, TSA, PIP, PCMCIA socket controller, RTC, PIT, watchdog
Low-Power OperationFive power modes (Full On, Doze, Sleep, Deep Sleep, Power Down) with selective unit shutdown and fast wake-up from RTC/PIT
JTAG Debug SupportIEEE 1149.1-compliant TAP controller with eight hardware watchpoint comparators for instruction/data address/data value breakpoints

Applications

DSL Access MultiplexerIndustrial Protocol Gateway

Use Scenario: Aggregating multiple ADSL/T1/E1 lines into a high-speed Ethernet backbone using ATM cell processing and UTOPIA interface.

IC Role / Device Role / Timing Role: MPC860PVR66D4 acts as the central communications controller, performing ATM segmentation/reassembly, HDLC framing, and Ethernet MAC bridging via its CPM and SCCs.

Use Value: Enables deterministic, low-latency packet processing at up to 70 Mbps cell rate without CPU intervention, reducing host software overhead and jitter.

Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP or PROFINET in factory automation edge devices.

IC Role / Device Role / Timing Role: MPC860PVR66D4 serves as protocol translation engine, using SMCs for serial fieldbus interfaces and Ethernet SCC for industrial Ethernet stack offload.

Use Value: Hardware CRC generation/checking, autobaud detection, and dual-port RAM buffering ensure reliable, timing-critical fieldbus synchronization and deterministic response times.

Secure Remote Terminal UnitLegacy System Emulation Bridge

Use Scenario: Deploying in oil/gas SCADA systems where long-term reliability, wide temperature range (–40°C to +95°C junction), and secure firmware updates are required.

IC Role / Device Role / Timing Role: MPC860PVR66D4 functions as the trusted execution platform, managing encrypted boot, secure flash updates, and watchdog-monitored serial telemetry links.

Use Value: Integrated MMU and memory protection groups enable secure partitioning of firmware, configuration, and runtime data - meeting IEC 62443 requirements for critical infrastructure.

Use Scenario: Replacing obsolete MC68360 QUICC in legacy telecom switching cards while retaining identical PCB layout and firmware compatibility.

IC Role / Device Role / Timing Role: MPC860PVR66D4 operates as drop-in QUICC successor, leveraging enhanced CPM with added I²C and improved memory controller for backward-compatible operation.

Use Value: Pin-compatible with MC68360 in 357-pin PBGA package; same register map and CPM instruction set allows direct firmware reuse with minimal peripheral initialization updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC860PZP66D4ZP package (0.85 mm mold compound thickness vs. VR's 1.15 mm); identical electrical specs and pinoutSuitable for space-constrained designs requiring lower profile; thermal resistance RθJA = 34 °C/W same, but RθJB = 14 °C/W slightly higherSelect MPC860PZP66D4 when board height budget is <1.15 mm; verify mechanical clearance and thermal path to PCB ground plane.
MPC855TLower cache (4 KB I-cache / 4 KB D-cache), single SCC, no ATM support, 40 MHz max frequency, 256-pin PQFP packageTargeted at cost-sensitive, lower-bandwidth applications like basic serial gateways or simple network bridges without Ethernet/ATMChoose MPC855T only if bandwidth, protocol breadth, and cache size requirements are significantly reduced; not pin-compatible.

Compared with MPC860PZP66D4, the MPC860PVR66D4 offers superior thermal conduction to the PCB (RθJB = 13 °C/W vs. 14 °C/W) due to thicker mold compound, making it preferred for sustained 66 MHz operation in thermally dense layouts; versus MPC855T, it delivers 4× instruction cache, dual Ethernet-capable SCCs, and full ATM protocol acceleration - essential for carrier-grade access equipment.

Availability

MPC860PVR66D4 is available at Aetrix Electronics and suitable for DSLAMs, industrial protocol gateways, secure RTUs, and legacy telecom emulation requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for MPC860PVR66D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture™ and communications processors.

The MPC860 PowerQUICC™ family was designed specifically for embedded networking and telecom edge applications requiring hardware-accelerated protocol processing, real-time determinism, and integration of CPU, CPM, and peripherals on a single die - exemplified by the MPC860PVR66D4 variant optimized for 66 MHz operation in extended temperature environments.

FAQ

What is the maximum operating frequency of the MPC860PVR66D4?

The MPC860PVR66D4 is rated for 66 MHz CPU and bus operation in 1:1 mode. It also supports 80 MHz CPU frequency with 40 MHz bus in 2:1 mode, as confirmed in Table 5 of the Freescale MPC860 Hardware Specifications Rev. 10. This dual-mode capability allows designers to balance performance and timing margin in memory subsystem design. The MPC860PVR66D4 must be configured accordingly via PLL settings and bus timing registers to maintain signal integrity and meet setup/hold requirements.

Does the MPC860PVR66D4 support IEEE 802.3u 10/100 Mbps Ethernet?

Yes, the MPC860PVR66D4 supports full IEEE 802.3u 10/100 Mbps Ethernet via its SCC1–SCC4 channels, as explicitly stated in Section 2 Features and Table 1 of the MPC860 Hardware Specifications. This functionality requires an external PHY connected through the MII or RMII interface (MII_MDC, MII_MDIO, MII_TXD[0:3], etc.). The MPC860PVR66D4 handles MAC-layer processing including CRC generation/checking, frame filtering, and buffer management in hardware, reducing CPU load during high-throughput traffic.

What package type does the MPC860PVR66D4 use, and how is it designated?

The MPC860PVR66D4 uses a 357-pin plastic ball grid array (PBGA) package with designation ZQ/VR, corresponding to Freescale case number 5058 (1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm body height. This is confirmed in Table 3 ("Package Description") of the MPC860 Hardware Specifications Rev. 10. The "VR" suffix in the part number directly references this ZQ/VR package variant, distinguishing it from the ZP-package MPC860PZP66D4.

Can the MPC860PVR66D4 operate in extended temperature ranges?

Yes, the MPC860PVR66D4 is qualified for extended temperature operation from –40°C to +95°C junction temperature, as specified in Table 2 ("Maximum Tolerated Ratings") under "Temperature (extended)" in the MPC860 Hardware Specifications Rev. 10. This makes it suitable for industrial and outdoor telecom applications. Ambient temperature limits depend on power dissipation and board thermal design; thermal calculations using RθJB = 13 °C/W and measured board temperature (TB) are recommended to ensure TJ remains within spec.

Is the MPC860PVR66D4 pin-compatible with the MC68360 QUICC?

The MPC860PVR66D4 is pin-compatible with the MC68360 QUICC in the 357-pin PBGA package, as confirmed by Freescale documentation stating the MPC860 "implements a superset of Freescale's MC68360 quad integrated communications controller" and shares identical pinout for core signals, memory bus, and serial interfaces. However, enhancements like the added I²C port and updated PCMCIA controller require verification of unused pin states and initialization sequence updates when migrating firmware from MC68360 to MPC860PVR66D4.

MPC860PVR66D4 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
357-BBGA
Series:
MPC8xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10Mbps (4), 10/100Mbps (1)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
357-PBGA (25x25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

MPC860PVR66D4 FAQ

1.How can I place an order for MPC860PVR66D4 through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC860PVR66D4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC860PVR66D4 reliable?

The price and inventory of MPC860PVR66D4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC860PVR66D4 is usually 5 days.

3.What payment methods are accepted for MPC860PVR66D4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC860PVR66D4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC860PVR66D4?

MPC860PVR66D4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC860PVR66D4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC860PVR66D4?

For technical support, including MPC860PVR66D4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC860PVR66D4 requirements.

6.How does Aetrix verify that MPC860PVR66D4 is sourced from the original manufacturer or authorized distributors?

All MPC860PVR66D4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC860PVR66D4 meets industry standards.

7.What is the process for return or replacement of MPC860PVR66D4?

All MPC860PVR66D4 units undergo pre-shipment inspection (PSI). If there is an issue with MPC860PVR66D4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC860PVR66D4 part is unused and in its original packaging.

Return procedure for MPC860PVR66D4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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