NXP Semiconductors MPC860PVR80D4R2

Overview

MPC860PVR80D4R2 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a dedicated RISC communications processor module (CPM). It operates at up to 80 MHz, integrates 16 KB instruction and 8 KB data caches, supports 10/100 Mbps Ethernet and ATM over UTOPIA, and targets embedded networking control applications in industrial gateways and telecom edge devices.

For engineers reviewing the MPC860PVR80D4R2 datasheet, MPC860PVR80D4R2 pinout, MPC860PVR80D4R2 application, or MPC860PVR80D4R2 equivalent, key selection considerations include its 357-pin PBGA package, dual-voltage 3.3 V core/I/O operation with 5-V-tolerant inputs, IEEE 802.3u-compliant Ethernet MAC, and CPM-based offload of serial protocol handling (HDLC, UART, I²C, SPI, SCCs).

Technical Context

The MPC860PVR80D4R2 implements a split-processor architecture: a 32-bit Power Architecture CPU core with MMU, instruction/data caches, and branch prediction handles general-purpose tasks and OS execution, while the independent CPM executes communications protocols-including HDLC, UART, and ATM cell processing-without CPU intervention. Its memory controller supports eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states, and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

Timing-critical functions are managed by dedicated hardware: four 16-bit timers (or two 32-bit), system integration unit (SIU) with PIT, RTC, watchdog, and JTAG debug interface; and a clock synthesizer enabling flexible PLL configurations. The device uses a 357-pin PBGA (ZQ/VR package code) with thermal resistance R_θJA = 22°C/W on a 4-layer board, requiring careful power plane layout and bypassing per Freescale's layout guidelines.

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ/VR case code (5058, 1103D-02), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm profile height. Thermal resistance R_θJB = 13°C/W, R_θJC = 8°C/W on 4-layer board.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860PZQ80D4, MPC860PVR80D4R2 offers superior thermal performance (R_θJA = 22°C/W vs. 34°C/W) and mechanical robustness for industrial environments; versus MPC855T, it delivers 2× CPU frequency, 4× cache, dual Ethernet/ATM capability, and full CPM feature set-enabling complex protocol stacks without external co-processors.

Availability

MPC860PVR80D4R2 is available at Aetrix Electronics and suitable for industrial protocol gateways, DSL edge routers, cellular base station controllers, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC860PVR80D4R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture™ microcontrollers.

The MPC860 PowerQUICC family was designed specifically for embedded communications infrastructure-integrating CPU, CPM, and peripheral sets to replace multi-chip controller designs in networking edge equipment and protocol-conversion gateways.

FAQ

What is the maximum operating frequency of the MPC860PVR80D4R2?

The MPC860PVR80D4R2 is rated for a maximum CPU frequency of 80 MHz. However, due to bus timing constraints, the external bus must operate at 40 MHz (2:1 mode) when the CPU runs at 80 MHz. This configuration is explicitly supported in the hardware specifications and validated in Rev. 10 documentation. Running the MPC860PVR80D4R2 above 80 MHz violates absolute maximum ratings and is not guaranteed.

Does the MPC860PVR80D4R2 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860PVR80D4R2 supports full IEEE 802.3u-compliant 10/100 Mbps Ethernet via its SCCs, but only when ATM is not active over the UTOPIA interface. The hardware specification confirms Ethernet functionality is available on SCC1–SCC4, with 100 Mbps operation validated at 80 MHz CPU speed. The MPC860PVR80D4R2 implements the MAC layer only; an external PHY is required for physical layer signaling.

What package type and thermal characteristics apply to the MPC860PVR80D4R2?

The MPC860PVR80D4R2 uses a 357-ball PBGA package with ZQ/VR case code (5058, 1103D-02), 25 mm × 25 mm body, 1.27 mm pitch, and 1.2 mm height. Its thermal resistance is R_θJA = 22°C/W on a 4-layer board (2s2p), R_θJB = 13°C/W, and R_θJC = 8°C/W. These values are measured per JEDEC JESD51-6 and are documented in Table 4 of the MPC860 Hardware Specifications Rev. 10.

Can the MPC860PVR80D4R2 execute Linux or other full-featured OSes?

Yes-the MPC860PVR80D4R2 includes a full MMU with 32-entry TLB, 4-/16-KB instruction cache, and 4-/8-KB data cache, enabling certified execution of Linux 2.4/2.6 kernels and real-time OSes like VxWorks and RTEMS. Its 32-bit Power Architecture core and memory management capabilities meet minimum requirements for protected-mode multitasking, as confirmed in the MPC860 User's Manual (MPC860UM, Rev. 3).

Is the MPC860PVR80D4R2 pin-compatible with other MPC860 variants?

Yes-MPC860PVR80D4R2 shares the same 357-ball PBGA footprint and pinout as all MPC860P-series devices (e.g., MPC860PZQ80D4, MPC860PVR66D4), including identical signal assignments for VDD, GND, CLKOUT, A/D buses, and peripheral interfaces. Mechanical compatibility is confirmed in Table 3 (Package Description) and Figure 10 (Ball Map) of the MPC860 Hardware Specifications Rev. 10.