NXP Semiconductors MPC860SRCVR50D4

Overview

MPC860SRCVR50D4 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM). It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, IEEE 802.3 10/100 Mbps Ethernet support on SCC channels, and UTOPIA-level ATM cell processing up to 70 Mbps - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways.

For engineers reviewing the MPC860SRCVR50D4 datasheet, MPC860SRCVR50D4 pinout, MPC860SRCVR50D4 application, or MPC860SRCVR50D4 equivalent, this page provides verified functional scope, thermal resistance values (RθJA = 34°C/W), bus timing at 50 MHz, DC electrical specs (VDDH/VDDL = 3.135–3.465 V), and confirmed package mapping to PBGA-357 ZP/VR.

Technical Context

The MPC860SRCVR50D4 implements a dual-bus architecture: a 32-bit CPU bus operating at 50 MHz and a separate CPM bus for offloading serial, Ethernet, and ATM traffic. Its CPM includes four SCCs, two SMCs, one SPI, one I²C, and a TSA supporting T1/E1 time-slot routing - enabling concurrent HDLC, UART, and ATM AAL5 processing without CPU intervention.

Power management supports five modes (Full On, Doze, Sleep, Deep Sleep, Power Down), with RTC, PIT, and PLL retained in all low-power states. The memory controller supports eight banks with programmable wait states (up to 15 per bank), DRAM/SRAM/Flash glueless interfacing, and boot-selectable 8/16/32-bit width.

Key Specifications

Pinout & Package

Package: 357-ball PBGA (ZP/VR designator), 25 mm × 25 mm, 1.27 mm pitch, 0.85 mm (ZP) or 1.15 mm (VR) mold compound thickness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC860DP, the MPC860SRCVR50D4 uniquely combines factory-enabled 10/100 Ethernet MAC functionality, validated 50 MHz timing, and guaranteed RθJA = 34°C/W - making it the only option for space-constrained, thermally limited DSLAM line cards requiring embedded MAC and deterministic ATM processing.

Availability

MPC860SRCVR50D4 is available at Aetrix Electronics and suitable for DSLAM line card control, industrial protocol gateway, enterprise router management plane, and carrier-grade TDM access node applications requiring stable component supply across extended product lifecycles.

Supply support for MPC860SRCVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance Power Architecture™ microcontrollers and communications processors for networking, automotive, and industrial markets.

The MPC860 family was developed specifically for embedded communications infrastructure requiring integrated CPU, CPM, and peripheral flexibility - targeting DSLAMs, routers, gateways, and TDM access equipment with deterministic real-time packet handling.

FAQ

What is the maximum operating frequency of the MPC860SRCVR50D4?

The MPC860SRCVR50D4 is rated for a maximum system clock frequency of 50 MHz. This is confirmed in the hardware specifications document (Rev. 10, Section 9, Table 7), where AC timing parameters are explicitly validated at 50 MHz. Operation above 50 MHz is not supported - attempting 66 MHz or 80 MHz configurations violates the device's maximum tolerated ratings and invalidates timing margins.

Does the MPC860SRCVR50D4 include built-in 10/100 Ethernet MAC functionality?

Yes, the MPC860SRCVR50D4 includes factory-programmed 10/100 Mbps Ethernet MAC support on its SCC channels, as documented in Table 1 and Section 2 Features of the MPC860 hardware specification. This capability is exclusive to certain MPC860 variants (including SRCVR50D4) and is disabled when UTOPIA ATM mode is active - a hardware-enforced mutual exclusion.

What package type and thermal characteristics apply to the MPC860SRCVR50D4?

The MPC860SRCVR50D4 uses a 357-ball PBGA package (ZP or VR designator) with 25 mm × 25 mm footprint and 1.27 mm ball pitch. Its thermal resistance is RθJA = 34°C/W under natural convection on a single-layer board, and RθJB = 14°C/W junction-to-board - critical for thermal design in enclosed DSLAM chassis where airflow is restricted.

How does the CPM in the MPC860SRCVR50D4 reduce CPU overhead in communications tasks?

The CPM in the MPC860SRCVR50D4 executes serial protocols (HDLC, UART, ATM AAL5) autonomously using dedicated RISC microcode and 8 KB dual-port RAM. It handles frame assembly/disassembly, CRC generation/checking, and DMA transfers without CPU intervention - reducing host interrupt load by up to 70% compared to software-only implementations, as verified in Freescale application note AN2101.

What power supply voltage range must be maintained for reliable 50 MHz operation of the MPC860SRCVR50D4?

For stable 50 MHz operation, the MPC860SRCVR50D4 requires VDDH and VDDL supply voltages within 3.135 V to 3.465 V, as specified in Table 6 (DC Electrical Specifications). This ±4.5% tolerance mandates precision 3.3 V regulation - exceeding this range risks timing violations, cache coherency errors, or undefined reset behavior.