NXP Semiconductors MPC860SRCVR66D4

Overview

MPC860SRCVR66D4 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core, communications processor module (CPM), and system integration unit in a single PBGA-357 package. It delivers 66 MHz CPU operation, 4 KB instruction/4 KB data cache, IEEE 802.3u 10/100 Mbps Ethernet support on SCCs, ATM UTOPIA-level-1 interface, and four serial communications controllers - enabling embedded networking gateways, industrial protocol converters, and telecom access equipment.

For engineers reviewing the MPC860SRCVR66D4 datasheet, MPC860SRCVR66D4 pinout, MPC860SRCVR66D4 application, or MPC860SRCVR66D4 equivalent, key selection criteria include its 66 MHz bus timing compliance, dual-voltage 3.3 V core / 3.3 V I/O operation, 357-pin PBGA thermal performance (RθJB = 13 °C/W), and CPM-based offloading of HDLC, UART, SPI, I²C, and TDM traffic from the main CPU.

Technical Context

The MPC860SRCVR66D4 implements a dual-core architecture: a 32-bit Power Architecture CPU with MMU, instruction/data caches, and branch prediction; and a RISC-based Communications Processor Module (CPM) handling serial protocols independently via 16 SDMA channels and dual-port RAM. Its memory controller supports eight banks with programmable wait states and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

Timing-critical subsystems include four SCCs supporting HDLC/SDLC (2 Mbps), Ethernet (10/100 Mbps), UART, IrDA, and BISYNC; two SMCs for GCI/TDM; one SPI master/slave interface; one I²C port; and a time-slot assigner (TSA) enabling dynamic T1/E1/PCM routing. The SIU provides PIT, RTC, watchdog, JTAG, and clock synthesis with PLL-based frequency generation.

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ/VR case code (5058, 1103D-02), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC860P, the MPC860SRCVR66D4 offers optimal balance of deterministic 66 MHz performance, verified thermal behavior (RθJB = 13 °C/W), and cost-effective 4 KB cache - making it preferred for volume-deployed telecom edge devices where thermal headroom and firmware footprint are tightly constrained.

Availability

MPC860SRCVR66D4 is available at Aetrix Electronics and suitable for industrial protocol gateways, DSL access multiplexers, telecom RTUs, and secure router platforms requiring stable component supply across long-lifecycle deployments.

Supply support for MPC860SRCVR66D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, industrial, and networking markets.

The MPC860SRCVR66D4 belongs to the PowerQUICC™ family - engineered specifically for integrated communications control in space- and power-constrained edge infrastructure, combining CPU, CPM, and SIU to replace multi-chip controller solutions.

FAQ

What is the maximum bus frequency supported by the MPC860SRCVR66D4?

The MPC860SRCVR66D4 supports a maximum bus frequency of 33 MHz when operating at its rated 66 MHz CPU speed (2:1 mode). As confirmed in Table 7 of the hardware specification, bus timing parameters are validated up to 33 MHz - attempting higher bus speeds violates AC timing margins and risks metastability or data corruption. The device must be configured with MF=2 for stable 66 MHz CPU operation.

Does the MPC860SRCVR66D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860SRCVR66D4 supports full IEEE 802.3u 10/100 Mbps Ethernet on its SCCs, as explicitly stated in Section 2 Features. This capability requires external PHY connection via MII interface and proper configuration of SCC1–SCC4 in Ethernet mode - the CPM handles MAC-layer functions including CRC, preamble, and backoff, freeing the CPU for higher-layer processing.

What package type and thermal resistance does the MPC860SRCVR66D4 use?

The MPC860SRCVR66D4 uses a 357-ball PBGA package with ZQ/VR case code (5058, 1103D-02), and its junction-to-board thermal resistance is 13 °C/W on a four-layer board (2s2p), per Table 4. This value enables accurate thermal modeling using TJ = TB + (13 × PD), critical for industrial designs operating at –40 °C to +95 °C junction temperature.

Can the MPC860SRCVR66D4 operate with 5 V-tolerant I/Os?

No - the MPC860SRCVR66D4 operates at 3.3 V and is not 5 V tolerant. All inputs (except EXTAL and EXTCLK) have VIH(max) = 5.5 V only under absolute maximum stress conditions; functional operation requires VIH ≤ VDDH and VIL ≥ 0 V, with VDDH limited to 3.135–3.465 V above 40 MHz. Applying 5 V to any input risks permanent damage per Table 2's caution note.

How many serial communication controllers (SCCs) does the MPC860SRCVR66D4 integrate?

The MPC860SRCVR66D4 integrates four serial communications controllers (SCCs), as confirmed in Table 1 and Section 2 Features. Each SCC supports multiple protocols including HDLC/SDLC (2 Mbps), Ethernet (10/100 Mbps), UART, IrDA, BISYNC, and transparent bit-stream modes - all managed independently by the CPM without CPU overhead.