NXP Semiconductors MPC860SRCZQ66D4

Overview

MPC860SRCZQ66D4 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM) in a single PBGA357 package. It delivers 66 MHz CPU operation, 4 KB instruction/4 KB data cache, IEEE 802.3u-compliant 10/100 Mbps Ethernet on SCCs, and UTOPIA-level ATM support up to 70 Mbps - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways.

For engineers reviewing the MPC860SRCZQ66D4 datasheet, MPC860SRCZQ66D4 pinout, MPC860SRCZQ66D4 application, or MPC860SRCZQ66D4 equivalent, this page provides verified technical context, validated pin functions, real-world timing constraints at 66 MHz bus speed, thermal resistance values for PBGA ZQ package, and two field-validated alternative parts with documented functional trade-offs.

Technical Context

The MPC860SRCZQ66D4 implements a dual-execution-domain architecture: a 32-bit Power Architecture CPU core with MMU, 4 KB instruction and 4 KB data caches, and a separate RISC CPM handling serial protocols (HDLC, UART, SPI, I²C) and ATM cell processing. Its memory controller supports eight banks with programmable wait states and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

It integrates four Serial Communication Controllers (SCCs), two Serial Management Channels (SMCs), one SPI, one I²C port, a Time-Slot Assigner (TSA), and system-level peripherals including PIT, RTC, watchdog, JTAG debug interface, and clock synthesizer - all operating from a single 3.3 V supply with 5 V-tolerant I/O (except EXTAL/EXTCLK).

Key Specifications

Pinout & Package

Package: PBGA357 (ZQ package code per Freescale case number 5058, 25×25×1.2 mm, 1.27 mm ball pitch). Thermal pad not electrically connected; soldered to ground plane for thermal conduction only.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860SRCZQ66D4, MPC860T removes integrated Ethernet MAC capability while retaining identical timing and packaging, whereas MPC855T eliminates both Ethernet and ATM subsystems - making MPC860SRCZQ66D4 the only option among the three supporting concurrent 10/100 Mbps LAN and UTOPIA ATM in a single chip.

Availability

MPC860SRCZQ66D4 is available at Aetrix Electronics and suitable for carrier-grade DSLAMs, industrial protocol gateways, telecom router control planes, and secure remote terminal units requiring stable component supply across extended lifecycle deployments.

Supply support for MPC860SRCZQ66D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, with deep heritage in Power Architecture™ microcontrollers.

The MPC860 family was designed as the foundational PowerQUICC™ platform for communications infrastructure - integrating CPU, CPM, and high-speed serial interfaces to replace multi-chip controller designs in routers, DSLAMs, and protocol converters.

FAQ

What is the maximum supported bus speed for MPC860SRCZQ66D4?

The MPC860SRCZQ66D4 supports a maximum bus speed of 66 MHz in 1:1 mode (CPU = bus). When operated at 80 MHz CPU frequency, it must use 2:1 mode, limiting the bus to 40 MHz. Bus timing parameters in Table 7 of the hardware spec are validated for 33/40/50/66 MHz operation, with setup/hold margins degrading above 66 MHz due to fixed internal pipeline latencies. MPC860SRCZQ66D4 does not support 80 MHz bus operation.

Does MPC860SRCZQ66D4 include an integrated Ethernet MAC?

Yes, MPC860SRCZQ66D4 includes a fully compliant IEEE 802.3u 10/100 Mbps Ethernet MAC implemented within its Serial Communication Controllers (SCCs), specifically enabled on SCC1–SCC4. This MAC supports full-duplex operation, auto-negotiation, and MII interface signaling. The MPC860SRCZQ66D4 datasheet confirms Ethernet functionality is present in the SR variant, distinguishing it from non-Ethernet variants like MPC860T.

What package type and thermal characteristics apply to MPC860SRCZQ66D4?

MPC860SRCZQ66D4 uses the ZQ package: PBGA357 (25×25 mm, 1.2 mm height, 1.27 mm ball pitch, case number 5058). Its thermal resistance is RθJA = 34°C/W on a single-layer board and RθJB = 13°C/W to the PCB - critical for thermal design in enclosed telecom chassis. The device's maximum junction temperature is 95°C, and it supports extended temperature operation from −40°C to +85°C ambient.

Can MPC860SRCZQ66D4 operate with a 5 V input signal on its I/O pins?

Yes, most I/O pins on MPC860SRCZQ66D4 tolerate 5 V inputs (VIH up to 5.5 V), but with strict constraints: input voltage must not exceed VDDH + 2.5 V at any time, including power-up sequences. Pins EXTAL and EXTCLK are exceptions - they require VIH = 0.7 × VDDH to VDDH + 0.3 V. All 5 V-tolerant pins maintain 3.3 V logic thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V) per DC specs in Table 6.

What debug interfaces are supported by MPC860SRCZQ66D4?

MPC860SRCZQ66D4 supports IEEE 1149.1 JTAG boundary-scan and on-chip emulation via its TAP controller. It includes eight hardware watchpoint comparators (four for instruction address, two for data address, two for data value), enabling precise breakpoint insertion without code instrumentation. Debug access is fully compatible with standard JTAG emulators used for Power Architecture™ development, and MPC860SRCZQ66D4 retains full debug capability across all low-power modes except Deep Sleep and Power Down.