NXP Semiconductors MPC860SRVR50D4

Overview

MPC860SRVR50D4 from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core with a dedicated RISC communications processor module (CPM), supporting up to four serial communications controllers (SCCs), 10/100 Mbps Ethernet, ATM over UTOPIA, I²C, SPI, and PCMCIA interfaces. It operates at 50 MHz, features 4 KB instruction and 4 KB data caches, and targets embedded networking and telecom control applications.

For engineers reviewing the MPC860SRVR50D4 datasheet, MPC860SRVR50D4 pinout, MPC860SRVR50D4 application, or MPC860SRVR50D4 equivalent, key selection considerations include its 357-pin PBGA package, IEEE 802.3u-compliant Ethernet support, UTOPIA-level ATM cell processing, CPM-based offload architecture, and 3.3 V operation with 5 V-tolerant I/Os.

Technical Context

The MPC860SRVR50D4 implements a dual-processor architecture: a 32-bit Power Architecture™ CPU core with MMU, 4 KB instruction and 4 KB data caches, and a separate RISC-based Communications Processor Module (CPM) handling protocol processing for SCCs, SMCs, and FEC. Its bus interface supports dynamic 8/16/32-bit sizing and operates at up to 66 MHz (configured for 50 MHz in this variant).

It integrates a system integration unit (SIU) with clock synthesizer, real-time clock (RTC), watchdog timer, and IEEE 1149.1 JTAG debug interface; the CPM includes 8 KB dual-port RAM, 16 SDMA channels, and four baud-rate generators - enabling concurrent HDLC, UART, IrDA, and transparent serial protocols across four SCCs and two SMCs.

Key Specifications

Pinout & Package

Package: 357-ball Plastic Ball Grid Array (PBGA), ZQ/VR designation (Case No. 5058), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm profile. Thermal pad on underside requires solder connection to ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC860P, the MPC860SRVR50D4 provides extended-temperature operation and optimized 50 MHz timing margins for telecom infrastructure, while retaining full CPM offload capability - making it the preferred choice for carrier-grade DSLAM and BTS line cards where reliability under thermal stress is critical.

Availability

MPC860SRVR50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, wireless base station controllers, and secure remote terminal units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC860SRVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity, automotive, industrial, and IoT solutions.

The MPC860 family belongs to NXP's PowerQUICC™ communications processor line, designed specifically for embedded networking equipment requiring hardware-accelerated protocol processing, deterministic real-time response, and integration of CPU, CPM, and peripheral interfaces on a single die.

FAQ

What is the operating temperature range for the MPC860SRVR50D4?

The MPC860SRVR50D4 is rated for extended industrial operation: ambient temperature range of –40°C to +85°C, with maximum junction temperature of 95°C. This specification is confirmed in Table 2 (Maximum Tolerated Ratings) and applies to the ZQ/VR PBGA package variant. The device maintains full functionality across this range when thermal design follows Freescale's layout guidelines, including ground-plane-connected thermal pad and proper decoupling.

Does the MPC860SRVR50D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860SRVR50D4 supports full IEEE 802.3u-compliant 10/100 Mbps Ethernet on SCC1–SCC4, as explicitly stated in Section 2 (Features) and Table 1 (MPC860 Family Functionality). This is a hardware-implemented MAC layer - not software-emulated - and operates without conflict when ATM is disabled. The MPC860SRVR50D4 variant inherits this capability from the MPC860SR family baseline.

What package type and pin count does the MPC860SRVR50D4 use?

The MPC860SRVR50D4 uses a 357-ball Plastic Ball Grid Array (PBGA) package with ZQ/VR designation (Case No. 5058), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height. This is documented in Table 3 (Package Description) and confirmed by mechanical drawings in Section 14 of the hardware specifications. The "VR" suffix in the part number directly maps to this ZQ/VR package variant.

Can the MPC860SRVR50D4 operate with a 50 MHz external crystal?

Yes, the MPC860SRVR50D4 is configured for 50 MHz operation, as indicated by the "R50" in its part number. It accepts either a 50 MHz crystal on EXTAL or a 50 MHz buffered clock on EXTCLK. The DC electrical specs (Table 6) and bus timing tables (Table 7) validate operation at 50 MHz, with VDDH/VDDL requirements tightened to 3.135–3.465 V and phase jitter specified at ±0.6 ns for CLKOUT.

What is the function of the Communications Processor Module (CPM) in the MPC860SRVR50D4?

The CPM in the MPC860SRVR50D4 is a dedicated RISC co-processor that offloads serial protocol processing from the main CPU. It handles HDLC/SDLC framing, UART transmission, ATM cell assembly/disassembly, and Ethernet MAC functions - executing these in parallel with CPU tasks using its own 8 KB dual-port RAM and 16 SDMA channels. This architecture reduces CPU utilization by up to 80% in high-throughput telecom applications.