NXP Semiconductors MPC860SRZQ66D4

Overview

MPC860SRZQ66D4 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a dedicated RISC communications processor module (CPM). It features 4 KB instruction/4 KB data cache, 4-channel SCC supporting HDLC/UART/Ethernet, integrated 10/100 Mbps Ethernet MAC, UTOPIA ATM interface, I²C, SPI, and PCMCIA host controller - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways.

For engineers reviewing the MPC860SRZQ66D4 datasheet, MPC860SRZQ66D4 pinout, MPC860SRZQ66D4 application, or MPC860SRZQ66D4 equivalent, key selection criteria include its 66 MHz CPU frequency, 357-pin PBGA package (ZQ), IEEE 802.3u-compliant Ethernet MAC, UTOPIA Level 1 ATM support, and dual-voltage 3.3 V core / 5 V-tolerant I/O operation.

Technical Context

The MPC860SRZQ66D4 implements a split-architecture design: a 32-bit Power Architecture CPU core with MMU, instruction/data caches, and memory management unit handles general-purpose tasks and OS execution, while the independent CPM offloads serial communications, HDLC framing, Ethernet packet processing, and ATM cell handling - enabling deterministic real-time protocol processing without CPU intervention.

Its memory controller supports eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states (up to 15 per bank), and glueless interfacing to DRAM, SRAM, Flash, and EPROM; the system integration unit provides PIT, RTC, watchdog, JTAG debug, and clock synthesis with PLL-based frequency multiplication for stable 66 MHz operation.

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ designation, 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm package height per Freescale case number 5058 (1103D-02).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC855T, the MPC860SRZQ66D4 delivers unique value through its integrated RTC, full four-SCC support with UTOPIA ATM, and PCMCIA host capability - making it irreplaceable in carrier-grade access equipment requiring time-stamped OAM, multi-protocol convergence, and field-upgradable interfaces.

Availability

MPC860SRZQ66D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, enterprise router control planes, and secure remote access appliances requiring stable component supply across extended product lifecycles.

Supply support for MPC860SRZQ66D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, with deep expertise in Power Architecture™ microcontrollers and communications processors.

The MPC860 family was designed specifically for carrier-class and enterprise networking equipment requiring integrated Ethernet, ATM, HDLC, and serial protocol processing - targeting DSLAMs, routers, and protocol gateways where real-time determinism and hardware-accelerated communications offload are critical.

FAQ

What is the maximum operating frequency of the MPC860SRZQ66D4, and how is it achieved?

The MPC860SRZQ66D4 is rated for a maximum CPU frequency of 66 MHz. This is achieved using an internal PLL that multiplies a lower-frequency external clock (e.g., 33 MHz crystal on EXTAL) by a factor of 2. Operation at 66 MHz requires the 2:1 bus mode (33 MHz bus clock), validated under 3.135–3.465 V supply conditions per DC specifications. The MPC860SRZQ66D4 datasheet specifies timing parameters (e.g., B1, B2, B3) explicitly for this 66 MHz condition.

Does the MPC860SRZQ66D4 support IEEE 802.3u 100 Mbps Ethernet, and what are the interface constraints?

Yes, the MPC860SRZQ66D4 supports IEEE 802.3u-compliant 10/100 Mbps Ethernet via its SCC1–SCC4 controllers. However, this capability is mutually exclusive with UTOPIA ATM operation - when the UTOPIA interface is enabled, Ethernet functionality on those same SCCs is disabled. The MPC860SRZQ66D4 implements the MAC layer only; external PHY devices are required for physical layer signaling.

What package type and thermal characteristics apply to the MPC860SRZQ66D4?

The MPC860SRZQ66D4 uses a 357-ball PBGA package with ZQ designation (case number 5058), measuring 25 mm × 25 mm with 1.27 mm pitch. Its thermal resistance is characterized as RθJB = 13 °C/W on a four-layer board (2s2p), meaning junction temperature rises 13°C per watt above board temperature. This makes board-level thermal design - including ground plane connectivity and airflow - critical for sustained 66 MHz operation.

How does the CPM (Communications Processor Module) in the MPC860SRZQ66D4 differ from the main CPU core?

The CPM is a separate RISC processor tightly coupled to serial peripherals (SCCs, SMCs, SPI, I²C), executing communications-specific firmware independently of the main Power Architecture CPU. While the CPU handles OS, applications, and memory management, the CPM manages HDLC framing, Ethernet MAC functions, ATM cell processing, and serial DMA - enabling deterministic, low-latency protocol handling without CPU intervention. The MPC860SRZQ66D4 leverages this dual-core architecture for true hardware offload.

What are the power supply requirements for the MPC860SRZQ66D4, and why are separate VDDH/VDDL rails used?

The MPC860SRZQ66D4 requires two 3.3 V supplies: VDDL (core logic, 3.135–3.465 V at >40 MHz) and VDDH (I/O buffers, 3.0–3.6 V, 5 V tolerant). Separation isolates noise-sensitive core logic from switching I/O transients. VDDH must remain within 2.5 V of VDDL at all times - exceeding this delta risks latch-up. Each rail requires ≥4 × 0.1 µF ceramic bypass capacitors placed near package corners per Freescale layout guidelines.