NXP Semiconductors MPC860TVR50D4

Overview

MPC860TVR50D4 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM) in a single PBGA357 package. It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, IEEE 802.3u-compliant 10/100 Mbps Ethernet support via SCCs, and UTOPIA-level ATM cell processing up to 70 Mbps - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways.

For engineers reviewing the MPC860TVR50D4 datasheet, MPC860TVR50D4 pinout, MPC860TVR50D4 application, or MPC860TVR50D4 equivalent, key selection criteria include its dual-bus architecture (CPU + CPM), 32-bit DRAM/SRAM/Flash memory controller with eight banks, four serial communications controllers (SCCs), two serial management channels (SMCs), I²C and SPI interfaces, and real-time clock integration - all operating at 3.3 V with 5-V-tolerant I/O.

Technical Context

The MPC860TVR50D4 implements a split-processor architecture: a 32-bit Power Architecture™ CPU core with MMU, instruction/data caches, and branch prediction handles general-purpose tasks and OS execution, while the dedicated CPM offloads time-critical communication protocols including HDLC, UART, IrDA, BISYNC, and ATM AAL0/AAL5. The CPM features 8 KB dual-port RAM and 16 SDMA channels for autonomous frame handling.

Its memory subsystem supports dynamic bus sizing (8/16/32-bit), 32 address lines, up to 15 wait states per bank, and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA sockets. Clock synthesis includes PLL-based frequency multiplication, enabling 50 MHz core operation from lower-frequency crystals, with IEEE 1149.1 JTAG debug support and multiple low-power modes (Doze, Sleep, Deep Sleep).

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ/VR designation per Freescale case number 5058 (1103D-02), 25 mm × 25 mm body, 1.27 mm ball pitch, 1.2 mm height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T, MPC860TVR50D4 offers superior thermal resistance (RθJB = 13°C/W vs. 14°C/W) in 4-layer boards, while MPC860DP provides double instruction cache for complex routing stacks - making MPC860TVR50D4 the balanced choice for thermally demanding, cost-optimized telecom edge applications.

Availability

MPC860TVR50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, enterprise router control planes, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC860TVR50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a pioneer in embedded communications processors, delivering high-integration SoCs for networking, automotive, and industrial markets.

The MPC860TVR50D4 belongs to the PowerQUICC™ family - designed specifically for cost-sensitive, real-time communications infrastructure requiring hardware-accelerated protocol offload alongside general-purpose processing.

FAQ

What is the maximum operating frequency of the MPC860TVR50D4?

The MPC860TVR50D4 is rated for a maximum system clock frequency of 50 MHz, as confirmed by Freescale's Hardware Specifications Rev. 10 (2015). This speed grade is validated across commercial and extended temperature ranges, with DC characteristics specified for 3.135–3.465 V supply at >40 MHz operation. The device achieves this using an internal PLL that multiplies a lower-frequency crystal input, and it supports both 1:1 (CPU = bus) and 2:1 (CPU = 2× bus) configurations - though MPC860TVR50D4 is configured for 50 MHz fixed operation.

Does the MPC860TVR50D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860TVR50D4 supports full IEEE 802.3u 10/100 Mbps Ethernet via its Serial Communications Controllers (SCCs), as documented in Section 2 ("Features") and Table 1 of the Freescale MPC860 Hardware Specifications. SCC1–SCC4 can be individually configured for Ethernet MAC functionality, including MII signaling, CRC generation/checking, and full-duplex operation - with hardware acceleration eliminating CPU overhead for frame assembly/disassembly. This capability is active in MPC860TVR50D4 and does not require special programming beyond standard CPM initialization.

What package type and pin count does the MPC860TVR50D4 use?

The MPC860TVR50D4 uses a 357-ball plastic ball grid array (PBGA) package with ZQ/VR designation (Freescale case number 5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height. This matches the "VR" suffix in the part number and is distinct from the ZP (0.9 mm height) variant. The package supports standard reflow profiles and is compatible with automated SMT assembly lines used in telecom equipment manufacturing.

Can the MPC860TVR50D4 operate with a 3.3 V supply only?

Yes, the MPC860TVR50D4 operates from a single 3.3 V supply for VDDH, VDDL, and VDDSYN, with tight regulation required: 3.135–3.465 V for >40 MHz operation per Table 6 of the Hardware Specifications. Its I/O pins are 5-V-tolerant (VIH up to 5.5 V), allowing direct connection to legacy 5-V peripherals without level shifters - except EXTAL and EXTCLK, which require VIHC = 0.7×VDDH to VDDH+0.3 V. KAPWR in power-down mode accepts 2.0–3.6 V, enabling flexible backup power schemes.

Is the MPC860TVR50D4 pin-compatible with other MPC860 variants like MPC860T or MPC860DP?

Yes, the MPC860TVR50D4 is pin-compatible with MPC860T (ZP package) and MPC860DP (ZQ/VR package), sharing identical 357-ball PBGA footprint, signal assignment, and power/ground pin mapping per Freescale's Mechanical Data and Ordering Information (Section 14). Differences are limited to package height (VR = 1.2 mm, ZP = 0.9 mm) and cache size (MPC860DP has 16 KB instruction cache vs. 4 KB in MPC860TVR50D4), with no changes to pin function or electrical behavior - enabling drop-in replacement in most board designs.