NXP Semiconductors MPC860TZQ50D4

Overview

MPC860TZQ50D4 from NXP (formerly Freescale) is a Power Architecture™-based integrated communications controller (PowerQUICC™) combining a 32-bit RISC CPU core, Communications Processor Module (CPM), dual Ethernet MACs, ATM UTOPIA interface, and system integration peripherals in a single PBGA357 package. It operates at 50 MHz, supports 32-bit/66-MHz local bus, integrates 4-KB instruction and 4-KB data caches, and targets embedded networking control applications including DSLAMs, enterprise routers, and industrial gateways.

For engineers reviewing the MPC860TZQ50D4 datasheet, MPC860TZQ50D4 pinout, MPC860TZQ50D4 application, or MPC860TZQ50D4 equivalent, key selection criteria include its 50-MHz CPU frequency, IEEE 802.3u-compliant 10/100 Mbps Ethernet support on SCC1–SCC4, UTOPIA Level 1 ATM interface, CPM-based offload capability for HDLC/PPP/UART protocols, and 3.3-V operation with 5-V-tolerant I/O.

Technical Context

The MPC860TZQ50D4 implements a dual-core architecture: a Power Architecture™ CPU core with MMU, 32-bit address/data bus, and configurable cache; plus a dedicated RISC-based Communications Processor Module (CPM) handling serial protocols independently. Its memory controller supports eight banks with programmable wait states, DRAM/SRAM/Flash glueless interfacing, and boot-selectable 8/16/32-bit width.

It integrates four Serial Communication Controllers (SCCs) supporting HDLC, UART, IrDA, BISYNC, and Ethernet MAC (IEEE 802.3u); two Serial Management Channels (SMCs); one SPI; one I²C port; Time-Slot Assigner (TSA); PCMCIA socket controller; and real-time clock. The CPM executes protocol-specific microcode, enabling hardware-accelerated frame processing without CPU intervention.

Key Specifications

Pinout & Package

Package: 357-ball Plastic Ball Grid Array (PBGA), 25 mm × 25 mm, 1.27 mm pitch, ZQ package code per Freescale case number 5058 (1103D-02). Thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860PZP50D4, the MPC860TZQ50D4 offers identical functionality but improved thermal performance under board-constrained conditions due to its thicker mold compound and optimized thermal ball layout; versus MPC855TZQ50D4, it delivers four times the serial interface density and full Ethernet/ATM protocol acceleration essential for carrier-grade edge devices.

Availability

MPC860TZQ50D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, enterprise branch routers, and secure RTUs requiring stable component supply across extended product lifecycles.

Supply support for MPC860TZQ50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with heritage from Freescale's PowerQUICC innovation.

The MPC860TZQ50D4 belongs to the PowerQUICC family - designed specifically for embedded communications infrastructure requiring hardware-accelerated protocol processing, deterministic real-time response, and long-term industrial availability.

FAQ

What is the maximum operating frequency of the MPC860TZQ50D4?

The MPC860TZQ50D4 is rated for a maximum CPU frequency of 50 MHz, as indicated by the "50" in its part number suffix. This frequency is validated under specified voltage (3.135–3.465 V) and thermal (Tj ≤ 95°C) conditions. Operation above 50 MHz is not supported - the D.4 die revision does not guarantee stability or timing compliance beyond this rating, and bus timing parameters in the hardware specification are defined only up to 50 MHz for this variant. The MPC860TZQ50D4 must be configured with appropriate PLL settings to achieve exactly 50 MHz core clock.

Does the MPC860TZQ50D4 support IEEE 802.3u 100-Mbps Ethernet?

Yes, the MPC860TZQ50D4 supports IEEE 802.3u 100-Mbps Ethernet via its four Serial Communication Controllers (SCCs), which implement full-duplex MAC functionality with MII interface capability. This is confirmed in Section 2 ("Features") of the Freescale MPC860 Hardware Specifications (Rev. 10), which states "10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u® Standard". The SCCs handle frame transmission, reception, CRC generation/checking, and collision detection autonomously, offloading these tasks from the main CPU core.

What package type and pin count does the MPC860TZQ50D4 use?

The MPC860TZQ50D4 uses a 357-ball Plastic Ball Grid Array (PBGA) package with ZQ designation (Freescale case number 5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch. This is explicitly documented in Table 3 ("Package Description") of the MPC860 Hardware Specifications, where ZQ/VR maps to "PBGA 357 25*25*1.2P1.27". The ZQ package features a 1.15-mm mold compound thickness and is optimized for thermal performance in board-mounted applications compared to the thinner ZP variant.

Can the MPC860TZQ50D4 operate with 5-V-tolerant I/O while powered at 3.3 V?

Yes, the MPC860TZQ50D4 supports 5-V-tolerant inputs on all pins except EXTAL and EXTCLK, provided VDDH is within specification (3.135–3.465 V for >40 MHz operation). Per Table 6 ("DC Electrical Specifications"), VIH(max) is 5.5 V, and the caution note specifies that 5-V inputs must not exceed VDDH + 2.5 V - satisfied when VDDH = 3.3 V. However, outputs are 3.3-V CMOS levels; interfacing with 5-V logic requires level-shifting circuitry on driven signals, as VOL and VOH are defined only for 3.3-V operation.

What is the function of the Communications Processor Module (CPM) in the MPC860TZQ50D4?

The Communications Processor Module (CPM) in the MPC860TZQ50D4 is a dedicated RISC-based co-processor that handles serial communication protocols independently of the main CPU core. It executes microcode for HDLC, PPP, UART, IrDA, and BISYNC, manages 16 SDMA channels, and controls four SCCs and two SMCs. This offloads bit-level framing, CRC calculation, and buffer management from the CPU - enabling deterministic real-time response and freeing the Power Architecture™ core for application-layer tasks like routing or encryption, as detailed in Section 2 ("Features") and Table 1 of the hardware specification.