NXP Semiconductors MPC860TZQ80D4

Overview

MPC860TZQ80D4 from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM). It operates at 80 MHz, integrates 16 KB instruction and 8 KB data caches, supports 10/100 Mbps Ethernet via SCCs, and includes UTOPIA-level ATM interface, I²C, SPI, dual SMCs, four SCCs, and PCMCIA socket controller - deployed in telecom access equipment, industrial gateways, and legacy network edge routers.

For engineers reviewing the MPC860TZQ80D4 datasheet, MPC860TZQ80D4 pinout, MPC860TZQ80D4 application, or MPC860TZQ80D4 equivalent, key selection considerations include its 357-pin PBGA ZQ package, 3.3 V core/I/O operation with 5 V-tolerant inputs (except EXTAL/EXTCLK), IEEE 802.3u-compliant Ethernet support, ATM UNI 4.0 compliance, and CPM-assisted offloading of serial protocol processing (HDLC, UART, IrDA, BISYNC) to reduce host CPU load.

Technical Context

The MPC860TZQ80D4 implements a dual-processor architecture: a 32-bit Power Architecture CPU core with MMU, instruction/data caches, and branch prediction; and a separate RISC CPM handling serial, timer, and I/O tasks independently. Its memory controller supports eight banks with dynamic bus sizing (8/16/32-bit), programmable wait states, and glueless interfacing to DRAM, SRAM, Flash, and EPROM.

It features four SCCs configurable for Ethernet (IEEE 802.3/802.3u), HDLC/SDLC (up to 2 Mbps), UART, IrDA, or transparent bit-stream modes; two SMCs supporting UART/GCI/TDM; one SPI master/slave interface; one I²C master/slave port; and a TSA enabling time-slot routing across serial channels for T1/E1/PCM/ISDN applications.

Key Specifications

Pinout & Package

Package: 357-ball Plastic Ball Grid Array (PBGA), ZQ designation (case 5058, 25 mm × 25 mm × 1.2 mm, 1.27 mm ball pitch), RoHS-compliant, thermal pad on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860PZP80D4, the MPC860TZQ80D4 offers marginally better board-level thermal conduction (RθJB = 13°C/W) due to thicker mold compound, making it more robust under sustained 80 MHz operation on 4-layer boards; versus MPC855TZQ80D4, it delivers full quad-SCC Ethernet routing, ATM cell processing, and PCMCIA host capability - essential for carrier-grade access equipment.

Availability

MPC860TZQ80D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, legacy enterprise routers, and secure RTUs requiring stable component supply across extended product lifecycles.

Supply support for MPC860TZQ80D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity, automotive, industrial, and IoT solutions.

The MPC860TZQ80D4 belongs to the PowerQUICC™ family - designed specifically for embedded communications infrastructure requiring integrated CPU, protocol offload, and real-time I/O in a single SoC for telecom, networking, and industrial control.

FAQ

What is the maximum operating frequency of the MPC860TZQ80D4 and how is bus timing configured?

The MPC860TZQ80D4 operates at a maximum CPU frequency of 80 MHz. To achieve this, it must be configured in 2:1 mode where the CPU runs at twice the bus clock frequency - resulting in a 40 MHz bus clock. This configuration is mandatory per the hardware specification; attempting 80 MHz bus operation violates timing limits and is unsupported.

Does the MPC860TZQ80D4 support IEEE 802.3u 100 Mbps Ethernet, and which pins implement the MII interface?

Yes, the MPC860TZQ80D4 supports IEEE 802.3u 100 Mbps Ethernet via its SCCs when configured in MII mode. The MII interface uses dedicated pins including MII_MDC, MII_MDIO, MII_TXD[0:3], MII_TX_ER, MII_EN, MII_RX_DV, MII_RXD[0:3], and MII_RX_CLK - all mapped to specific PA/PB/PC port pins as defined in the MPC860TZQ80D4 signal list.

What power supply requirements apply to the MPC860TZQ80D4 at 80 MHz operation?

At 80 MHz operation, the MPC860TZQ80D4 requires VDDH and VDDL supplies within 3.135 V to 3.465 V. KAPWR must be maintained between VDDH – 0.4 V and VDDH. All I/O pins (except EXTAL and EXTCLK) tolerate up to 5.5 V, but input voltage must not exceed VDDH + 2.5 V during power-up or normal operation.

How does the CPM in the MPC860TZQ80D4 reduce host CPU load for serial communications?

The CPM in the MPC860TZQ80D4 executes serial protocol handling autonomously - including HDLC CRC generation/checking, bit-stuffing, frame synchronization, and PPP state machine management - using its own RISC processor and 8 KB dual-port RAM. This allows the main CPU to remain idle during serial transfers, reducing average CPU utilization by up to 70% in high-throughput HDLC applications.

Is the MPC860TZQ80D4 pin-compatible with other MPC860 family members such as the MPC860PZP80D4?

Yes, the MPC860TZQ80D4 is pin-compatible with the MPC860PZP80D4 - both use the identical 357-ball PBGA footprint and signal mapping. The only difference is package variant (ZQ vs. ZP), affecting mold compound thickness and thermal resistance, not pin assignment or electrical interface. No PCB redesign is required when substituting between these two.