NXP Semiconductors MPC862PCZQ66B

Overview

MPC862PCZQ66B from NXP (formerly Freescale) is a PowerQUICC™ II family integrated communications processor combining a 32-bit MPC8xx PowerPC core, Communications Processor Module (CPM), and System Integration Unit (SIU) in a single 357-pin PBGA package. It operates at 66 MHz, delivers 16 KB instruction and 8 KB data cache, supports up to four Fast Ethernet MII/UTOPIA interfaces, and integrates FEC, four SCCs, two SMCs, SPI, I²C, and PCMCIA. It targets ATM edge routers and carrier-grade DSLAM control planes.

For engineers reviewing the MPC862PCZQ66B datasheet, MPC862PCZQ66B pinout, MPC862PCZQ66B application, or MPC862PCZQ66B equivalent, key selection criteria include its 66 MHz CPU/bus speed, dual-port CPM RAM size, UTOPIA Level 2 + MII coexistence, enhanced SAR (ESAR) mode for OAM/PM, and support for up to four PHYs - all confirmed for the MPC862P variant per Freescale MPC862EC Rev. 3.

Technical Context

The MPC862PCZQ66B implements a single-issue 32-bit PowerPC core with 32 GPRs, branch prediction, and physically addressed caches (16 KB instruction, 8 KB data, four-way set-associative). Its CPM executes communication-specific RISC instructions independently of the main core, managing serial channels via 16 SDMA channels and 8 KB dual-port RAM.

It features simultaneous MII (10/100Base-T) and UTOPIA Level 2 operation on a multiplexed bus, ESAR-mode ATM enhancements including ATM port-to-port switching without microcode, and full-duplex UTOPIA master/slave capability using a split bus - all explicitly specified for the MPC862P in Table 1 and Section 2 of MPC862EC Rev. 3.

Key Specifications

Pinout & Package

Package: 357-pin PBGA (plastic ball grid array), 27 mm × 27 mm body, 1.27 mm pitch, exposed thermal pad - confirmed in Section 14 "Mechanical Data and Ordering Information" of MPC862EC Rev. 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC862PCZQ66B, MPC862PZQ66B offers identical functionality and compatibility, while MPC862PZQ80B provides higher clock performance at the cost of stricter thermal design and non-drop-in timing constraints - making the former ideal for direct replacement and the latter suitable only for new high-throughput designs.

Availability

MPC862PCZQ66B is available at Aetrix Electronics and suitable for DSLAM control plane, ATM edge routing, industrial protocol gateway, and legacy telecom node applications requiring stable component supply across extended product lifecycles.

Supply support for MPC862PCZQ66B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, with deep heritage in Power Architecture® and communications processors.

The MPC862PCZQ66B belongs to the PowerQUICC™ II family, designed specifically for carrier-grade and enterprise networking equipment requiring integrated protocol acceleration, deterministic real-time response, and multi-interface flexibility in space-constrained platforms.

FAQ

What is the maximum operating frequency of the MPC862PCZQ66B?

The MPC862PCZQ66B is rated for 66 MHz operation in 1:1 CPU-to-bus mode, as confirmed in Table 4 (Power Dissipation) and Section 9 (Bus Signal Timing) of the MPC862EC Rev. 3 datasheet. While the MPC862P family supports up to 100 MHz in 2:1 mode, the MPC862PCZQ66B suffix explicitly denotes the 66 MHz speed grade and must be configured accordingly - exceeding this violates guaranteed timing margins.

Does the MPC862PCZQ66B support simultaneous MII and UTOPIA interfaces?

Yes, the MPC862PCZQ66B supports simultaneous MII (10/100Base-T) and UTOPIA Level 2 operation on a multiplexed bus, as stated in Section 2 "Features" and validated in Figure 1 block diagram of the MPC862EC Rev. 3 datasheet. This capability is exclusive to the MPC862P variant and enables dual-physical-layer ATM termination without external glue logic.

How much on-chip memory does the MPC862PCZQ66B include?

The MPC862PCZQ66B integrates 16 KB of four-way set-associative instruction cache and 8 KB of two-way set-associative data cache, plus 8 KB of dual-port RAM within the CPM - all confirmed in Table 1 and Section 2 of MPC862EC Rev. 3. These memory resources are fixed and not user-configurable; no additional on-die SRAM or ROM is present beyond these blocks.

What package type and pin count does the MPC862PCZQ66B use?

The MPC862PCZQ66B uses a 357-pin plastic ball grid array (PBGA) package with 27 mm × 27 mm body size and 1.27 mm pitch, as documented in Section 14 "Mechanical Data and Ordering Information" of the MPC862EC Rev. 3 datasheet. The exposed thermal pad version is standard, and footprint dimensions match JEDEC MO-205AC specifications.

Is the MPC862PCZQ66B pin-compatible with other MPC862 family members?

The MPC862PCZQ66B shares the same 357-pin PBGA package and pinout with MPC862PZQ66B and MPC862PZQ80B, as verified in Freescale's mechanical drawings and ordering information tables. However, it is not compatible with MPC862T or MPC857 variants due to differences in peripheral count (e.g., fewer SCCs/SMCs) and internal signal mapping - only MPC862P-series devices maintain full pin and function equivalence.