NXP Semiconductors MPC862TCVR80B

Overview

MPC862TCVR80B from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ family integrated communications processor combining a 32-bit MPC8xx PowerPC core, System Integration Unit (SIU), and Communications Processor Module (CPM). It operates at 80 MHz, features 4-Kbyte instruction and 4-Kbyte data caches, supports up to four serial communication controllers (SCCs), and integrates a Fast Ethernet Controller (FEC) with MII and UTOPIA interfaces for ATM/DSL edge routing applications.

For engineers reviewing the MPC862TCVR80B datasheet, MPC862TCVR80B pinout, MPC862TCVR80B application, or MPC862TCVR80B equivalent, this page delivers verified technical context, cache configuration, bus timing constraints, thermal resistance values, and validated alternative parts for embedded telecom controller design.

Technical Context

The MPC862TCVR80B implements a single-issue 32-bit PowerPC architecture core with MMU support (32-entry ITLB/DTLB), branch prediction, and physically addressed caches. Its CPM includes a RISC controller, 8-Kbyte dual-port RAM, and 16 serial DMA channels for offloading protocol processing from the main CPU.

It supports simultaneous MII (10/100Base-T) and UTOPIA Level 2 operation via multiplexed bus, enhanced SAR (ESAR) mode for ATM OAM/PM, and full-duplex UTOPIA master/slave operation using split-bus architecture - all while maintaining IEEE 1149.1 JTAG debug compliance and 3.3 V core operation with 5-V TTL-compatible I/O.

Key Specifications

Pinout & Package

357-pin plastic ball grid array (PBGA) package with 25 × 25 mm footprint, 1.27 mm pitch, and exposed thermal pad. Pin mapping follows Freescale MPC862T-specific ballout per MPC862EC Rev. 3, Section 14.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC862TCVR80B, MPC862PZQ80B offers greater cache capacity and TSA flexibility at higher cost and power, while MPC857TFCR80B sacrifices SCC count and UTOPIA capability for lower BOM cost and thermal envelope - making each viable only within strictly bounded functional scopes.

Availability

MPC862TCVR80B is available at Aetrix Electronics and suitable for DSLAM line cards, ATM edge routers, industrial protocol gateways, and legacy network bridges requiring stable component supply across extended product lifecycles.

Supply support for MPC862TCVR80B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors develops high-performance mixed-signal processors for networking, automotive, and industrial applications, with heritage from Freescale's PowerQUICC™ portfolio.

The MPC862TCVR80B belongs to the PowerQUICC™ family designed specifically for integrated communications processing in carrier-grade DSL and ATM infrastructure - balancing real-time protocol acceleration with deterministic memory subsystems.

FAQ

What is the maximum operating frequency of the MPC862TCVR80B and how does it affect bus timing?

The MPC862TCVR80B operates at a maximum core frequency of 80 MHz, but must be configured in 2:1 CPU-to-bus mode (40 MHz bus clock) per Section 9 of MPC862EC Rev. 3. Attempting full-speed 80 MHz bus operation violates AC timing specifications - specifically violating minimum CLKOUT pulse width (B2/B3) and setup/hold margins for address/data signals (B7–B12). This constraint directly impacts memory controller configuration and external SDRAM interface design.

Does the MPC862TCVR80B support UTOPIA Level 2 and MII simultaneously, and what design considerations apply?

Yes, the MPC862TCVR80B supports simultaneous MII (10/100Base-T) and UTOPIA Level 2 operation using the UTOPIA multiplexed bus, as confirmed in Section 2 Features and Figure 1 of MPC862EC Rev. 3. Designers must allocate separate 8-bit UTOPIA data buses and isolate MII signal routing from UTOPIA clocks to prevent crosstalk-induced cell misalignment. The integrated FIFO buffering reduces total cell transmission time, but requires precise clock domain crossing synchronization between FEC and CPM modules in MPC862TCVR80B.

What thermal management requirements apply to the MPC862TCVR80B in continuous 80 MHz operation?

At 80 MHz, 2:1 mode, and 3.5 V supply, MPC862TCVR80B exhibits maximum power dissipation of 1.20 W (Table 4). With RθJB = 13 °C/W, junction temperature rise above board temperature is ~15.6 °C. To maintain TJ ≤ 105 °C (standard grade), board temperature must stay below 89.4 °C - requiring either forced air cooling (200 ft/min) or a 4-layer PCB with thermal vias to inner ground planes. Natural convection on single-layer boards exceeds thermal limits.

How many serial communication controllers (SCCs) does the MPC862TCVR80B include, and what protocols do they support?

The MPC862TCVR80B includes four serial communication controllers (SCCs), as specified in Table 1 of MPC862EC Rev. 3. Each SCC supports HDLC/SDLC, asynchronous UART, AppleTalk, IrDA, BISYNC, and bit-transparent modes. SCC4 optionally provides UTOPIA port functionality, and SCC1–SCC4 support IEEE 802.3 Ethernet at 10 Mbps. All SCCs implement serial ATM capability - a key differentiator enabling MPC862TCVR80B to serve as an ATM segmentation/reassembly engine without external ASICs.

Is the MPC862TCVR80B pin-compatible with other members of the MPC862/857T/857DSL family, and what are the layout implications?

No, the MPC862TCVR80B is not universally pin-compatible across the MPC862/857T/857DSL family. While all variants use the same 357-pin PBGA package, ball assignments differ significantly - especially for SCC/SMC signal routing, TSA interface pins, and PCMCIA control lines. MPC862TCVR80B shares pinout with MPC862P and MPC862T (Figure 1), but differs from MPC857T/MPC857DSL (Figure 2) which omit SMC2 and TSA signals. Layout reuse requires verification against MPC862EC Section 14 mechanical drawings and signal integrity simulation for all high-speed buses.