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NXP Semiconductors MPC866TZP100A

Part No.:
MPC866TZP100A
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
357-BBGA
Datasheet:
AetrixMPC866TZP100A.pdf
Description:
IC MPU MPC8XX 100MHZ 357BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,227

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Product details

Overview

MPC866TZP100A from NXP (formerly Freescale) is a PowerQUICC™ I communications processor integrating a 32-bit PowerPC core, CPM-based serial peripherals, and Fast Ethernet controller in a single PBGA package. It delivers 100 MHz CPU operation with 4 KB instruction/4 KB data cache, supports MII/UTOPIA ATM interfaces, and targets embedded telecom edge devices requiring deterministic real-time packet processing.

For engineers reviewing the MPC866TZP100A datasheet, MPC866TZP100A pinout, MPC866TZP100A application, or MPC866TZP100A equivalent, key selection criteria include its 100 MHz core frequency, dual-voltage supply (1.8 V core / 3.3 V I/O), 357-pin PBGA package, IEEE 1149.1 JTAG debug support, and integrated FEC with MII/UTOPIA dual-mode capability.

Technical Context

The MPC866TZP100A implements a single-issue PowerPC core with MMU, 32-entry ITLB/DTLB, and physically addressed caches. Its CPM subsystem executes serial protocol offload via 10 SDMA channels, four SCCs, two SMCs, SPI, I²C, and TSA - all synchronized to the SIU's clock synthesizer and bus arbiter.

It operates in 1:1 bus mode at 100 MHz CPU/50 MHz bus or 2:1 mode at 100 MHz CPU/50 MHz bus, with memory controller supporting up to eight banks, dynamic bus sizing (8/16/32-bit), and glueless interface to SDRAM, SRAM, and flash. Thermal design requires junction-to-board (RθJB = 13°C/W) and junction-to-ambient (RθJA = 23°C/W on 4-layer board) modeling.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Frequency 100 MHz - Enables real-time packet forwarding at OC-3 line rates in telecom edge applications.
Core Voltage 1.7–1.9 V - Requires tightly regulated low-noise 1.8 V supply; violation risks ESD diode conduction and long-term reliability loss.
I/O Voltage 3.135–3.465 V - Supports 3.3 V logic with 5 V tolerance on 32 pins (e.g., PA[0:15], MII_MDIO), enabling direct interfacing to legacy PHYs.
Cache 4 KB instruction + 4 KB data - Two-way set-associative, lockable per 128-bit block; sufficient for compact firmware with minimal external memory access.
Package 357-pin PBGA (27 × 27 mm, 1.27 mm pitch) - Requires 4-layer PCB with dedicated VDD/GND planes and ≤0.5″ capacitor lead length for stable power delivery.
Thermal Resistance RθJB = 13°C/W - Primary thermal path is through soldered BGA balls to PCB; case-to-ambient cooling is secondary.
Power Dissipation 210 mW typical / 250 mW max at 100 MHz - Excludes I/O driver current; total system power depends on external buffer loading and bus activity.

Pinout & Package

357-pin plastic ball grid array (PBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Package conforms to JEDEC MO-205AB standard with thermal pad exposed on underside.

Pin/Terminal Circuit Role Design Meaning
VDDL (Balls A1–A4, B1–B4, etc.) Core power supply Must ramp monotonically from 0 V; must not exceed VDDH during power-up/down to prevent forward-biasing of ESD protection diodes.
VDDH (Balls C1–C4, D1–D4, etc.) I/O power supply Supplies all digital I/O buffers; 5 V tolerant on designated pins only; voltage difference vs. VDDL limited to 100 mV.
VDDSYN (Ball E1) PLL analog supply Low-noise 1.8 V source required; decoupling critical - noise here directly modulates clock jitter and timing margin.
CLKIN / EXTAL (Ball P1) External clock input Accepts crystal (4–50 MHz) or LVCMOS clock; VIHC = 0.7×VDDH min ensures reliable PLL lock under voltage droop.
MII_TXD[0:3], MII_TX_EN, MII_RXD[0:3] (Balls R1–R4, T1–T4, etc.) FEC MII interface Direct connection to 10/100Base-T PHY; supports full-duplex operation; requires controlled-impedance 50 Ω traces ≤6″.
TMS, TCK, TDI, TDO, TRST_B (Balls U1–U5) JTAG test access port IEEE 1149.1 compliant; enables boundary-scan testing, flash programming, and real-time debugging without halting CPU execution.

Key Features

Feature Design Value
Integrated FEC with MII/UTOPIA dual-mode Enables simultaneous 10/100Base-T Ethernet and UTOPIA Level 2 ATM traffic without external bridging logic or RAM-based microcode.
Four Serial Communication Controllers (SCCs) Each supports HDLC, UART, IrDA, or ATM SAR; SCC4 optionally configured as UTOPIA master/slave port for PHY-side cell transport.
Time Slot Assigner (TSA) Routes time-division multiplexed data between SCCs/SMCs and T1/E1/ISDN lines; supports dynamic reconfiguration and independent TX/RX frame sync.
CPM with 10 SDMA channels Offloads serial protocol framing, CRC generation, and bit-stuffing from CPU; reduces interrupt load and improves determinism in real-time systems.
Memory controller with boot CS Eight programmable banks support mixed memory types (SDRAM, flash, SRAM); boot chip-select auto-enables 8/16/32-bit NOR flash at reset for secure firmware recovery.

Applications

DSL Access Multiplexer (DSLAM) Enterprise VoIP Gateway

Use Scenario: Aggregates multiple ADSL lines into ATM backhaul using PVC-based QoS scheduling.

IC Role / Device Role / Timing Role: MPC866TZP100A acts as line-card controller, executing SAR segmentation/reassembly and OAM cell insertion in CPM firmware.

Use Value: Eliminates need for external SAR ASIC; leverages on-chip UTOPIA FIFO buffering to reduce cell transmission latency by up to 35% versus discrete solutions.

Use Scenario: Connects PSTN FXS/FXO ports to SIP trunk via H.323 or SIP stack running on external host.

IC Role / Device Role / Timing Role: MPC866TZP100A handles TDM-to-packet conversion, echo cancellation offload, and MII-linked Ethernet uplink.

Use Value: Integrates TSA, SMC UARTs, and FEC in one die - reduces BOM count by 7 components and PCB area by 32% versus multi-chip alternatives.

Industrial Protocol Gateway Secure Remote Terminal Unit (RTU)

Use Scenario: Bridges Modbus RTU over RS-485 to TCP/IP Ethernet in SCADA field controllers.

IC Role / Device Role / Timing Role: MPC866TZP100A runs lightweight Linux, uses SCC2 for RS-485 HDLC framing, and FEC for deterministic Ethernet response.

Use Value: Achieves sub-10 ms end-to-end latency with hardware-accelerated CRC-16 and configurable 32-byte receive FIFO depth per SCC channel.

Use Scenario: Monitors distributed sensors in oil/gas pipeline monitoring with encrypted telemetry upload.

IC Role / Device Role / Timing Role: MPC866TZP100A executes secure bootloader, validates signed firmware images, and manages watchdog-triggered failover via SIU PIT timer.

Use Value: On-chip MMU enforces memory protection between RTOS kernel and crypto task; eliminates external security co-processor requirement.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC866PZP133 133 MHz CPU, 16 KB instruction / 8 KB data cache, same PBGA package and pinout. Higher throughput for multi-channel ATM aggregation; requires tighter thermal management (RθJA = 23°C/W at 133 MHz → TJ = 100°C at 320 mW). Select when >100 Mbps aggregate throughput is required and board layout supports enhanced heat sinking.
MPC852TVR100B 100 MHz PowerPC core, no FEC, no UTOPIA, 4 KB caches, 240-pin PQFP package. Limited to serial-only protocols (HDLC/UART); lacks MII/UTOPIA PHY interface and TSA - unsuitable for ATM/Ethernet convergence. Choose only for cost-sensitive serial gateway designs where Ethernet connectivity is handled externally.

Compared with MPC866TZP100A, MPC866PZP133 offers higher compute headroom but increases thermal design complexity, while MPC852TVR100B sacrifices integrated networking capability for lower cost and simpler packaging - neither is pin-compatible, and both require PCB redesign.

Availability

MPC866TZP100A is available at Aetrix Electronics and suitable for DSLAM line cards, VoIP gateways, industrial protocol converters, and secure RTUs requiring stable component supply across extended temperature ranges (–40°C to +100°C junction).

Supply support for MPC866TZP100A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors develops high-reliability embedded processors for automotive, industrial, and networking applications, with heritage from Freescale's PowerQUICC family.

The MPC866TZP100A belongs to the PowerQUICC I product line, designed specifically for cost-optimized, low-power communications edge devices requiring integrated ATM/Ethernet processing and deterministic real-time serial protocol handling.

FAQ

What is the maximum operating junction temperature for the MPC866TZP100A?

The MPC866TZP100A has a maximum guaranteed junction temperature (Tj(max)) of 100°C under extended temperature conditions. This rating applies when ambient temperature is –40°C and thermal design meets JEDEC JESD51-6 requirements for a 4-layer board with 200 ft/min airflow. Exceeding 100°C risks permanent parametric shift or functional failure. The MPC866TZP100A datasheet specifies RθJB = 13°C/W as the dominant thermal path, so board-level copper area and via density directly determine achievable power envelope.

Does the MPC866TZP100A support 100 Mbps full-duplex Ethernet operation?

Yes, the MPC866TZP100A supports 100 Mbps full-duplex Ethernet via its integrated Fast Ethernet Controller (FEC) using the MII interface. It complies with IEEE 802.3u and supports auto-negotiation, flow control, and store-and-forward mode. However, it does not implement GMII or RGMII - external PHY must provide MII signaling. The MPC866TZP100A FEC achieves line-rate performance only when paired with a PHY that meets MII timing skew limits (<10 ns) and uses proper PCB layout practices (≤6″ trace length, 50 Ω impedance control).

Can the MPC866TZP100A operate with a 50 MHz external crystal?

Yes, the MPC866TZP100A accepts a 50 MHz external crystal on the EXTAL/EXTCLK pins. The internal PLL multiplies this reference to generate the 100 MHz CPU clock in 2:1 bus mode. Crystal drive level must comply with AC specifications: VIHC ≥ 0.7×VDDH (≥2.2 V) and input capacitance ≤20 pF. Layout requires guard ring around crystal traces and placement within 5 mm of the EXTAL/EXTCLK pins to minimize noise coupling - deviations risk PLL unlock or increased jitter affecting FEC timing margin.

How many serial communication controllers (SCCs) does the MPC866TZP100A include?

The MPC866TZP100A includes four Serial Communication Controllers (SCCs), as confirmed in Table 1 of the MPC866/MPC859 Hardware Specifications. All four SCCs support HDLC, UART, and ATM SAR modes. SCC4 can be configured as a UTOPIA Level 2 interface for direct connection to ATM PHYs. This matches the MPC866T variant designation ('T' = 4 KB cache, 4 SCCs), distinguishing it from MPC859 variants which include only one SCC. No firmware patch or configuration register modifies this hardware count.

Is the MPC866TZP100A pin-compatible with the MPC866PZP133?

Yes, the MPC866TZP100A and MPC866PZP133 share identical 357-pin PBGA mechanical footprint, pin assignment, and power sequencing requirements. Both use the same VDDL/VDDH/VDDSYN rail structure, JTAG interface, and memory controller signal mapping. However, the MPC866PZP133 operates at 133 MHz and features larger 16 KB instruction / 8 KB data caches - software must validate timing margins and cache coherency behavior before substitution. No PCB changes are required, but thermal validation is mandatory due to 25% higher power dissipation.

MPC866TZP100A Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
357-BBGA
Series:
MPC8xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10Mbps (4), 10/100Mbps (1)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
357-PBGA (25x25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

MPC866TZP100A FAQ

1.How can I place an order for MPC866TZP100A through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC866TZP100A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC866TZP100A reliable?

The price and inventory of MPC866TZP100A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC866TZP100A is usually 5 days.

3.What payment methods are accepted for MPC866TZP100A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC866TZP100A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC866TZP100A?

MPC866TZP100A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC866TZP100A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC866TZP100A?

For technical support, including MPC866TZP100A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC866TZP100A requirements.

6.How does Aetrix verify that MPC866TZP100A is sourced from the original manufacturer or authorized distributors?

All MPC866TZP100A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC866TZP100A meets industry standards.

7.What is the process for return or replacement of MPC866TZP100A?

All MPC866TZP100A units undergo pre-shipment inspection (PSI). If there is an issue with MPC866TZP100A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC866TZP100A part is unused and in its original packaging.

Return procedure for MPC866TZP100A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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