NXP Semiconductors MPC866TZP133A
- Part No.:
- MPC866TZP133A
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC866TZP133A.pdf
- Description:
- IC MPU MPC8XX 133MHZ 357BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,857
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC866TZP133A from Freescale Semiconductor is a 32-bit PowerQUICC™ communications processor integrating a PowerPC core, CPM coprocessor, and Fast Ethernet controller in a single PBGA package. It operates at up to 133 MHz CPU frequency with 4-Kbyte instruction and 4-Kbyte data caches, 1.8-V core / 3.3-V I/O supply, and supports MII/UTOPIA interfaces for ATM and Ethernet applications in broadband access equipment.
For engineers reviewing the MPC866TZP133A datasheet, MPC866TZP133A pinout, MPC866TZP133A application, or MPC866TZP133A equivalent, key selection criteria include cache configuration (4K/4K), 357-pin PBGA package, 133-MHz operation in 2:1 bus mode, IEEE 802.3-compliant FEC, and ESAR-enhanced ATM support - all critical for embedded telecom control plane design.
Technical Context
The MPC866TZP133A implements a single-issue 32-bit PowerPC core with MMU, 32-entry ITLB/DTLB, and physically addressed caches. Its CPM subsystem includes 8-Kbyte dual-port RAM, 16 SDMA channels, four SCCs (all supporting serial ATM), and two SMCs - enabling concurrent HDLC, UART, and GCI protocols without microcode.
It integrates a system integration unit (SIU) with clock synthesizer, JTAG debug interface, software watchdog, and memory controller supporting DRAM, SDRAM, SRAM, and flash across eight banks. The FEC supports simultaneous MII (10/100Base-T) and UTOPIA Level 2 operation via multiplexed bus, with optional statistical cell counters and full-duplex master/slave UTOPIA capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Frequency | 133 MHz - enables high-throughput packet processing in telecom edge devices |
| Instruction Cache | 4 Kbytes, two-way set-associative - reduces instruction fetch latency for real-time protocol stacks |
| Data Cache | 4 Kbytes, two-way set-associative - improves data throughput for buffer management and frame handling |
| Core Supply Voltage | 1.7–1.9 V - mandates low-noise 1.8-V regulator with tight sequencing vs. 3.3-V I/O rail |
| I/O Supply Voltage | 3.135–3.465 V - compatible with 3.3-V logic families; PA/PB/PC/PD pins are 5-V tolerant |
| Package | 357-pin PBGA - requires controlled-impedance PCB layout with dedicated power/ground planes |
| Thermal Limit | Junction temperature max 95°C (standard) - dictates heatsink or airflow requirements in sealed enclosures |
Pinout & Package
357-pin plastic ball grid array (PBGA), 27 × 27 mm body, 1.27-mm pitch, RoHS-compliant. Package supports thermal dissipation via bottom-side solder balls connected to internal ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDL | Core power supply | Must ramp no faster than VDDH during power-up; violation risks ESD diode conduction |
| VDDH | I/O power supply | Supplies all digital I/O including MII, UTOPIA, and address/data bus; 5-V tolerant on designated pins |
| VDDSYN | PLL power supply | 1.7–1.9 V rail for clock synthesizer; noise sensitivity requires dedicated decoupling near PLL pins |
| EXTAL | Crystal oscillator input | Accepts fundamental-mode crystal (e.g., 50 MHz); external load capacitors required per oscillator spec |
| CLKOUT | System clock output | Buffered derivative of internal PLL clock; drives external logic with 2.4-V min VOH at –2 mA |
| MII_TXD[0:3] | MII transmit data | 4-bit parallel interface to PHY; timing referenced to MII_TX_CLK with setup/hold constraints per Table 9 |
| UTXCLK/URXCLK | UTOPIA clock inputs | Supports half-duplex UTOPIA Level 2; clock rate derived from internal baud generators or external source |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced SAR (ESAR) mode | Enables OAM performance monitoring and multi-priority APC without RAM-based microcode - reduces boot time and firmware complexity |
| Four Serial Communication Controllers (SCCs) | Each supports HDLC, UART, IrDA, BISYNC, and serial ATM - allows concurrent DSLAM line card, OAM channel, and management port operation |
| Fast Ethernet Controller (FEC) | IEEE 802.3-compliant MII interface with integrated DMA - eliminates external MAC and reduces BOM count in CPE gateways |
| Time Slot Assigner (TSA) | Configurable T1/E1/PCM routing with 1- or 8-bit resolution - enables flexible TDM voice/data multiplexing in access concentrators |
| CPM with 8-Kbyte dual-port RAM | Dedicated RISC coprocessor offloads protocol processing from main CPU - preserves PowerPC cycles for application-layer tasks |
Applications
| DSLAM Line Card Control | ATM Edge Router |
|---|---|
Use Scenario: Managing multiple ADSL lines with per-line QoS, OAM, and traffic shaping in carrier-class DSLAMs. IC Role / Device Role / Timing Role: Main control processor executing ATM adaptation layer (AAL2/VBR) and SAR firmware in ROM, coordinating SCCs for line framing and FEC for backhaul Ethernet. Use Value: Integrated ESAR eliminates need for external SAR ASIC, reducing latency and board space while supporting standardized OAM cell insertion. | Use Scenario: Aggregating ATM PVCs into Ethernet WAN uplinks in metro edge routers. IC Role / Device Role / Timing Role: Protocol gateway bridging UTOPIA Level 2 (ATM side) and MII (Ethernet side) with hardware-accelerated cell-to-frame conversion. Use Value: Simultaneous MII/UTOPIA operation enables wire-speed 100 Mbps Ethernet-to-ATM translation without external FIFOs or glue logic. |
| VoIP Access Gateway | Industrial Protocol Converter |
Use Scenario: Converting T1/E1 voice channels to SIP/RTP over Ethernet in enterprise VoIP gateways. IC Role / Device Role / Timing Role: TSA routes TDM time slots to SMCs for CAS signaling and SCCs for HDLC framing, while FEC handles SIP packet transport. Use Value: On-chip TSA and dual SMCs eliminate external TDM switch and UART bridge ICs, simplifying timing synchronization and reducing jitter. | Use Scenario: Translating legacy fieldbus protocols (e.g., HDLC-based SCADA links) to modern Ethernet/IP in industrial control cabinets. IC Role / Device Role / Timing Role: SCC1 handles HDLC master polling of RTUs, SCC2 manages PPP over serial, and FEC delivers packets to HMI via 10/100 Ethernet. Use Value: Hardware CRC generation and transparent bit-stream mode ensure deterministic frame handling for time-critical automation messaging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC866PZP133D | 16-Kbyte instruction cache, 8-Kbyte data cache, same 133-MHz speed and PBGA package | Better suited for complex protocol stacks requiring larger code footprint (e.g., full TCP/IP + TLS) | Select when cache miss rate dominates performance over raw clock speed |
| MPC852TVR133D | Same 4-Kbyte caches and 133-MHz rating but lacks SCC4, TSA, and PCMCIA interface; smaller 256-pin PQFP package | Targeted at cost-sensitive, lower-port-count applications like single-line DSL modems | Choose when footprint and BOM cost outweigh need for multi-channel TDM or PCMCIA expansion |
Compared with MPC866TZP133A, the MPC866PZP133D offers higher code density at identical speed but larger die area, while the MPC852TVR133D trades peripheral richness for compactness and lower system cost - making each optimal for distinct tiers of broadband access hardware.
Availability
MPC866TZP133A is available at Aetrix Electronics and suitable for DSLAM line cards, ATM edge routers, VoIP access gateways, and industrial protocol converters requiring stable component supply across extended product lifecycles.
Supply support for MPC866TZP133A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC866TZP133A belongs to the PowerQUICC™ family - designed specifically for integrated communications processing in broadband access infrastructure, combining PowerPC compute with CPM offload and telecom-grade peripherals.
FAQ
What is the maximum operating frequency of the MPC866TZP133A and how is bus timing configured?
The MPC866TZP133A operates at a maximum CPU frequency of 133 MHz. In this configuration, it must be run in 2:1 bus mode (66.5 MHz bus clock), as specified in Table 7 and Table 8 of the hardware specifications. Bus timing parameters - including setup/hold times and pulse widths - are defined in Table 9 for 33, 40, 50, and 66 MHz operation, with load conditions of 0 pF (min) and 50 pF (max). The MPC866TZP133A's memory controller supports programmable wait states per bank to accommodate varying memory speeds.
Does the MPC866TZP133A support IEEE 1149.1 JTAG debugging, and what debug features are included?
Yes, the MPC866TZP133A includes full IEEE 1149.1 test access port (TAP) support per Section 11 of the hardware specifications. It provides eight hardware comparators (four for instruction address, two for data address, two for data value), conditional breakpoint generation (=, ≠, <, >), and advanced on-chip emulation debug mode. These capabilities enable non-intrusive code inspection, real-time register tracing, and precise fault isolation during development of firmware for the MPC866TZP133A.
How does the MPC866TZP133A handle power supply sequencing, and what happens if violated?
The MPC866TZP133A requires strict sequencing: VDDL (core) must not exceed VDDH (I/O) during power-up or power-down, and both rails must stay within 1.7–1.9 V (VDDL/VDDSYN) and 3.135–3.465 V (VDDH). Violation forward-biases internal ESD protection diodes, causing excessive current flow that degrades long-term reliability. Figure 4 in the hardware specs shows an external diode-based sequencing circuit using MUR420 and 1N5820 diodes to enforce compliance for the MPC866TZP133A.
What peripheral interfaces are supported by the MPC866TZP133A for telecom applications?
The MPC866TZP133A supports MII (10/100Base-T), UTOPIA Level 2 (half/full-duplex), four SCCs with serial ATM capability, two SMCs, SPI, I²C, TSA for T1/E1/PCM routing, and PCMCIA socket interface. Its enhanced SAR (ESAR) mode adds OAM PM, multi-priority APC, and ATM port-to-port switching - all confirmed in Table 1 and Section 2 of the MPC866/MPC859 Hardware Specifications for the MPC866TZP133A.
Is the MPC866TZP133A pin-compatible with other members of the MPC866/859 family, and what are the key package constraints?
Yes, the MPC866TZP133A uses the same 357-pin PBGA package (27 × 27 mm, 1.27-mm pitch) as MPC866P, MPC866T, MPC859P, and MPC859T variants. Mechanical data in Section 15 confirms identical land pattern and thermal ball layout. However, functional pin assignments differ - e.g., MPC859DSL disables SCC2/SMC2 and TSA, while MPC866TZP133A retains all four SCCs and TSA. PCB layout must follow Section 9's four-layer board recommendation with dedicated VDD/GND planes for the MPC866TZP133A.
MPC866TZP133A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 133MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (4), 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC866TZP133A FAQ
1.How can I place an order for MPC866TZP133A through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC866TZP133A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC866TZP133A reliable?
The price and inventory of MPC866TZP133A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC866TZP133A is usually 5 days.
3.What payment methods are accepted for MPC866TZP133A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC866TZP133A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC866TZP133A?
MPC866TZP133A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC866TZP133A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC866TZP133A?
For technical support, including MPC866TZP133A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC866TZP133A requirements.
6.How does Aetrix verify that MPC866TZP133A is sourced from the original manufacturer or authorized distributors?
All MPC866TZP133A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC866TZP133A meets industry standards.
7.What is the process for return or replacement of MPC866TZP133A?
All MPC866TZP133A units undergo pre-shipment inspection (PSI). If there is an issue with MPC866TZP133A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC866TZP133A part is unused and in its original packaging.
Return procedure for MPC866TZP133A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC866TZP133A Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

