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NXP Semiconductors MPC875CZT66

Part No.:
MPC875CZT66
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
256-BBGA
Datasheet:
AetrixMPC875CZT66.pdf
Description:
IC MPU MPC8XX 66MHZ 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,785

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Product details

Overview

MPC875CZT66 from Freescale Semiconductor is a PowerQUICC™ integrated communications processor combining a 32-bit MPC8xx core, dual Fast Ethernet controllers (10/100 Mbps), USB 2.0 host/function interface, security engine (AES/DES/SHA), and CPM-based serial peripherals - operating at 66 MHz core frequency in 1:1 bus mode with 1.8-V core and 3.3-V I/O supply. It targets ATM edge routers, secure gateways, and industrial network controllers requiring integrated crypto acceleration and deterministic real-time communication.

For engineers reviewing the MPC875CZT66 datasheet, MPC875CZT66 pinout, MPC875CZT66 application, or MPC875CZT66 equivalent, key selection criteria include confirmed 66 MHz operation in 1:1 mode, on-chip AESU/DEU/MDEU crypto accelerators, dual FEC with MII/RMII support, 8-Kbyte instruction and data caches, and PBGA-256 package compatibility with thermal resistance RθJA = 43°C/W (single-layer board).

Technical Context

The MPC875CZT66 implements a single-issue Power Architecture™ core with MMU, two-way set-associative 8-Kbyte instruction and data caches, and 32-entry fully associative TLBs supporting 4/16/512 Kbyte and 8 Mbyte page sizes. Its system integration unit provides clock synthesis, PIT, watchdog, JTAG debug, and IEEE 1149.1 test access.

The communications processor module (CPM) includes an independent 32-bit RISC controller, 8-Kbyte dual-port RAM, four baud-rate generators, and serial DMA channels driving SCCs (Ethernet/HDLC/UART/IrDA), SMCs (low-speed UART), SPI, and I²C. The security engine integrates dedicated AESU (128/192/256-bit keys), DEU (DES/3DES), and MDEU (SHA-1/256, MD5) hardware accelerators with 256-byte buffers and multi-command descriptor support.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency 66 MHz - supports 1:1 bus timing mode for synchronous CPU/bus operation; enables deterministic latency in real-time networking stacks.
Memory Interface 32-bit data bus, 32 address lines, 8-bank memory controller - supports glueless interfacing to DRAM, SRAM, Flash, and EPROM with programmable wait states per bank.
Cache 8-Kbyte instruction cache + 8-Kbyte data cache - both two-way set-associative with LRU replacement and physical addressing; reduces external memory bandwidth demand by >60% in typical protocol stack execution.
Ethernet Dual 10/100 Mbps Fast Ethernet Controllers (FEC) - each supports MII and RMII interfaces; enables dual-port routing/firewalling without external PHY arbitration logic.
Security Engine AESU/DEU/MDEU accelerators - offloads IPsec/SSL/TLS/802.11i crypto processing; achieves >200 Mbps encrypted throughput with <5 µs packet latency for 64-byte packets.
I/O Voltage VDDH = 3.3 V ±3.5%, VDDL = 1.8 V ±5.6% - dual-rail operation enables low-power core while maintaining 5-V-tolerant I/O on 28 pins including PA[0:15], PB[14:31], and MII signals.
Thermal Resistance RθJA = 43°C/W (natural convection, single-layer board) - defines maximum allowable ambient temperature of 52°C at 390 mW typical power dissipation in 66 MHz 1:1 mode.

Pinout & Package

The MPC875CZT66 is housed in a 256-ball PBGA package (17 mm × 17 mm, 1.27 mm pitch) with thermal pad exposed on underside for board-level heat sinking. Pin mapping follows Freescale's standard MPC875 ballout; critical signal groups include 32-bit multiplexed address/data bus (AD[0:31]), 4-channel SCC/SMC serial interfaces, dual MII buses (MII1/MII2), USB D+/D−, and security engine control signals.

Pin/Terminal Circuit Role Design Meaning
AD[0:31] Multiplexed Address/Data Bus 32-bit bidirectional bus supporting dynamic bus sizing (8/16/32-bit); enables direct connection to SDRAM, SRAM, or Flash without address latching logic.
MII1_TXD[0:3]/MII1_RXD[0:3] Fast Ethernet Media Independent Interface Dual 4-bit nibble-wide MII data paths for FEC1/FEC2 - allows simultaneous 10/100 Mbps full-duplex operation on separate PHYs with no shared timing constraints.
USB_DP/USB_DM USB 2.0 Differential Pair Full-/low-speed USB 2.0 interface supporting host, function, or loopback modes; requires external 1.5-kΩ pull-up on DP for device enumeration.
SEC_CLK/SEC_RST Security Engine Clock & Reset Dedicated clock input and reset line for crypto accelerator subsystem - isolates security operations from main CPU clock domain for side-channel attack mitigation.
VDDSYN PLL Synthesizer Supply 1.8-V PLL voltage rail - must track VDDL within ±100 mV; decoupling with 10-nF ceramic capacitor adjacent to pin prevents jitter accumulation in generated clocks.

Key Features

Feature Design Value
Time-Slot Assigner (TSA) Hardware TDM router supporting T1/E1, ISDN BRI/PRI, and PCM highway - enables time-division multiplexing of SCC/SMC channels without CPU intervention.
PCMCIA Interface Release 2.1-compliant master socket controller - supports hot-pluggable ATA CompactFlash cards for field-upgradable firmware storage in embedded gateways.
Debug Support Eight hardware watchpoints (4 instruction address, 2 data address, 2 data value) - enables non-intrusive real-time tracing of crypto engine register writes and FEC descriptor updates.
Power Management Normal high/low power modes with software-controllable clock gating - reduces idle current by 45% in low-power mode while retaining SRAM and register state.
Interrupt Architecture 23 internal + 6 external IRQ sources with programmable priority - allows prioritized servicing of FEC packet interrupts over USB endpoint transfers in real-time traffic shaping.

Applications

Secure Remote Access Gateway Industrial Ethernet Router

Use Scenario: Deployed in oilfield SCADA systems to terminate IPsec tunnels from RTUs while routing Modbus TCP between legacy PLCs and cloud SCADA servers.

IC Role / Device Role / Timing Role: Primary network processor executing Linux-based routing stack, crypto offload engine for ESP/AH packet processing, and dual-FEC MAC layer controller.

Use Value: Integrated AESU/DEU eliminates need for external crypto ASIC, reducing BOM cost by $3.20 and PCB area by 180 mm² versus discrete solution.

Use Scenario: Used in railway signaling interlock controllers to bridge PROFINET IRT and EtherNet/IP networks with deterministic sub-100 µs cycle times.

IC Role / Device Role / Timing Role: Real-time communications processor managing dual FEC timestamping, CPM-driven serial fieldbus gateways (RS-485/RS-232), and SIU-based periodic interrupt timer for IRT scheduling.

Use Value: On-chip 32-bit timers with gate mode enable precise synchronization of PROFINET frame transmission to external 1 PPS reference signal.

ATM Edge Concentrator USB-Enabled Network Appliance

Use Scenario: Installed in telecom central offices to aggregate DSLAM ATM cells into IP/MPLS core using RFC 2684 bridging and QoS-aware traffic shaping.

IC Role / Device Role / Timing Role: ATM segmentation/reassembly (SAR) accelerator via TSA-multiplexed SCC channels, FEC-based IP forwarding engine, and security engine for subscriber authentication.

Use Value: TSA hardware routing reduces CPU load by 35% during 256-concurrent PVC handling compared to software-only SAR implementations.

Use Scenario: Embedded in medical imaging devices as USB host controller for DICOM image transfer to PACS servers and USB function endpoint for service technician diagnostics.

IC Role / Device Role / Timing Role: Dual-role USB 2.0 transceiver supporting concurrent host (storage class) and function (CDC ACM) operation with independent endpoint buffers.

Use Value: Single-chip USB dual-role capability eliminates need for separate USB host controller IC and USB PHY, cutting component count by 3 and enabling Class I medical EMC compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC875CZQ66 Same die revision and feature set but in quad flat pack (QFP-256) package; RθJA = 52°C/W vs. 43°C/W for PBGA; no exposed thermal pad. Suitable for prototyping or space-constrained layouts where BGA rework is impractical; thermal derating required above 45°C ambient. Select MPC875CZQ66 only when QFP assembly infrastructure exists and thermal margin ≥15°C is available.
MPC885CZQ80 Higher 80 MHz core frequency, enhanced security engine (SHA-384/512), additional USB OTG support, and DDR2 memory controller - not pin-compatible. Targets next-generation secure routers requiring >300 Mbps IPsec throughput and DDR2-based packet buffering; requires PCB redesign. Choose MPC885CZQ80 for new designs needing higher crypto throughput and DDR2 interface; avoid for drop-in replacement of MPC875CZT66.

Compared with MPC875CZT66, MPC875CZQ66 offers identical functionality in a rework-friendly QFP package at the cost of 21% higher thermal resistance, while MPC885CZQ80 delivers architectural upgrades including DDR2 support and SHA-384 acceleration but mandates full hardware redesign due to non-pin-compatible packaging and expanded peripheral set.

Availability

MPC875CZT66 is available at Aetrix Electronics and suitable for secure remote access gateways, industrial Ethernet routers, and ATM edge concentrators requiring stable component supply across extended product lifecycles.

Supply support for MPC875CZT66 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC875CZT66 belongs to the PowerQUICC™ family of integrated communications processors designed specifically for cost-sensitive, power-efficient networking equipment requiring hardware-accelerated security and deterministic real-time I/O.

FAQ

What is the maximum ambient temperature for reliable operation of the MPC875CZT66 at 66 MHz?

The MPC875CZT66 has a maximum junction temperature (TJ) of 95°C under standard conditions. With typical power dissipation of 390 mW and RθJA = 43°C/W on a single-layer board, the maximum allowable ambient temperature is calculated as TA = TJ − (RθJA × PD) = 95 − (43 × 0.39) ≈ 52°C. Operation above this requires forced airflow or thermal enhancement. This thermal limit applies specifically to the MPC875CZT66 in its PBGA-256 package configuration.

Does the MPC875CZT66 support USB host and device modes simultaneously?

Yes, the MPC875CZT66 supports concurrent USB host and function operation through its dual-role USB 2.0 interface. In host mode, it manages control/bulk/interrupt/isochronous transfers to peripherals like USB storage; in function mode, it acts as a CDC ACM device for diagnostic communication. Both modes use independent endpoint buffers and share the same D+/D− differential pair, with mode selection controlled by software configuration of the USB control registers. This capability is intrinsic to the MPC875CZT66 silicon design.

How does the security engine in the MPC875CZT66 accelerate IPsec processing?

The MPC875CZT66 security engine accelerates IPsec via three dedicated hardware units: the AESU handles AES-128/192/256 encryption/decryption in ECB/CBC/counter modes; the DEU performs DES/3DES operations; and the MDEU computes SHA-1/256 and MD5 hashes. These units operate in parallel with the main CPU, process crypto operations on 256-byte descriptors, and achieve >200 Mbps throughput for ESP tunnel mode. This offload is implemented directly in the MPC875CZT66 die and requires no external components.

What are the mandatory reset configuration requirements for the MPC875CZT66?

The MPC875CZT66 requires specific register programming during boot: HRCW[DBGC] must be set to binary X1, SIUMCR[DBGC] must match that value, MBMR[GPLB4DIS] = 0, and port direction/assignment registers (PAPAR, PADIR, etc.) must be initialized per Table 7 in the hardware spec. These settings ensure proper debug mode enablement, GPIO functionality, and peripheral initialization. Failure to configure these registers correctly will result in undefined behavior of the MPC875CZT66 after reset release.

Is the MPC875CZT66 pin-compatible with other MPC875 variants like MPC875CZQ66?

No, the MPC875CZT66 (PBGA-256) is not pin-compatible with MPC875CZQ66 (QFP-256). Although both share identical electrical functionality and register maps, their package footprints differ: PBGA uses 1.27 mm ball pitch in 17×17 array with thermal pad, while QFP uses 0.5 mm lead pitch in 256-lead gull-wing configuration. PCB layout, thermal management, and assembly processes are incompatible between these packages. This distinction is inherent to the MPC875CZT66 mechanical specification.

MPC875CZT66 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-BBGA
Series:
MPC8xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10Mbps (1), 10/100Mbps (2)
SATA:
-
USB:
USB 2.0 (1)
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Grade:
-
Qualification:
-
Security Features:
Cryptography
Mounting Type:
Surface Mount
Supplier Device Package:
256-PBGA (23x23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

MPC875CZT66 FAQ

1.How can I place an order for MPC875CZT66 through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC875CZT66 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC875CZT66 reliable?

The price and inventory of MPC875CZT66 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC875CZT66 is usually 5 days.

3.What payment methods are accepted for MPC875CZT66?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC875CZT66 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC875CZT66?

MPC875CZT66 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC875CZT66 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC875CZT66?

For technical support, including MPC875CZT66 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC875CZT66 requirements.

6.How does Aetrix verify that MPC875CZT66 is sourced from the original manufacturer or authorized distributors?

All MPC875CZT66 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC875CZT66 meets industry standards.

7.What is the process for return or replacement of MPC875CZT66?

All MPC875CZT66 units undergo pre-shipment inspection (PSI). If there is an issue with MPC875CZT66, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC875CZT66 part is unused and in its original packaging.

Return procedure for MPC875CZT66:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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