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NXP Semiconductors MPC875VR66-NXP
- Part No.:
- MPC875VR66-NXP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 256-BBGA
- Datasheet:
-
MPC875VR66-NXP.pdf
- Description:
- IC MPU 66MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,972
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Product details
Overview
MPC875VR66-NXP from NXP Semiconductors (formerly Freescale) is a Power Architecture™-based 32-bit integrated microprocessor with embedded MPC8xx core, dual Fast Ethernet controllers, USB 2.0 host/function interface, security engine, and communications processor module (CPM). It operates at 66 MHz core frequency in 1:1 bus mode, supports 1.8-V core/3.3-V I/O, and targets ATM-enabled networking and controller applications.
For engineers reviewing the MPC875VR66-NXP datasheet, MPC875VR66-NXP pinout, MPC875VR66-NXP application, or MPC875VR66-NXP equivalent, key selection criteria include its 8-Kbyte instruction/data caches, IEEE 802.3 10/100 Mbps FECs, hardware-accelerated AES/DES/SHA crypto engine, 256-pin PBGA package, and mandatory reset configuration requirements for boot stability.
Technical Context
The MPC875VR66-NXP integrates a single-issue 32-bit MPC8xx core with MMU, two-way set-associative 8-Kbyte instruction and data caches, and 32-entry TLBs supporting 4/16/512 Kbyte and 8 Mbyte page sizes. Its system integration unit (SIU) provides clock synthesis, JTAG debug, watchdog, and periodic interrupt timer functionality.
The communications processor module (CPM) includes an 8-Kbyte dual-port RAM, RISC controller, and serial DMA channels managing SCC, SMC, SPI, and I²C peripherals. The security engine implements dedicated crypto-channel logic with DEU (DES/3DES), AESU (AES-128/192/256), and MDEU (SHA-1/256, MD5) accelerators - all accessible via descriptor-based DMA transfers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 66 MHz - enables 1:1 bus timing with external memory interfaces up to 66 MHz; supports deterministic real-time control in networking edge devices. |
| Cache Configuration | 8-Kbyte instruction + 8-Kbyte data cache, two-way set-associative - reduces memory latency for protocol stack execution and packet processing without external SRAM. |
| FEC Interfaces | Two 10/100 Mbps Fast Ethernet controllers with MII/RMII support - allows dual-port routing, bridging, or redundant LAN connectivity in industrial gateways. |
| Security Engine | AES-128/192/256, DES/3DES, SHA-1/256, MD5 acceleration - offloads IPsec/SSL/TLS cryptographic operations from main CPU, preserving throughput for packet forwarding. |
| I/O Voltage | 3.3 V with 5-V tolerant pins (PA[0:3], PB[24:25], etc.) - permits direct interfacing with legacy 5-V peripherals without level shifters in mixed-voltage systems. |
| Core Voltage | 1.8 V ±0.1 V - mandates strict power sequencing vs. VDDH to prevent ESD diode conduction; requires separate low-noise regulator and bypassing per layout guidelines. |
| Package | 256-ball PBGA (17 mm × 17 mm, 1.27 mm pitch) - demands four-layer PCB with dedicated VDD/GND planes and ≤6-inch trace lengths for signal integrity on address/data buses. |
Pinout & Package
The MPC875VR66-NXP is housed in a 256-ball plastic ball grid array (PBGA) package with 1.27 mm pitch and 17 mm × 17 mm body size. Thermal resistance values include RθJA = 43 °C/W (single-layer board, natural convection) and RθJB = 20 °C/W, requiring thermal vias to internal ground planes for sustained operation at junction temperatures up to 95 °C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDL | Core power supply | 1.8-V supply for CPU core and caches; must ramp no faster than VDDH and remain within ±100 mV of VDDSYN to avoid latch-up. |
| VDDH | I/O power supply | 3.3-V supply for all digital I/O including Ethernet PHY interfaces, USB transceivers, and parallel buses; supports 5-V tolerant inputs when VDDH = 3.3 V. |
| HRESET | Hardware reset input | Active-low asynchronous reset; must be held low ≥100 µs after power stabilization; triggers mandatory HRCW and SIUMCR register initialization sequence. |
| MII1_TXEN | Fast Ethernet transmit enable | Output controlling MII transmit data strobe; drives 10/100 Mbps Ethernet MAC layer; requires controlled-impedance PCB routing to minimize jitter. |
| USB_DP / USB_DM | USB 2.0 differential pair | Full-speed (12 Mbps) or low-speed (1.5 Mbps) signaling; requires 90-Ω differential impedance, <15-mm trace length, and common-mode choke for EMI compliance. |
| TSIZ0 / REG | Memory bank size select | Configures DRAM bank size during boot; determines address decode window for glueless interface to 32 MB–256 MB memory arrays. |
Key Features
| Feature | Design Value |
|---|---|
| PowerQUICC™ Architecture | Integrated MPC8xx core + CPM + SIU eliminates need for external communication co-processor, reducing BOM count and PCB area in router/firewall designs. |
| Dual Fast Ethernet Controllers | Independent MII/RMII interfaces allow simultaneous 10/100 Mbps operation on two physical ports - enabling transparent bridging or WAN/LAN separation without external switch IC. |
| Hardware Security Engine | Dedicated crypto-channel with AESU/DEU/MDEU units processes IPsec ESP/AH packets at line rate without CPU intervention, preserving MIPS for application-layer tasks. |
| Time-Slot Assigner (TSA) | Supports T1/E1, ISDN PRI/BRI, and PCM highway time-division multiplexing - enables voice-over-IP gateway functionality with precise channelized timing control. |
| PCMCIA Interface | Release 2.1-compliant socket controller supports hot-pluggable modems or wireless cards - extends field-upgradability in remote access concentrators and industrial terminals. |
Applications
| ATM Edge Router | Secure Industrial Gateway |
|---|---|
Use Scenario: Aggregating DSL/Cable modem traffic into ATM backhaul networks with QoS-aware scheduling. IC Role / Device Role / Timing Role: Main processor executing ATM adaptation layer (AAL5), SAR segmentation/reassembly, and traffic shaping algorithms. Use Value: Integrated TSA and FECs eliminate external PHY and TDM controller ICs; 66-MHz core delivers sufficient MIPS for multi-service packet classification at OC-3 line rates. |
Use Scenario: Connecting Modbus/Profibus field devices to encrypted TLS tunnels for cloud SCADA monitoring. IC Role / Device Role / Timing Role: Central secure gateway running Linux with real-time extensions, managing crypto offload and protocol translation. Use Value: Hardware AES/SHA acceleration enables 20+ concurrent TLS sessions with <5% CPU utilization; 5-V tolerant I/O simplifies legacy sensor interface design. |
| VoIP Media Gateway | Network Attached Storage Controller |
Use Scenario: Converting analog POTS lines to SIP/RTP streams using G.711/G.729 codecs and echo cancellation. IC Role / Device Role / Timing Role: Real-time DSP host with TSA-driven TDM bus for codec interfacing and FEC-managed Ethernet transport. Use Value: On-chip TSA synchronizes 24-channel T1 framing to Ethernet packet timestamps; dual FECs support simultaneous WAN uplink and LAN management port. |
Use Scenario: Embedded NAS appliance with RAID 5, SMB/CIFS file serving, and HTTPS admin interface. IC Role / Device Role / Timing Role: System-on-chip controller managing SATA/IDE storage, USB mass storage, and encrypted web services. Use Value: PCMCIA socket enables optional 3G/WiMAX WAN module; security engine accelerates HTTPS handshake and disk encryption (AES-XTS) without performance penalty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated networking processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC875VR80-NXP | 80 MHz core frequency; supports both 1:1 and 2:1 bus modes; higher power dissipation (430 mW typical at 1.8 V). | Required for applications needing >66 MHz instruction throughput - e.g., deep packet inspection or multi-protocol firewalling. | Select MPC875VR80-NXP only if application firmware exceeds 66-MHz cycle budget; verify thermal margin with RθJA = 43 °C/W. |
| MPC885CZQ80B-NXP | Successor PowerQUICC III device; e500v1 core at 800 MHz; integrated DDR controller; lacks TSA but adds PCI Express and SEC 2.2. | Suitable for next-generation gateways requiring gigabit Ethernet, hardware NAT, and multi-core scalability - not drop-in compatible. | MPC885CZQ80B-NXP requires full hardware redesign; choose only for new designs targeting 10-year lifecycle and >1 Gbps throughput. |
Compared with MPC875VR66-NXP, the MPC875VR80-NXP offers higher deterministic throughput for compute-bound networking stacks, while the MPC885CZQ80B-NXP shifts architecture toward scalable multicore and modern memory interfaces - making MPC875VR66-NXP optimal for cost-sensitive, thermally constrained ATM/DSL edge deployments where legacy software compatibility and TSA functionality are essential.
Availability
MPC875VR66-NXP is available at Aetrix Electronics and suitable for industrial gateways, VoIP media converters, ATM edge routers, and secure network attached storage requiring stable component supply across extended product lifecycles.
Supply support for MPC875VR66-NXP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and networking markets.
The MPC875VR66-NXP belongs to the PowerQUICC™ family of integrated communications processors designed specifically for cost-optimized, low-power ATM, DSL, and enterprise edge networking equipment with hardware-accelerated security and TDM support.
FAQ
What is the maximum operating junction temperature for the MPC875VR66-NXP?
The MPC875VR66-NXP has a maximum guaranteed junction temperature (TJ) of 95 °C under standard operating conditions. This limit applies when ambient temperature is maintained at 0 °C and thermal design meets JEDEC JESD51-2 specifications with RθJA = 43 °C/W on a single-layer board. Exceeding 95 °C risks timing violations and accelerated electromigration in the 1.8-V core logic. For extended temperature applications, derating curves in Section 3 of the MPC875EC Rev. 4 datasheet must be applied.
Does the MPC875VR66-NXP support pin-compatible upgrades to higher-frequency variants?
No, the MPC875VR66-NXP does not support pin-compatible upgrades to higher-frequency variants like MPC875VR80-NXP. While both share the same 256-ball PBGA package and pinout definition, the VR80 variant requires stricter power sequencing (VDDL ramp rate control), enhanced decoupling (additional 0.01-µF capacitors near VDDL balls), and revised thermal vias due to 430 mW typical power dissipation. Board-level validation is mandatory before substitution.
How is the security engine in the MPC875VR66-NXP accessed by software?
The MPC875VR66-NXP security engine is accessed via descriptor-based DMA through the crypto-channel interface. Software writes command descriptors to dual-port RAM, configures CHA registers (DEU/AESU/MDEU), and triggers execution using CPM SDMA channels. No CPU cycles are consumed during crypto operations - the engine runs autonomously and signals completion via interrupt. Full programming details are in Chapter 13 of the MPC885 PowerQUICC™ Family Reference Manual.
What are the mandatory reset configuration steps required for reliable boot of the MPC875VR66-NXP?
Reliable boot of the MPC875VR66-NXP requires three mandatory steps: (1) Set HRCW[DBGC] = binary X1 during hardware reset; (2) Program SIUMCR[DBGC] = X1 in boot code immediately after HRESET deassertion; (3) Configure MBMR[GPLB4DIS] = 0 and specific PAPAR/PADIR register fields per Table 7 of the MPC875EC Rev. 4 specification. Failure to execute all steps causes undefined CPM behavior and cache coherency faults.
Can the MPC875VR66-NXP operate with a 5-V-only power supply system?
No, the MPC875VR66-NXP requires three independent supplies: 1.8 V for VDDL (core), 3.3 V for VDDH (I/O), and 1.8 V for VDDSYN (PLL). While certain pins (e.g., PA[0:3], PB[24:25]) tolerate 5-V inputs, applying 5 V to any power pin will cause permanent damage. Input voltage on 5-V tolerant pins must not exceed VDDH + 2.5 V - so with VDDH = 3.3 V, max input is 5.8 V, but absolute maximum rating is 5.5 V per Table 2.
MPC875VR66-NXP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-BBGA
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 66MHz
- Co-Processors/DSP:
- Communications; CPM, Security; SEC
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1), 10/100Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-PBGA (23x23)
- Additional Interfaces:
- I2C, PCMCIA, SPI, TDM, UART
MPC875VR66-NXP FAQ
1.How can I place an order for MPC875VR66-NXP through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC875VR66-NXP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC875VR66-NXP reliable?
The price and inventory of MPC875VR66-NXP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC875VR66-NXP is usually 5 days.
3.What payment methods are accepted for MPC875VR66-NXP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC875VR66-NXP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC875VR66-NXP?
MPC875VR66-NXP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC875VR66-NXP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC875VR66-NXP?
For technical support, including MPC875VR66-NXP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC875VR66-NXP requirements.
6.How does Aetrix verify that MPC875VR66-NXP is sourced from the original manufacturer or authorized distributors?
All MPC875VR66-NXP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC875VR66-NXP meets industry standards.
7.What is the process for return or replacement of MPC875VR66-NXP?
All MPC875VR66-NXP units undergo pre-shipment inspection (PSI). If there is an issue with MPC875VR66-NXP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC875VR66-NXP part is unused and in its original packaging.
Return procedure for MPC875VR66-NXP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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