NXP Semiconductors MPC875ZT133

Overview

MPC875ZT133 from Freescale Semiconductor is a 32-bit Power Architecture™ microprocessor with integrated communications processor module (CPM), dual Fast Ethernet controllers (FEC), USB 2.0 host/function interface, security engine (AES/DES/SHA), and 8-Kbyte instruction + 8-Kbyte data caches. It operates at 133 MHz core frequency (2:1 bus mode), supports 10/100 Mbps MII/RMII Ethernet, and targets secure networking edge devices requiring deterministic real-time packet processing.

For engineers reviewing the MPC875ZT133 datasheet, MPC875ZT133 pinout, MPC875ZT133 application, or MPC875ZT133 equivalent, key selection criteria include its 256-pin PBGA package, 1.8-V core / 3.3-V I/O voltage domains, mandatory reset configuration sequence, IEEE 1149.1 JTAG debug support, and hardware-accelerated IPsec/SSL offload capability via dedicated crypto-channel.

Technical Context

The MPC875ZT133 integrates a single-issue MPC8xx core with MMU, two-way set-associative caches, and a separate 32-bit RISC CPM for autonomous serial protocol handling (HDLC, UART, IrDA, BISYNC). Its system integration unit (SIU) provides clock synthesis, PIT, watchdog, and bus arbitration logic.

It features dual 10/100 Mbps FECs with MII/RMII interfaces, a time-slot assigner (TSA) for TDM multiplexing, PCMCIA 2.1 socket support, and a security engine comprising AESU (128/192/256-bit keys), DEU (DES/3DES), and MDEU (SHA-1/256, MD5) with 256-byte buffer per accelerator and multi-command descriptor support.

Key Specifications

Pinout & Package

The MPC875ZT133 is housed in a 256-ball PBGA package (17 mm × 17 mm, 1.0 mm ball pitch) with thermal pad exposed on underside for board-level heat conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC875ZT100, the MPC875ZT133 delivers 33% higher core throughput for crypto-intensive workloads while maintaining identical I/O compatibility; versus MPC875ZT150, it offers better thermal margin and lower system-level power conversion losses without sacrificing functional feature set.

Availability

MPC875ZT133 is available at Aetrix Electronics and suitable for secure residential gateways, industrial Ethernet bridges, DSLAM line cards, and remote access appliances requiring stable component supply across extended product lifecycles.

Supply support for MPC875ZT133 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC875ZT133 belongs to the PowerQUICC™ family - designed specifically for integrated communications processors combining general-purpose CPU cores with autonomous communication engines and hardware security acceleration for edge networking equipment.

FAQ

What is the maximum operating junction temperature for the MPC875ZT133?

The MPC875ZT133 has a maximum junction temperature of 95 °C under standard operating conditions and 100 °C in extended temperature grade configurations. This rating assumes proper PCB thermal design with a 4-layer board (2s2p) and adequate airflow. Exceeding these limits risks permanent degradation of the security engine's cryptographic accelerators and cache coherency logic. Always verify TJ using RθJB = 20 °C/W and measured board temperature during thermal validation of the MPC875ZT133.

Does the MPC875ZT133 support pin-compatible migration from the MPC875ZT100?

Yes, the MPC875ZT133 is pin-compatible with the MPC875ZT100 and shares identical 256-ball PBGA mechanical dimensions, power pin mapping, and signal ball assignments. No PCB redesign is required for upgrade; however, the reset configuration sequence and power sequencing circuit must be verified to meet the tighter VDDL–VDDSYN tracking requirement (≤100 mV) specified for the 133 MHz variant. The MPC875ZT133 retains full software compatibility with MPC875ZT100 firmware images.

How does the security engine in the MPC875ZT133 accelerate IPsec processing?

The MPC875ZT133 security engine accelerates IPsec by offloading AES-CBC/CTR, DES/3DES, and SHA-1/256 operations to dedicated hardware units (AESU, DEU, MDEU) managed by a crypto-channel controller. It processes inbound/outbound packets in-line via DMA-linked descriptors, eliminating CPU context switches. For example, a 1500-byte ESP packet undergoes full encryption, authentication, and sequence number update in <12 µs - enabling line-rate 100 Mbps IPsec tunneling without impacting main CPU utilization. This acceleration is intrinsic to the MPC875ZT133 silicon and requires no external co-processor.

What are the mandatory reset configuration steps required for reliable MPC875ZT133 boot?

Upon HRESET assertion, the MPC875ZT133 requires programming of HRCW[DBGC] = binary X1 and SIUMCR[DBGC] = binary X1 before releasing reset. Additionally, MBMR[GPLB4DIS] = 0 and specific bitfields in PAPAR, PADIR, PBPAR, PBDIR, PCPAR, and PCDIR must be set per Table 7 of the hardware specification. Failure to execute this sequence results in undefined CPM behavior and corrupted USB enumeration. These settings must be implemented in boot ROM code prior to enabling peripheral clocks - they are not optional configuration registers but hardwired dependencies for MPC875ZT133 functional integrity.

Can the MPC875ZT133 operate with asynchronous VDDL and VDDH power supplies?

No - the MPC875ZT133 mandates strict voltage sequencing: VDDH must ramp before or simultaneously with VDDL, and the difference between VDDL and VDDH must never exceed 100 mV during power-up, steady-state, or power-down. Violation causes forward biasing of ESD protection diodes, leading to irreversible latch-up or accelerated electromigration failure. Freescale specifies use of Schottky diode clamping (e.g., MUR420) between supplies as shown in Figure 4 of the hardware spec. This constraint is absolute for MPC875ZT133 reliability and is not relaxed by derating or ambient temperature reduction.