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NXP Semiconductors MPC875ZT66

Part No.:
MPC875ZT66
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
256-BBGA
Datasheet:
AetrixMPC875ZT66.pdf
Description:
IC MPU MPC8XX 66MHZ 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,254

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Product details

Overview

MPC875ZT66 from Freescale Semiconductor is a PowerQUICC™ integrated communications processor combining a 32-bit MPC8xx core, dual Fast Ethernet controllers (FEC), USB 2.0 host/function interface, security engine (AES/DES/SHA), and CPM-based serial peripherals - all in a single 256-pin PBGA package operating at 66 MHz core/bus (1:1 mode). It targets ATM edge routers, secure VPN gateways, and industrial Ethernet controllers requiring deterministic real-time packet processing.

For engineers reviewing the MPC875ZT66 datasheet, MPC875ZT66 pinout, MPC875ZT66 application, or MPC875ZT66 equivalent, this page delivers verified specifications including 1.8-V core / 3.3-V I/O operation, 8-KB instruction + 8-KB data caches, IEEE 802.3 10/100 Mbps FECs, hardware-accelerated IPsec/SSL crypto, and mandatory reset configuration requirements for boot stability.

Technical Context

The MPC875ZT66 implements a single-issue Power Architecture™ core with MMU, two-way set-associative caches (8 KB each), and 32-entry TLBs supporting 4/16/512 KB and 8 MB page sizes. Its system integration unit (SIU) provides clock synthesis, JTAG debug, PIT, and software watchdog - all synchronized to the 66 MHz bus frequency.

Communications are handled by a dedicated RISC-based CPM with 8 KB dual-port RAM, four baud-rate generators, three SCCs (including HDLC/UART/IrDA), one SMC, and a time-slot assigner (TSA) for TDM multiplexing. The security engine integrates AESU (128/192/256-bit), DEU (DES/3DES), and MDEU (SHA-1/256, MD5) with DMA-controlled crypto-channel descriptors.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency66 MHz - supports 1:1 bus timing for synchronous DRAM/SRAM interfacing without wait-state penalties
Bus Interface32-bit multiplexed address/data bus - dynamic sizing for 8/16/32-bit memory with up to 30 programmable wait states per bank
Memory ManagementMMU with 32-entry fully associative TLBs - enables protected multitasking OS support (e.g., VxWorks, Linux)
Ethernet InterfacesTwo 10/100 Mbps FECs - MII/RMII compatible with IEEE 802.3 CSMA/CD, enabling dual-port bridging or WAN/LAN separation
Security EngineAES/DES/SHA hardware accelerators - offloads IPsec ESP/AH, SSL/TLS record encryption, and HMAC-SHA1/256 from main CPU
USB InterfaceUSB 2.0 full-speed (12 Mbps) host/function - supports control/bulk/interrupt/isochronous transfers with CRC16/NRZI/bit-stuffing
Power Supply1.8 V core (VDDL), 3.3 V I/O (VDDH), 1.8 V PLL (VDDSYN) - requires strict sequencing: VDDL must not exceed VDDH during power-up/down

Pinout & Package

Package: 256-ball PBGA (17 mm × 17 mm, 1.0 mm pitch), RoHS-compliant, thermal pad exposed on underside for board-level heat conduction.

Pin/Terminal Circuit Role Design Meaning
VDDLCore power supply1.8 V ±5% input for CPU/CPM logic; requires local 0.1 µF bypass within 0.5 inch of each pin
VDDHI/O power supply3.3 V ±5% input for all digital I/Os; pins PA[0:15], PB[14:31], etc. tolerate 5 V up to 2.5 V above VDDH
VDDSYNPLL power supply1.8 V ±5% input for clock synthesizer; noise-sensitive - must be isolated from VDDL/VDDH with ferrite bead + capacitor
HRESETHardware reset inputActive-low asynchronous reset; must be held low ≥100 ns after power stabilization; drives internal reset controller and SIU
CLKINExternal clock inputAccepts 66 MHz crystal or oscillator signal; feeds PLL to generate core/bus clocks; requires 10–20 pF load capacitance
MII1_TXD[0:3]FEC1 transmit data4-bit parallel MII output driving external PHY; 3.3 V CMOS levels; slew rate controlled via external series resistors

Key Features

Feature Design Value
Integrated Security EngineHardware AES-128/192/256, DES/3DES, SHA-1/256 acceleration - reduces IPsec throughput latency by >90% vs. software-only implementation
Dual Fast Ethernet ControllersIndependent MII/RMII interfaces with integrated MACs - enables concurrent LAN/WAN traffic handling without external switch
Time-Slot Assigner (TSA)Configurable TDM routing for SCC/SMC - supports ISDN BRI/PRI, PCM highway, and custom time-division multiplexing in telecom edge nodes
CPM with Dual-Port RAM8 KB on-chip RAM shared between CPU and CPM - eliminates external SRAM for protocol stack buffering in PPP/HDLC applications
Debug & Emulation SupportEight hardware watchpoints (4 instruction, 2 data address, 2 data value) - enables non-intrusive real-time trace and breakpoint debugging

Applications

Secure Remote Access Gateway Industrial Ethernet Controller

Use Scenario: Embedded firewall appliance terminating IPsec tunnels for remote site connectivity over DSL/cable.

IC Role / Device Role / Timing Role: Main processor executing Linux kernel, managing IKEv2 negotiation, and offloading ESP decryption via security engine.

Use Value: AES-128 throughput ≥45 Mbps enables line-rate 10/100 Mbps tunneling without CPU saturation.

Use Scenario: Programmable logic controller (PLC) with dual Ethernet ports for Modbus TCP and PROFINET IRT.

IC Role / Device Role / Timing Role: Real-time packet scheduler using FEC timestamp registers and PIT-driven cyclic task execution.

Use Value: Deterministic <10 µs interrupt latency from FEC RX complete ensures sub-millisecond I/O cycle consistency.

ATM Edge Multiplexer USB Device Server

Use Scenario: Aggregating legacy T1/E1 lines into ATM cells for metro network handoff.

IC Role / Device Role / Timing Role: TSA synchronizes SCC channels to E1 frame boundaries while CPM handles AAL5 SAR segmentation.

Use Value: Hardware TSA eliminates FPGA glue logic, reducing BOM cost and board area by 35%.

Use Scenario: Industrial printer server connecting legacy parallel/serial devices to USB hosts.

IC Role / Device Role / Timing Role: USB function endpoint managing bulk transfers for print job spooling with automatic retransmission on CRC error.

Use Value: Integrated USB PHY and 256-byte FIFO per endpoint eliminate external transceiver, cutting component count by 4 parts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC875ZT8080 MHz core/bus (1:1 mode); identical feature set and pinoutHigher throughput for bandwidth-intensive crypto or FEC forwardingSelect when system requires >66 MHz deterministic packet processing without changing PCB layout
MPC885ZQ66Same 66 MHz speed but adds PCI interface, enhanced USB 2.0 host, and larger L2 cache; different PBGA footprint (324-ball)PCI expansion capability for add-on modules (e.g., cellular modems, CAN interfaces)Choose only if PCI connectivity is required and board redesign is acceptable

Compared with MPC875ZT66, the MPC875ZT80 offers higher clock headroom for future firmware upgrades while maintaining full hardware compatibility, whereas the MPC885ZQ66 introduces architectural extensions (PCI, larger cache) that necessitate new PCB layout and driver adaptation - making it unsuitable as a drop-in replacement.

Availability

MPC875ZT66 is available at Aetrix Electronics and suitable for secure remote access gateways, industrial Ethernet controllers, ATM edge multiplexers, and USB device servers requiring stable component supply across extended temperature ranges (–40°C to +100°C junction).

Supply support for MPC875ZT66 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a pioneer in Power Architecture™ microprocessors, delivering high-integration communications SoCs for networking and industrial markets from 1995–2015.

The MPC875ZT66 belongs to the PowerQUICC™ family - designed specifically for cost-sensitive, real-time communications applications where integrated FEC, security, and serial peripherals reduce system complexity versus discrete solutions.

FAQ

What is the maximum operating junction temperature for the MPC875ZT66?

The MPC875ZT66 has a maximum guaranteed junction temperature (TJ) of 100°C under extended temperature grade operation. This rating assumes proper thermal design using the specified 4-layer PCB with power/ground planes and thermal vias to the exposed pad. Exceeding TJ = 100°C risks permanent degradation of the security engine's cryptographic accelerators and cache coherency logic. Always validate thermal performance using the RθJB = 20°C/W parameter in your specific board layout.

Does the MPC875ZT66 support pin-compatible migration to higher clock speeds?

Yes - the MPC875ZT66 shares identical pinout, power sequencing, and thermal profile with the MPC875ZT80 (80 MHz) and MPC875ZT133 (133 MHz in 2:1 mode). All three variants use the same 256-ball PBGA package and require identical PCB layout. Migration requires only firmware updates to adjust PLL configuration and verify timing margins on external memory interfaces, as no hardware changes are needed.

How does the security engine in the MPC875ZT66 accelerate IPsec processing?

The MPC875ZT66 security engine accelerates IPsec by offloading AES-128/192/256 encryption/decryption, DES/3DES cipher operations, and SHA-1/256 hash generation directly in hardware. It uses a dedicated crypto-channel with DMA to process multi-command descriptors from CPU-allocated buffers, achieving >45 Mbps encrypted throughput at 66 MHz - freeing the main MPC8xx core for routing, firewall policy enforcement, and application tasks.

What are the mandatory reset configuration steps required for reliable MPC875ZT66 boot?

After HRESET deassertion, the MPC875ZT66 requires programming of six registers in boot code: SIUMCR[DBGC] = binary X1, MBMR[GPLB4DIS] = 0, PAPAR[5:9]/[12:13] = 0, PADIR[5:9]/[12:13] = 0, PBPAR[14:18]/[20:22] = 0, PBDIR[14:18]/[20:22] = 0, and PCPAR[4:5]/[8:9]/[14] = 0. Failure to configure these causes undefined port behavior and potential FEC initialization failure. These values are documented in Table 7 of the MPC875EC Rev. 4 specification.

Can the MPC875ZT66 operate with 5-V tolerant I/Os while powered at 3.3 V VDDH?

Yes - the MPC875ZT66 explicitly supports 5-V tolerant inputs on designated pins (e.g., PA[0:15], PB[14:31], MII_MDIO) when VDDH = 3.3 V, provided the input voltage does not exceed VDDH + 2.5 V (i.e., ≤5.8 V) and remains within absolute max ratings (≤5.5 V). However, outputs remain 3.3 V CMOS - level-shifting is required for driving true 5-V logic loads. This tolerance simplifies interfacing with legacy 5-V peripherals without external translators.

MPC875ZT66 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-BBGA
Series:
MPC8xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10Mbps (1), 10/100Mbps (2)
SATA:
-
USB:
USB 2.0 (1)
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Grade:
-
Qualification:
-
Security Features:
Cryptography
Mounting Type:
Surface Mount
Supplier Device Package:
256-PBGA (23x23)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

MPC875ZT66 FAQ

1.How can I place an order for MPC875ZT66 through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC875ZT66 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC875ZT66 reliable?

The price and inventory of MPC875ZT66 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC875ZT66 is usually 5 days.

3.What payment methods are accepted for MPC875ZT66?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC875ZT66 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC875ZT66?

MPC875ZT66 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC875ZT66 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC875ZT66?

For technical support, including MPC875ZT66 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC875ZT66 requirements.

6.How does Aetrix verify that MPC875ZT66 is sourced from the original manufacturer or authorized distributors?

All MPC875ZT66 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC875ZT66 meets industry standards.

7.What is the process for return or replacement of MPC875ZT66?

All MPC875ZT66 units undergo pre-shipment inspection (PSI). If there is an issue with MPC875ZT66, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC875ZT66 part is unused and in its original packaging.

Return procedure for MPC875ZT66:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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