NXP Semiconductors MPC880CVR133-NXP

Overview

MPC880CVR133-NXP from NXP (formerly Freescale) is a Power Architecture™-based integrated communications processor combining a 133 MHz MPC8xx core, dual 10/100 Fast Ethernet controllers (FEC), USB 2.0 full-/low-speed interface, UTOPIA L1/L2-compliant ATM interface, and dual-port CPM with 8 KB RAM. It operates at 1.8 V core / 3.3 V I/O and targets broadband access gateways and DSLAM line cards requiring deterministic real-time packet processing.

For engineers reviewing the MPC880CVR133-NXP datasheet, MPC880CVR133-NXP pinout, MPC880CVR133-NXP application, or MPC880CVR133-NXP equivalent, key selection criteria include its 133 MHz core frequency in 2:1 bus mode, dual FEC with MII/RMII support, absence of on-chip security engine (vs. MPC885), and PBGA-357 package with 1.8 V/3.3 V dual-rail power sequencing requirements.

Technical Context

The MPC880CVR133-NXP integrates a single-issue 32-bit MPC8xx core with 8 KB instruction and 8 KB data caches (two-way set-associative), MMU with 32-entry ITLB/DTLB supporting 4/16/512 KB and 8 MB page sizes, and a dedicated Communications Processor Module (CPM) running independently via RISC controller and 8 KB dual-port RAM. Its CPM handles serial protocols including HDLC, UART, IrDA, and ATM over SCCs/SMCs without CPU intervention.

It supports 2:1 bus mode only at 133 MHz core frequency, with external bus maxing at 80 MHz; includes four baud rate generators, time-slot assigner for T1/CEPT/ISDN timing, and IEEE 1149.1 JTAG debug interface. The USB controller operates as function endpoint or host controller (12/1.5 Mbps), while FECs implement IEEE 802.3 CSMA/CD with MII/RMII physical layer interfaces.

Key Specifications

Pinout & Package

The MPC880CVR133-NXP is housed in a 357-ball PBGA package (19×19 mm, 1.27 mm pitch) with thermal pad. Pin assignments follow Freescale's standard MPC880 ball map: balls A1–A19, B1–B19, ..., T1–T19; critical signal groups include PA[0:15] (multiplexed address/data), PB[14:31] (peripheral I/O), PC[4:15] (serial control), PD[3:15] (FEC/MII), PE[14:31] (USB/UTOPIA), and dedicated power/ground balls distributed across all four edges.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC885CVR133, MPC880CVR133 removes the security engine to lower cost and power, making it optimal for non-encrypted ATM/Ethernet aggregation; versus MPC8360EVRAGDB, it retains CPM-based serial offload but trades raw MIPS for deterministic low-latency protocol handling in legacy telecom stacks.

Availability

MPC880CVR133-NXP is available at Aetrix Electronics and suitable for DSLAM line cards, residential gateways, enterprise branch routers, and industrial protocol gateways requiring stable component supply across long-lifecycle telecom deployments.

Supply support for MPC880CVR133-NXP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and communication markets.

The MPC880CVR133-NXP belongs to the PowerQUICC family designed specifically for cost-sensitive, real-time communications infrastructure-emphasizing integrated peripheral offload (CPM), deterministic ATM/Ethernet timing, and extended temperature reliability.

FAQ

What is the maximum operating frequency of the MPC880CVR133-NXP core?

The MPC880CVR133-NXP core operates at a maximum frequency of 133 MHz, but only in 2:1 bus mode (core clock twice the external bus clock). It does not support 133 MHz in 1:1 mode; for 1:1 operation, maximum core frequency is 80 MHz. This constraint is defined in the MPC885/MPC880 Hardware Specifications Rev. 7, Section 2 Features. The MPC880CVR133-NXP must be configured accordingly in reset configuration pins and software initialization.

Does the MPC880CVR133-NXP include a hardware security engine?

No, the MPC880CVR133-NXP does not include a hardware security engine. Unlike the MPC885 variant, the MPC880 omits the crypto-channel, AESU, DEU, and MDEU blocks. This is explicitly confirmed in Table 1 of the MPC885/MPC880 Hardware Specifications, which lists "No" under Security Engine for MPC880. Therefore, the MPC880CVR133-NXP relies on software-based encryption or external security ICs for IPsec, SSL/TLS, or other cryptographic operations.

What package type and pin count does the MPC880CVR133-NXP use?

The MPC880CVR133-NXP uses a 357-ball plastic ball grid array (PBGA) package with 1.27 mm pitch and 19×19 ball array, including an exposed thermal pad. This is documented in Section 2 Features ("The MPC885/MPC880 comes in a 357-pin ball grid array (PBGA) package") and confirmed in Figure 2 (MPC880 Block Diagram) and Mechanical Data section. The package supports standard reflow profiles and requires controlled impedance PCB layout for signal integrity.

Can the MPC880CVR133-NXP operate with 5 V-tolerant I/O pins?

Yes, specific I/O pins on the MPC880CVR133-NXP-including PA[0:15], PB[14:31], PC[4:15], PD[3:15], PE[14:31], TDI, TDO, TCK, TRST, TMS, MII1_TXEN, and MII_MDIO-are 5 V tolerant, but only up to VDDH + 2.5 V (i.e., ≤5.8 V when VDDH = 3.3 V). This is specified in Table 6 (DC Electrical Specifications) and Section 8 (Power Supply and Power Sequencing). Exceeding this limit risks forward-biasing ESD diodes and damaging the MPC880CVR133-NXP.

What is the thermal design requirement for the MPC880CVR133-NXP junction temperature?

The MPC880CVR133-NXP has a maximum junction temperature (TJ) of +100°C under extended temperature operation, as stated in Table 3 (Operating Temperatures). Thermal design must ensure TJ remains ≤100°C using junction-to-board (RθJB = 17°C/W) or junction-to-ambient (RθJA = 25°C/W on 4-layer board) metrics from Table 4. Power dissipation at 133 MHz in 2:1 mode is up to 495 mW (Table 5), so board-level thermal management-including ground plane vias under the thermal pad-is essential to meet this requirement.