NXP Semiconductors MPC885CZP133

Overview

MPC885CZP133 from Freescale Semiconductor is a Power Architecture™-based integrated communications processor combining a 133 MHz MPC8xx core, dual Fast Ethernet controllers (10/100 Mbps), USB 2.0 full-/low-speed host/function capability, UTOPIA L2-compliant ATM interface, and hardware security engine (AES/DES/3DES/SHA/MD5) in a single 357-pin PBGA package. It targets embedded networking gateways, DSLAMs, and secure edge routers requiring deterministic real-time packet processing.

For engineers reviewing the MPC885CZP133 datasheet, MPC885CZP133 pinout, MPC885CZP133 application, or MPC885CZP133 equivalent, key selection criteria include its 133 MHz core frequency with 2:1 bus ratio, 1.8 V core / 3.3 V I/O voltage separation, integrated crypto-accelerated IPsec/SSL offload, and dual FEC + UTOPIA support for multi-protocol WAN aggregation.

Technical Context

The MPC885CZP133 implements a unified 32-bit Power Architecture core with separate 8 KB instruction and 8 KB data caches (two-way set-associative), 32-entry MMU TLBs supporting 4/16/512 KB and 8 MB page sizes, and on-chip bus arbitration logic enabling glueless interfacing to DRAM, SRAM, Flash, and PCMCIA. Its CPM subsystem includes 8 KB dual-port RAM, four baud rate generators, and RISC-based serial DMA channels for SCC/SMC offload.

Hardware acceleration is distributed across three crypto units: DEU (DES/3DES ECB/CBC), AESU (AES-128/192/256 ECB/CBC/CTR), and MDEU (SHA-1/256, MD5, HMAC), all sharing a 256-byte buffer with flow control. The SIU provides clock synthesis, IEEE 1149.1 JTAG debug, periodic interrupt timer, and software watchdog - all operating under independent 1.8 V (VDDL) and 3.3 V (VDDH) power domains with strict sequencing requirements.

Key Specifications

Pinout & Package

Package: 357-ball PBGA (27 mm × 27 mm, 1.27 mm pitch), RoHS-compliant, thermal pad exposed on underside for board-level heat sinking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC885CZQ133, the MPC885CZP133 delivers 32% lower junction temperature under identical FEC+crypto load due to PBGA thermal pad; versus MPC8360EVRAGDB, it retains hardware-mapped UTOPIA L2 and AAL2/VBR ROM firmware essential for field-deployed DSLAMs.

Availability

MPC885CZP133 is available at Aetrix Electronics and suitable for DSLAM line cards, secure VPN gateways, industrial protocol gateways, and wireless baseband controllers requiring stable component supply across extended product lifecycles.

Supply support for MPC885CZP133 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC885CZP133 belongs to the PowerQUICC family - designed specifically for cost-sensitive, power-efficient communications infrastructure requiring integrated protocol acceleration, hardware security, and multi-interface flexibility in a single SoC.

FAQ

What is the maximum ambient temperature for continuous operation of the MPC885CZP133?

The MPC885CZP133 supports continuous operation at ambient temperatures up to 0 °C to +85 °C (standard grade) with junction temperature limited to 95 °C. This requires thermal design achieving ≤25 °C/W junction-to-ambient resistance on a 4-layer PCB with 200 ft/min airflow. At extended temperature grade (–40 °C to +100 °C junction), derating of CPU frequency or FEC activity may be necessary to maintain reliability.

Does the MPC885CZP133 support pin-compatible migration from the MPC880 series?

No, the MPC885CZP133 is not pin-compatible with MPC880 variants despite shared PBGA packaging - differences in security engine signal routing, USB PHY pin assignments, and UTOPIA interface signals require PCB layout revision. The MPC885CZP133 has dedicated TSIZ0/REG and enhanced FEC control pins absent in MPC880, making direct replacement impossible without hardware modification.

How does the MPC885CZP133 handle power sequencing between VDDL and VDDH rails?

The MPC885CZP133 mandates strict power sequencing: VDDL must ramp after and never exceed VDDH during power-up/down. Violation forward-biases internal ESD diodes, risking latch-up. Freescale recommends using Schottky diodes (e.g., MUR420) between VDDH and VDDL supplies as shown in Figure 5 of MPC885EC Rev. 7 to enforce ≤100 mV differential and prevent current surge exceeding 100 µA leakage limits.

Can the MPC885CZP133's USB interface operate as both host and function simultaneously?

No, the MPC885CZP133's USB controller supports host mode or function mode - not simultaneous dual-role operation. Mode selection is fixed at reset via strap pins (USB_MODE[1:0]), and runtime switching is unsupported. For diagnostic use, loopback mode is available only in host configuration at 12 Mbps, requiring no external USB device.

What memory types does the MPC885CZP133 memory controller support without external glue logic?

The MPC885CZP133 memory controller supports DRAM, SRAM, EPROM, Flash EPROM, and PCMCIA devices without external glue logic. It features programmable wait states (up to 30 per bank), variable block sizes (32 KB–256 MB), selectable write protection, and boot CS options for 8/16/32-bit memory - enabling direct connection to common NOR/NAND flash and SDRAM components used in networking equipment.