NXP Semiconductors MPC885VR133

Overview

MPC885VR133 from Freescale Semiconductor is a PowerQUICC II integrated communications processor combining a 133 MHz MPC8xx core, dual 10/100 Fast Ethernet controllers (FEC), USB 2.0 full-/low-speed host/function interface, UTOPIA L2-compliant ATM interface, and hardware security engine supporting DES/3DES, AES-128/192/256, SHA-1/256, and MD5. It targets secure broadband access gateways, DSLAMs, and enterprise edge routers requiring deterministic real-time packet processing.

For engineers reviewing the MPC885VR133 datasheet, MPC885VR133 pinout, MPC885VR133 application, or MPC885VR133 equivalent, key selection criteria include its 357-pin PBGA package, 1.8 V core / 3.3 V I/O operation, IEEE 1149.1 JTAG debug support, and verified compatibility with MPC885 family reference designs for ATM/ETH/USB co-processing.

Technical Context

The MPC885VR133 implements a unified 32-bit Power Architecture™ core with separate 8 KB instruction and 8 KB data caches (two-way set-associative), 32-entry MMU TLBs supporting 4/16/512 KB and 8 MB page sizes, and on-chip bus arbitration logic enabling glueless interfacing to DRAM, SRAM, Flash, and PCMCIA devices. Its CPM module includes 8 KB dual-port RAM and RISC-based serial DMA channels managing up to three SCCs and two SMCs.

Hardware acceleration is provided by a dedicated security engine comprising DEU (DES/3DES), AESU (AES-128/192/256), and MDEU (SHA-1/256, MD5, HMAC), all operating via crypto-channel descriptor chains with 256-byte internal buffers. The SIU integrates clock synthesizer, periodic interrupt timer, software watchdog, and reset controller - all synchronized to the 133 MHz core in 2:1 bus mode.

Key Specifications

Pinout & Package

The MPC885VR133 is housed in a 357-ball PBGA package (19 × 19 mm, 1.27 mm pitch) with thermal pad exposed on underside for board-level heat dissipation. Ball assignment follows Freescale's standard MPC885 layout per Document MPC885EC Rev. 7.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC885VR100 and MPC885VR166, the MPC885VR133 delivers optimal balance of deterministic real-time latency (critical for ATM OAM), cryptographic throughput (85 Mbps IPsec), and thermal headroom (TJ ≤ 95°C at 495 mW max) for mid-tier broadband infrastructure.

Availability

MPC885VR133 is available at Aetrix Electronics and suitable for DSLAM line cards, secure edge routers, industrial protocol gateways, and USB-based network diagnostic tools requiring stable component supply across extended product lifecycles.

Supply support for MPC885VR133 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC885VR133 belongs to the PowerQUICC II family, designed specifically for integrated communications processing in carrier-grade access equipment where deterministic packet handling, hardware security, and multi-protocol flexibility are mandatory.

FAQ

What is the maximum junction temperature specification for the MPC885VR133?

The MPC885VR133 has a maximum junction temperature (TJ) of 95°C under standard operating conditions and 100°C for extended temperature grade variants. This rating assumes natural convection cooling on a four-layer PCB with 25°C/W junction-to-ambient thermal resistance and 495 mW maximum power dissipation. Exceeding TJ(max) risks permanent degradation of cache coherency logic and MMU translation tables.

Does the MPC885VR133 support pin-compatible migration from earlier MPC8xx processors?

No, the MPC885VR133 is not pin-compatible with prior MPC8xx devices due to its 357-ball PBGA footprint, dual FEC interfaces, and integrated security engine requiring additional power and signal balls. Migration from MPC866 or MPC875 requires PCB redesign but leverages identical Power Architecture™ instruction set and compatible CPM register mapping for software reuse.

How does the MPC885VR133 handle USB suspend/resume events in host mode?

In USB host mode, the MPC885VR133 uses its SIU-integrated periodic interrupt timer to detect bus inactivity and assert SUSPEND signaling after 3 ms of no token packets. Resume is triggered by host-initiated EOP signaling, waking the CPM and re-enabling USB DMA channels within 12 µs - meeting USB 2.0 low-power requirements without firmware intervention.

Can the MPC885VR133's security engine perform concurrent DES and AES operations?

Yes, the MPC885VR133 security engine supports concurrent execution across its DEU, AESU, and MDEU units via independent crypto-channel descriptor chains. For example, it can process 3DES encryption on one data stream while computing SHA-256 hashes on another - verified in Freescale Application Note AN2493 using dual-channel DMA buffer chaining.

What boot sources are supported by the MPC885VR133 at power-on reset?

At reset, the MPC885VR133 supports booting from 8-, 16-, or 32-bit memory mapped to chip-select CS0, configurable via strap pins. Supported devices include NOR Flash (with WE/OE control), NAND Flash (via SMC), and SRAM. Boot ROM initialization code resides in on-chip mask ROM and validates checksum before loading vector table from external memory.