Monolithic Power Systems Inc. MPM3810GQB-25-P

Overview

MPM3810GQB-25-P from Monolithic Power Systems is a fixed-output 2.5V, 1.2A peak synchronous step-down DC-DC power module with integrated inductor and MOSFETs in a QFN-12 (2.5mm × 3.0mm × 0.9mm) package. It operates from 2.5V–6V input, delivers ±1.25% output accuracy at 10mA, features constant-on-time control for fast transient response, and includes power good (PG), enable (EN), and thermal shutdown protection - ideal for space-constrained portable SSD/HDD power rails.

For engineers reviewing the MPM3810GQB-25-P datasheet, MPM3810GQB-25-P pinout, MPM3810GQB-25-P application, or MPM3810GQB-25-P equivalent, key selection criteria include its 2.5V fixed output tolerance, 17μA quiescent current, 3.5MHz typical switching frequency, hiccup-mode short-circuit protection, and PG open-drain indicator with ±10% regulation window - all critical for low-power sequencing and compact point-of-load designs.

Technical Context

The MPM3810GQB-25-P implements a constant-on-time (COT) control architecture with input-voltage feedforward, enabling stable 3.5MHz switching across 2.5V–6V input while maintaining tight output regulation. Its internal 0.47μH inductor and matched 100mΩ/60mΩ P/N-channel MOSFETs form a complete buck stage with minimal external components.

It integrates EN logic-level control (1.2V high threshold), PG open-drain output with 550kΩ internal pull-up, and analog ground (AGND) separation for noise-sensitive feedback. Thermal shutdown activates at 150°C with 30°C hysteresis, and cycle-by-cycle current limiting trips at 2.1A typical to protect against overload and short-circuit faults.

Key Specifications

Pinout & Package

MPM3810GQB-25-P uses a thermally enhanced QFN-12 package (2.5mm × 3.0mm × 0.9mm) with exposed thermal pad (pins 3–4 connected internally to SW node and tied to PCB copper for heat dissipation). The package supports reflow soldering per JEDEC J-STD-020 and achieves θJA = 65°C/W on a 4-layer board.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output step-down module applications.

Compared with TSM1025-2.5 and RT6220BGQW, MPM3810GQB-25-P uniquely combines PG signaling, remote sensing, hiccup-mode protection, and 3.5MHz operation in the smallest footprint - making it optimal for space- and sequencing-critical embedded storage and portable instrumentation.

Availability

MPM3810GQB-25-P is available at Aetrix Electronics and suitable for SSD power rails, portable instrumentation, FPGA I/O banks, and space-constrained embedded systems requiring stable component supply, full lifecycle traceability, and consistent parametric performance across production lots.

Supply support for MPM3810GQB-25-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.

The MPM3810 series belongs to MPS's integrated power module product line, engineered specifically for compact, high-efficiency point-of-load conversion in portable, storage, and space-limited embedded applications - emphasizing minimal external components and robust fault protection.

FAQ

What is the recommended input capacitor for MPM3810GQB-25-P?

A 10µF X5R/X7R ceramic capacitor placed within 1mm of VIN and PGND pins is recommended for most applications. For higher output voltages or noisy input sources, a 22µF unit improves stability. An additional 0.1µF ceramic capacitor in parallel enhances high-frequency decoupling and reduces input voltage ripple.

Can MPM3810GQB-25-P operate with 100% duty cycle?

Yes - the device supports 100% duty cycle operation when input voltage approaches the output level, maintaining regulation down to VIN ≈ 2.72V at 1.2A load. This enables reliable operation in low-input scenarios such as partially discharged Li-ion batteries without dropout-induced reset events.

How does the Power Good (PG) pin function on this fixed-output variant?

PG is an open-drain output with internal 550kΩ pull-up to VIN. It asserts high when the FB node (internally tied to 2.5V output) remains within ±10% of regulation (2.25V–2.75V). If output deviates beyond that window - due to overload, short, or startup - PG pulls low, enabling system-level power sequencing and fault detection.

Is the OUT_S pin required for basic operation?

No - OUT_S is optional. When unused, connect it directly to the OUT pin. It enables remote sensing to compensate for voltage drop across PCB traces between the module and load, improving regulation accuracy to ±1% under dynamic load conditions - especially valuable in high-current or long-trace applications.

What thermal management practices are recommended for continuous 1.2A operation?

For sustained 1.2A output, use a 4-layer PCB with ≥2 oz copper on inner layers, connect the exposed thermal pad (pins 3–4) to a ≥100mm² internal copper pour, and place thermal vias (≥6× 0.3mm diameter) under the pad. This achieves ≤65°C junction rise above ambient at +25°C, staying well below the 150°C shutdown threshold.

Does MPM3810GQB-25-P require external compensation components?

No - the constant-on-time (COT) control architecture eliminates the need for external compensation networks. Loop stability is inherent to the topology, and only input/output capacitors and optional feedback resistors (not used on fixed versions) are required for full functionality.

How does hiccup-mode short-circuit protection behave during fault conditions?

Upon detecting overcurrent, the device disables the power stage, discharges the soft-start capacitor, waits ~5ms, then attempts soft-start again. If the short persists, it repeats this cycle indefinitely - limiting average power dissipation to <300mW and preventing thermal damage while allowing automatic recovery once the fault clears.