Monolithic Power Systems Inc. MPM3810GQB-P

Overview

MPM3810GQB-P from Monolithic Power Systems is a synchronous step-down DC-DC power module integrating MOSFETs and a 0.47μH inductor in a QFN-12 (2.5mm×3.0mm×0.9mm) package. It delivers up to 1.2A peak output current from 2.5V–6V input, regulates output down to 0.6V with ±2% feedback voltage accuracy (600mV typ), and features constant-on-time (COT) control for fast transient response in space-constrained portable power rails.

For engineers reviewing the MPM3810GQB-P datasheet, MPM3810GQB-P pinout, MPM3810GQB-P application, or MPM3810GQB-P equivalent, key selection criteria include its ultra-low 17μA quiescent current, integrated inductor enabling <6mm×3.8mm total solution size, EN/PG pins for sequencing, and hiccup-mode short-circuit protection - all critical for battery-powered FPGA/DSP core and I/O supply designs.

Technical Context

The MPM3810GQB-P implements constant-on-time (COT) control with input-voltage feedforward, maintaining switching frequency between 2.8MHz–4.2MHz across input and output conditions. Its internal 0.47μH inductor and dual MOSFETs (100mΩ P-FET, 60mΩ N-FET) enable high-efficiency operation in both continuous and discontinuous conduction modes.

It integrates cycle-by-cycle over-current protection (2.1A typ), thermal shutdown at 150°C with 30°C hysteresis, and a precision 0.6V reference with ±2% tolerance. The PG pin provides open-drain power-good indication with ±10% regulation window and 50μs delay, while EN enables logic-controlled startup with 1.2V threshold and 1.5μA input current.

Key Specifications

Pinout & Package

MPM3810GQB-P uses a thermally enhanced QFN-12 package (2.5mm × 3.0mm × 0.9mm) with exposed thermal pad (pins 3–4 connected internally to SW node and tied to copper pour for heat dissipation). Pin 12 (OUT_S) supports remote sensing for improved load regulation in high-current traces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous step-down module applications.

Compared with TSM1052-1.2 and RT6220BGQW, MPM3810GQB-P uniquely combines ultra-compact 2.5mm×3.0mm footprint, remote sense capability, and 17μA IQ - making it optimal for thermally constrained, multi-rail portable systems requiring precise load regulation and minimal standby drain.

Availability

MPM3810GQB-P is available at Aetrix Electronics and suitable for portable instrumentation, SSD/HDD power management, and space-limited industrial sensor nodes requiring stable component supply with full lifecycle support.

Supply support for MPM3810GQB-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with over two decades of expertise in DC-DC conversion and motor control.

The MPM3810 product line targets compact, high-efficiency power delivery for portable and embedded systems - integrating inductors and MOSFETs to eliminate layout sensitivity and accelerate time-to-market for battery-powered devices.

FAQ

What is the maximum recommended PCB copper area for the thermal pad (pins 3–4) of MPM3810GQB-P?

The thermal pad must be soldered to a minimum 25mm² exposed copper pour on the PCB's inner or bottom layer, connected via ≥4 thermal vias (0.3mm diameter) to internal ground planes. This achieves θJA ≈ 65°C/W per datasheet; reducing pad area below 15mm² risks thermal shutdown above 800mA at 60°C ambient.

Can MPM3810GQB-P operate with only ceramic capacitors, or are tantalum/electrolytic types required?

Only ceramic capacitors are required and recommended: 10μF X5R/X7R at VIN and 20μF at VOUT. Tantalum or electrolytic types are unnecessary and discouraged - their higher ESR degrades transient response and increases output ripple beyond the 15mV spec. A 0.1μF ceramic must be placed adjacent to VIN for high-frequency decoupling.

How does the OUT_S pin improve regulation accuracy, and when should it be used?

OUT_S provides remote voltage sensing at the load, compensating for IR drop in PCB traces. It should be used whenever output trace length exceeds 20mm or current exceeds 500mA - improving load regulation from ±3% (local sense) to ±0.5% (remote sense) per datasheet testing at 1A load step.

What is the minimum off-time limitation, and how does it affect light-load efficiency?

The minimum off-time is fixed at 60ns to prevent subharmonic oscillation. At light loads, this forces discontinuous conduction mode (DCM) operation, where the low-side FET turns off at zero inductor current. This reduces switching losses and achieves >85% efficiency at 10mA - critical for always-on sensor nodes.

Does the FB pin require an external capacitor for stability, and what is the recommended R1/R2 range?

No external capacitor is needed on FB - stability is inherent to the COT architecture. R1 must be 40kΩ–80kΩ (1% tolerance) to balance noise immunity and divider current; R2 is calculated as R2 = R1 × (0.6V / VOUT − 1). For 1.2V output, R1=40kΩ and R2=40kΩ yields 600mV at FB with <0.1% error.

What happens during thermal shutdown, and how does recovery work?

At 150°C junction temperature, internal thermal shutdown disables the power stage and holds EN inactive until die cools by 30°C (to 120°C). No external reset is needed - the device automatically resumes soft-start after cooldown, preventing latch-up and enabling autonomous recovery in sealed enclosures.

Is the PG pin compatible with 1.8V logic systems, and what pull-up options exist?

PG is open-drain with internal 550kΩ pull-up to VIN, so its high-level voltage equals VIN (not logic rail). To interface with 1.8V systems, add an external 10kΩ pull-up to 1.8V and use a level-shifter buffer - the internal pull-up must be disconnected via PCB cut or NC routing to avoid contention.