Monolithic Power Systems Inc. MPQ2026AGRE-0000-AEC1-P

Overview

MPQ2026AGRE-0000-AEC1-P from Monolithic Power Systems is a dual-channel, AEC-Q100 Grade 1 qualified LDO regulator with integrated asynchronous pre-boost converter, I²C interface, and 8-bit ADC for real-time voltage/current monitoring. It delivers up to 300mA per LDO channel across 1V–13.6V output range, supports 3V–40V automotive input (cold-crank to load-dump), and features OTP memory for permanent configuration storage. It is designed specifically for phantom power delivery to active antenna LNAs in ADAS camera systems.

For engineers reviewing the MPQ2026AGRE-0000-AEC1-P datasheet, MPQ2026AGRE-0000-AEC1-P pinout, MPQ2026AGRE-0000-AEC1-P application in automotive cameras or antenna power, or MPQ2026AGRE-0000-AEC1-P equivalent for AEC-Q100 LDO+pre-boost solutions, this device provides digitally configurable outputs, integrated fault detection (/FT), and thermal/short-to-battery protection - all in a wettable-flank QFN-16 package.

Technical Context

The MPQ2026A integrates two independent LDOs and an asynchronous boost pre-regulator sharing a single 40V-capable internal N-channel MOSFET (4A peak, 180mΩ R_DS(ON)). The boost operates at either 400kHz or 2.2MHz with frequency dithering to reduce EMI, and its output (6.5V–15.9V) powers the LDO inputs to maintain regulation during low-VIN conditions.

Configuration and diagnostics are handled via a 400kHz I²C interface with address-selectable ADD pin and open-drain SDA/SCL. An on-chip 8-bit capacitive charge redistribution ADC monitors both LDO output voltages and load currents, while OTP memory stores final register settings - eliminating external resistor networks and enabling production-ready calibration without hardware changes.

Key Specifications

Pinout & Package

MPQ2026AGRE-0000-AEC1-P is housed in a thermally enhanced, wettable-flank QFN-16 (4mm × 4mm) package with exposed thermal pad connected to GND. Pin 1 is marked by dot; exposed pad must be soldered to PCB ground plane for optimal thermal performance (θ_JA = 40.4°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-LDO-with-pre-boost applications.

Compared with MPQ2026AGRE-0000-AEC1-P, the MPQ2026B variant trades runtime configurability for guaranteed factory-set behavior, while the TPS650732 lacks critical automotive features - making the MPQ2026A uniquely suited for AEC-Q100-compliant, diagnosis-enabled phantom power systems.

Availability

MPQ2026AGRE-0000-AEC1-P is available at Aetrix Electronics and suitable for automotive camera modules, active antenna systems, ADAS domain controllers, and radar front-ends requiring stable component supply across extended temperature and lifetime requirements.

Supply support for MPQ2026AGRE-0000-AEC1-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs for automotive, industrial, and computing markets, with emphasis on integration, efficiency, and reliability.

The MPQ2026A belongs to MPS's automotive-grade power management portfolio, engineered specifically for functional-safety-critical ADAS subsystems requiring robustness against battery transients, real-time diagnostics, and zero-defect manufacturing compliance.

FAQ

What is the purpose of the /FT pin, and how should it be interfaced?

The /FT pin is an open-drain fault indicator that pulls low during thermal shutdown, short-to-battery events, or VIN UVLO. It requires an external pull-up resistor (e.g., 100kΩ to ≤5V). Floating or grounding /FT disables the signal. Its 40μs response time enables fast system-level fault logging, and leakage remains below 100nA at 150°C - critical for low-power wake-up monitoring.

Can the MPQ2026AGRE-0000-AEC1-P operate without the pre-boost enabled?

Yes. When VIN exceeds the pre-boost turn-on threshold (configurable 6.5V–15V), the boost stage fully disables to minimize quiescent current (35μA typ.). This makes the device suitable for nominal 12V/24V systems where LDO_IN is directly supplied - provided input voltage stays above dropout margin. The LDOs remain fully functional and I²C-configurable regardless of boost state.

How does the OTP memory interact with I²C configuration?

I²C allows full runtime register access for evaluation and tuning. Once optimal settings (V_{OUT_BOOST}, V_OUT1/2, f_SW, current limits) are validated, they are written to multi-page OTP memory - which permanently locks them at next power cycle. OTP write is one-time only and irreversible; no volatile register shadowing occurs post-OTP commit.

What is the role of the ADJ1 and ADJ2 pins in LDO operation?

ADJ1 and ADJ2 serve as reference inputs for LDO1 and LDO2, respectively. In tracking mode, they accept external voltage references or resistor dividers to set output voltages below the internal 1V minimum. If unused, they must be floated or tied to GND - leaving them unconnected risks undefined regulation behavior due to leakage paths.

Does the ADC measure load current directly, or is it derived?

The 8-bit ADC measures LDO output voltage and load current indirectly via dedicated sense resistors integrated into the LDO feedback path - not external shunts. It reports raw ADC codes corresponding to V_OUTx and I_OUTx with ±3% accuracy over −40°C to +150°C, enabling real-time health monitoring without adding board area or BOM cost.

Is the SW pin safe to leave unconnected if pre-boost is unused?

Yes. When pre-boost is disabled, the SW pin may be left floating per datasheet guidance. However, best practice is to connect SW to GND through a 100kΩ resistor to prevent noise coupling into the internal gate driver. Leaving SW completely unconnected poses no latch-up risk but may increase susceptibility to ESD-induced false triggering during handling.

What thermal derating applies above 25°C ambient?

With θ_JA = 40.4°C/W on JEDEC 4-layer board, maximum continuous power dissipation drops linearly: at 85°C ambient, PD_MAX = (150°C − 85°C) / 40.4 ≈ 1.6W. Derating curves in datasheet Figure 15 show LDO dropout voltage increases with temperature - design must ensure ≥300mV headroom at worst-case TJ = 150°C and full 300mA load.