Monolithic Power Systems Inc. MPQ6532GVE-AEC1-P

Overview

MPQ6532GVE-AEC1-P from Monolithic Power Systems is a three-phase BLDC motor pre-driver IC designed for automotive-grade motor control. It drives six N-channel MOSFETs across 5V–60V input, integrates 120° Hall-sensor commutation logic, supports 100% duty cycle via trickle-charged bootstrap, and delivers 0.8A HS source / 1A LS sink gate drive. Used in electric power steering pumps and HVAC blower actuators.

For engineers reviewing the MPQ6532GVE-AEC1-P datasheet, MPQ6532GVE-AEC1-P pinout, MPQ6532GVE-AEC1-P application, or MPQ6532GVE-AEC1-P equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, configurable dead-time (700ns–5.7µs), VDS-based short-circuit protection with 3µs deglitch, LSS current-limit threshold (0.4–0.6V), and thermal shutdown at 190°C.

Technical Context

The MPQ6532GVE-AEC1-P implements integrated 120° commutation using three Hall sensor inputs (HA/HB/HC) with internal pull-down resistors, enabling direct interface to standard BLDC motor position sensors. Its gate drive architecture combines a regulated charge pump (VREG = 9.5–13V) for low-side drivers and bootstrap circuits (BSTA/BSTB/BSTC) with active trickle-charge to sustain high-side drive during 100% duty cycle operation.

Safety logic includes dual over-current detection: VDS sensing for short-circuit protection (SCP) triggered when drain-source voltage exceeds OC_REF (0.125–2.4V), and LSS shunt-based OCP with fixed 70µs off-time and 1µs HS minimum on-time. Fault reporting is handled via open-drain nFAULT with automatic latch-off until reset by nSLEEP or VIN UVLO recovery.

Key Specifications

Pinout & Package

MPQ6532GVE-AEC1-P uses a thermally enhanced QFN-28 (4mm × 5mm) package with wettable flank and exposed thermal pad connected to GND. The 28-pin layout supports full three-phase gate drive, Hall sensor interface, fault signaling, and programmable protection functions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase BLDC pre-driver applications.

Compared with DRV8305-Q1 and MC33883, MPQ6532GVE-AEC1-P uniquely combines AEC-Q100 Grade 1 qualification, 5V–60V operation, Hall-integrated 120° commutation, and trickle-charged bootstrap in a single QFN-28 package-reducing system-level component count and PCB area while maintaining automotive thermal and fault robustness.

Availability

MPQ6532GVE-AEC1-P is available at Aetrix Electronics and suitable for automotive HVAC blowers, EPS assist pumps, front grille shutter actuators, and active suspension damping valves requiring stable component supply across extended temperature and lifecycle demands.

Supply support for MPQ6532GVE-AEC1-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.

The MPQ6532 product line targets automotive-grade motor control applications, delivering integrated pre-driver functionality-including Hall commutation, gate drive, and fault protection-to simplify adoption in safety-critical electromechanical systems.

FAQ

What is the purpose of the trickle-charge circuit in MPQ6532GVE-AEC1-P?

The trickle-charge circuit maintains bootstrap capacitor (CBST) voltage during sustained high-side conduction, enabling true 100% duty cycle operation without external charge-pump ICs. It supplies ~5µA to counter leakage, ensuring reliable HS-FET gate drive even when LS-FETs remain off for extended periods-critical for holding torque in automotive actuators.

How does the MPQ6532GVE-AEC1-P implement short-circuit protection?

It uses VDS sensing on each MOSFET: when drain-to-source voltage exceeds the OC_REF reference (0.125–2.4V), a 3µs deglitched comparator triggers immediate gate drive disable and pulls nFAULT low. The device remains latched off until reset by nSLEEP deassertion or VIN UVLO recovery-preventing repeated fault cycling during persistent shorts.

Can MPQ6532GVE-AEC1-P operate without Hall sensors?

No-its commutation logic is hardwired for 120° Hall-input sequencing. Pins HA/HB/HC are mandatory inputs with internal pull-downs; floating them causes undefined behavior. For sensorless operation, an external MCU or dedicated sensorless driver IC is required upstream of the MPQ6532GVE-AEC1-P gate outputs.

What is the role of the LSS pin, and how is over-current protection set?

LSS is the low-side current-sense input. An external shunt resistor between LSS and the MOSFET source sets OCP threshold: VLSS-OCP = 0.4–0.6V defines the voltage trip point. When exceeded, the HS-FET turns off and LS-FET turns on for 70µs fixed off-time-limiting motor stall current without requiring external comparators or timers.

Is the DT pin compatible with standard resistor values for common dead-time requirements?

Yes-DT uses linear scaling: tDEAD (ns) ≈ 60 × RDT (kΩ). A 10kΩ resistor yields ~600ns (suitable for 100V-class MOSFETs), 20kΩ gives ~1.2µs (typical for 60V automotive systems), and 100kΩ achieves 5.7µs (for slower, high-RDS(ON) devices). Values are verified per datasheet Equation (1) and validated across temperature.

Does MPQ6532GVE-AEC1-P support both 3.3V and 5V logic interfaces?

Yes-input thresholds are VIL ≤ 0.8V and VIH ≥ 2.0V, accommodating both 3.3V and 5V CMOS logic families. All digital inputs (PWM, DIR, nBRAKE, nSLEEP, HA/HB/HC) have internal 880kΩ pull-downs, eliminating need for external biasing in most MCU interfacing scenarios.

What thermal derating applies to the QFN-28 package at elevated ambient temperatures?

With θJA = 40°C/W on a 4-layer PCB, maximum continuous power dissipation drops from 3.1W at 25°C to ~1.5W at 85°C ambient. Derating follows PD(MAX) = (150°C − TA)/40. Thermal pad soldering and copper pour area directly impact achievable power handling-designers must follow MPS layout guidelines for GND pad thermal vias and plane coverage.