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NXP Semiconductors MRF1513NT1

Part No.:
MRF1513NT1
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
PLD-1.5
Datasheet:
AetrixMRF1513NT1.pdf
Description:
RF MOSFET LDMOS 12.5V PLD-1.5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,906

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Product details

Overview

MRF1513NT1 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for broadband common-source amplifier applications in VHF/UHF portable and mobile FM equipment. It delivers 3 W output power at 520 MHz with 15 dB power gain and 65% drain efficiency under 12.5 Vdc operation, and is rated for 20:1 VSWR tolerance at 15.5 Vdc.

For engineers reviewing the MRF1513NT1 datasheet, MRF1513NT1 pinout, MRF1513NT1 application, or MRF1513NT1 equivalent, this page provides verified thermal resistance (4°C/W), gate threshold voltage (1.7 V typ), input/output capacitance (33 pF / 16.5 pF), and large-signal impedance data across 135–520 MHz bands - critical for RF PA design, impedance matching, and ruggedized transmitter staging.

Technical Context

This device operates as a surface-mount, common-source RF power amplifier with lateral MOSFET architecture optimized for broadband VHF/UHF amplification. Its specified performance at 520 MHz includes 3 W POUT, 15 dB Gps, and 65% ηD under 12.5 Vdc/50 mA IDQ, with characterized S-parameters up to 1 GHz and series-equivalent Zin/ZOL* across three frequency bands (135–175 MHz, 400–470 MHz, 450–520 MHz).

Thermal management relies on direct source-pad contact to heatsink (RθJC = 4°C/W), and stability is addressed via gate-series RC network (15 Ω + 130 pF) per test fixture. The PLD-1.5 plastic package supports automated pick-and-place and meets MSL Level 3 per JESD22-A113.

Key Specifications

ParameterValue and Actual Design Meaning
Output Power3 W at 520 MHz, 12.5 Vdc - sufficient for Class AB FM transmitter final stages in portable/mobile radios
Power Gain15 dB at 520 MHz - enables single-stage amplification without cascaded gain blocks
Drain Efficiency65% at 520 MHz - reduces thermal load and extends battery life in 12.5 V systems
VSWR Tolerance20:1 at 520 MHz, 15.5 Vdc, 2 dB overdrive - ensures survivability under antenna mismatch conditions
Thermal ResistanceRθJC = 4°C/W - requires ≥65% of 0.065″ × 0.180″ source pad area in direct thermal contact with heatsink
Input CapacitanceCiss = 33 pF at 1 MHz - defines low-pass filtering and matching network reactance at VHF/UHF
Gate ThresholdVGS(th) = 1.7 V typ - sets minimum gate bias for reliable turn-on in DC-coupled bias networks

Pinout & Package

Package: PLD-1.5 plastic surface-mount package (Case 466-03, Style 1), dimensions 0.260″ × 0.235″ × 0.072″ (6.60 × 5.97 × 1.83 mm), MSL Level 3, RoHS-compliant (N suffix), supplied in 12 mm tape/reel (T1 = 1,000 units).

Pin/TerminalCircuit RoleDesign Meaning
1. DrainRF power output nodeHigh-current RF path requiring low-inductance layout and thermal via array to internal copper plane
2. GateControl electrodeCapacitive input (Ciss = 33 pF); must be DC-biased above VGS(th) and protected against transients via external Zener or RC snubber
3. SourceCommon reference terminalPrimary thermal path - entire bottom-side source metallization (0.065″ × 0.180″) must contact heatsink for RθJC = 4°C/W
4. SourceSecondary source connectionRedundant thermal and current return path; electrically tied to Pin 3 internally; must be soldered to same ground plane

Key Features

FeatureDesign Value
High VSWR ruggednessWithstands 20:1 mismatch at full RF power without degradation - eliminates need for external circulators in mobile radio PAs
Thermal stabilityPositive temperature coefficient of VDS(on) prevents thermal runaway during high-power operation
Large-signal impedance dataZin and ZOL* provided for 135–520 MHz - enables first-pass matching network design without EM simulation
Lead-free terminationN suffix confirms RoHS compliance and Pb-free plating - satisfies global environmental compliance requirements
Automated assembly supportTape-and-reel packaging (T1) and PLD-1.5 footprint compatible with standard SMT pick-and-place equipment

Applications

FM Transmitter Final StageLand Mobile Radio PA

Use Scenario: Final RF power amplifier in 12.5 V mobile FM transceivers operating at 450–520 MHz.

IC Role / Device Role / Timing Role: Common-source power switch delivering 3 W output with 15 dB gain and 65% efficiency.

Use Value: Eliminates need for driver stage due to high gain; 20:1 VSWR tolerance protects against antenna detuning during vehicle motion.

Use Scenario: Portable two-way radio amplifier operating at 135–175 MHz with battery-powered 7.5 V supply.

IC Role / Device Role / Timing Role: Broadband RF power transistor biased at 50 mA IDQ for linear FM modulation.

Use Value: Delivers 3 W output with >60% efficiency across full band; thermal stability prevents gain shift during extended transmission.

VHF Broadcast Auxiliary LinkUHF Public Safety Repeater

Use Scenario: Low-power broadcast auxiliary link transmitter (400–470 MHz) requiring high reliability and minimal heat dissipation.

IC Role / Device Role / Timing Role: Single-ended Class AB amplifier with fixed 12.5 Vdc rail and gate-bias network.

Use Value: 4°C/W junction-to-case thermal resistance enables compact heatsinking; characterized Zin/ZOL* simplifies impedance matching for FCC-certified designs.

Use Scenario: UHF repeater output stage operating continuously at ambient temperatures up to 70°C.

IC Role / Device Role / Timing Role: Ruggedized RF power MOSFET handling intermittent high-SWR loads in base station infrastructure.

Use Value: Proven 20:1 VSWR capability avoids failure during antenna fault events; MTTF calculator support enables lifetime prediction under real-world thermal stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MRF1513NNo tape-and-reel (bulk) packaging; identical electrical specs and PLD-1.5 package; lacks T1 suffixNot suitable for automated SMT production; requires manual placement or tube-to-tape conversionSelect MRF1513NT1 for volume manufacturing; use MRF1513N only for prototyping or low-volume hand-soldered builds
MRF1517NT1Higher POUT (7 W at 520 MHz), higher VDSS (+65 V), same PLD-1.5 package and pinoutRequires redesigned output matching network and increased heatsink capacity; not drop-in for 3 W designsChoose MRF1517NT1 only when scaling output power beyond 3 W while retaining board space and thermal interface constraints

Compared with MRF1513N and MRF1517NT1, the MRF1513NT1 uniquely balances tape-and-reel manufacturability, 3 W output capability, and proven 20:1 VSWR ruggedness - making it optimal for cost-sensitive, high-reliability VHF/UHF portable radio PAs where thermal margin and assembly automation are critical.

Availability

MRF1513NT1 is available at Aetrix Electronics and suitable for FM transmitter final stages, land mobile radio power amplifiers, and UHF public safety repeaters requiring stable component supply, RoHS compliance, and automated SMT assembly support.

Supply support for MRF1513NT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of RF power transistors for wireless infrastructure, automotive, and industrial communications.

The MRF1513NT1 belongs to Freescale's lateral RF power MOSFET product line, engineered specifically for rugged, high-efficiency VHF/UHF amplifier applications in portable and mobile radio equipment.

FAQ

What is the maximum continuous drain current rating for the MRF1513NT1?

The MRF1513NT1 has a maximum continuous drain current (ID) rating of 2 A at TC = 25°C. This rating assumes proper heatsinking to maintain case temperature within limits; derating applies above 25°C at 0.25 W/°C. The device is typically operated at 50 mA quiescent current (IDQ) for Class AB amplifier applications, as characterized in the datasheet for 3 W output at 520 MHz.

Does the MRF1513NT1 include integrated gate protection?

No, the MRF1513NT1 does not include internal monolithic gate protection. Its gate is electrically isolated by oxide and susceptible to ESD damage. Freescale explicitly recommends external gate protection - such as a zener diode from gate to source - and cautions against floating gate nodes. The MRF1513NT1 gate leakage is ≤1 μA at 10 Vdc, and absolute maximum VGS is ±20 Vdc; exceeding this risks permanent oxide breakdown.

What is the recommended gate bias network for MRF1513NT1 in a 12.5 Vdc amplifier?

The MRF1513NT1 is characterized at IDQ = 50 mA with VDD = 12.5 Vdc, requiring a gate-source voltage of approximately 2.5–3.0 Vdc. A simple resistive divider (e.g., 33 kΩ from VGG to gate, 15 Ω from gate to source) is recommended, as used in Freescale's test fixture. The gate draws negligible DC current, so bias stability depends on minimizing leakage paths and ensuring the gate is never left floating - especially during power-up/down sequences.

Can the MRF1513NT1 be used at frequencies below 135 MHz or above 520 MHz?

The MRF1513NT1 is characterized and specified for operation from 135 MHz to 520 MHz, with full performance data (gain, efficiency, Zin/ZOL*, S-parameters) provided across those bands. While functional operation may extend beyond this range, Freescale does not guarantee performance outside 135–520 MHz. At lower frequencies, parasitic inductance dominates; above 520 MHz, gain and efficiency roll off significantly - e.g., S21 drops to 1.55 @ 600 MHz (12.5 Vdc, 50 mA IDQ), indicating marginal usability beyond 520 MHz.

How is thermal performance validated for the MRF1513NT1 in production designs?

Thermal performance of the MRF1513NT1 is validated using its specified junction-to-case thermal resistance (RθJC = 4°C/W), which assumes ≥65% of the 0.065″ × 0.180″ source pad area is in intimate thermal contact with a heatsink. Designers must verify actual case temperature (TC) under worst-case operating conditions using thermocouples or IR imaging, ensuring TJ ≤ 150°C. Freescale provides MTTF calculators and AN4005/D for mounting methodology - critical because insufficient thermal contact increases RθJC and accelerates electromigration failure.

MRF1513NT1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
PLD-1.5
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
520MHz
Gain:
15dB
Voltage - Test:
12.5 V
Current Rating (Amps):
2A
Noise Figure:
-
Current - Test:
50 mA
Power - Output:
3W
Voltage - Rated:
40 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PLD-1.5

MRF1513NT1 FAQ

1.How can I place an order for MRF1513NT1 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF1513NT1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF1513NT1 reliable?

The price and inventory of MRF1513NT1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF1513NT1 is usually 5 days.

3.What payment methods are accepted for MRF1513NT1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF1513NT1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF1513NT1?

MRF1513NT1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF1513NT1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF1513NT1?

For technical support, including MRF1513NT1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF1513NT1 requirements.

6.How does Aetrix verify that MRF1513NT1 is sourced from the original manufacturer or authorized distributors?

All MRF1513NT1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF1513NT1 meets industry standards.

7.What is the process for return or replacement of MRF1513NT1?

All MRF1513NT1 units undergo pre-shipment inspection (PSI). If there is an issue with MRF1513NT1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF1513NT1 part is unused and in its original packaging.

Return procedure for MRF1513NT1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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