Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MRF18060ALR3

Part No.:
MRF18060ALR3
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
SOT-957A
Datasheet:
AetrixMRF18060ALR3.pdf
Description:
RF MOSFET LDMOS 26V NI780
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,315

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MRF18060ALR3 from Freescale Semiconductor is an internally matched N-channel enhancement-mode lateral RF power MOSFET designed for GSM 1805–1880 MHz base station amplifiers. It delivers 60 W CW output power at 26 Vdc, achieves 13 dB typical power gain and 45% drain efficiency, and withstands 10:1 VSWR under full-load conditions-enabling robust operation in PCN/PCS and WLL transmitter stages.

For engineers reviewing the MRF18060ALR3 datasheet, MRF18060ALR3 pinout, MRF18060ALR3 application, or MRF18060ALR3 equivalent, key selection criteria include its 1805–1880 MHz frequency coverage, 0.97 °C/W junction-to-case thermal resistance, RoHS-compliant NI-780 package, and integrated ESD protection rated to Class 2 HBM.

Technical Context

This device operates as a common-source RF power amplifier stage in Class AB configuration, optimized for linear multicarrier signal handling in TDMA, CDMA, and FM systems. Its internal input/output matching network eliminates external tuning components across the full GSM1800 band, while the lateral MOSFET architecture ensures stable gain flatness and low insertion phase variation.

Thermal design is enabled by direct case mounting to heatsinks via the metal flange (Case 465-06), with maximum junction temperature rated at 200°C and derating starting above 25°C ambient. The gate threshold voltage range (2–4 Vdc) and quiescent gate voltage (2.5–4.5 Vdc at 500 mA IDQ) support precise bias control for linearity-critical applications.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range1805–1880 MHz - Fully specified and characterized for GSM1800 base station transmitters.
Output Power60 W CW - Delivered into 50 Ω load at 26 Vdc supply and 500 mA quiescent drain current.
Power Gain13 dB typical - Measured under full-band 60 W CW conditions; enables single-stage PA design.
Drain Efficiency45% typical - Reduces thermal load and DC power consumption in high-duty-cycle base station operation.
VSWR Tolerance10:1 @ 1840 MHz, 60 W CW - Ensures ruggedness against antenna mismatch without external circulator.
Thermal Resistance0.97 °C/W - Enables compact heatsink design with predictable junction temperature rise.
ESD RatingHBM Class 2 (≥2 kV) - Integrated protection reduces need for external transient suppression.

Pinout & Package

Package: NI-780 (Case 465-06, Style 1), metal-ceramic flanged package with solderable leads and gold-plated terminals (40 μ″ nominal). Flange serves as thermal and electrical ground reference.

Pin/Terminal Circuit Role Design Meaning
1. DrainRF Power Output TerminalHigh-current RF output node; electrically and thermally connected to flange; requires low-inductance RF grounding.
2. GateRF Input Control TerminalHigh-impedance control node; biased at 2.5–4.5 Vdc for 500 mA IDQ; sensitive to ESD and layout parasitics.
3. SourceRF Return & Bias ReferenceCommon return path for RF and DC; tied directly to flange ground; critical for stability and thermal conduction.

Key Features

Feature Design Value
Internally Matched I/OEliminates discrete matching networks across 1805–1880 MHz, reducing BOM count and layout sensitivity.
High LinearitySupports multicarrier GSM signals with low ACPR and IMD3, verified at 60 W CW output.
Thermal StabilityStable gain and efficiency over TC = 25–150°C; enables reliable operation in uncooled outdoor enclosures.
Low Gold Plating40 μ″ nominal on leads - balances solderability, wire-bond compatibility, and cost for high-volume RF assembly.
Tape & Reel PackagingR3 suffix = 250 units per 56 mm, 13-inch reel - supports automated SMT placement in RF power module production.

Applications

GSM Base Station Transmitter Wireless Local Loop (WLL) Amplifier

Use Scenario: Final-stage power amplification in macrocell BTS operating in 1805–1880 MHz band with 60 W peak envelope power requirement.

IC Role / Device Role / Timing Role: High-efficiency, high-linearity RF power MOSFET operating in Class AB mode with internal impedance matching.

Use Value: Delivers 45% efficiency and 13 dB gain without external tuning, reducing board space and calibration complexity in multi-carrier deployments.

Use Scenario: Outdoor point-to-multipoint base station amplifier for fixed wireless access in licensed 1.8 GHz spectrum.

IC Role / Device Role / Timing Role: Ruggedized RF power transistor capable of sustained 10:1 VSWR operation without damage or performance degradation.

Use Value: Eliminates need for external circulators or isolators in antenna-feeder mismatch scenarios, lowering system BOM and failure risk.

TDMA/CDMA Cellular Infrastructure FM Broadcast Auxiliary Link

Use Scenario: Linear PA stage in legacy TDMA or CDMA base stations requiring broadband 1800–2000 MHz coverage at 60 W.

IC Role / Device Role / Timing Role: Laterally diffused MOSFET with flat gain response and low Crss (2.7 pF) to maintain intermodulation performance.

Use Value: Maintains EVM and ACLR compliance across wide instantaneous bandwidths without per-channel predistortion tuning.

Use Scenario: High-reliability studio-transmitter link (STL) amplifier for FM broadcast auxiliary transmission at 1800–1900 MHz.

IC Role / Device Role / Timing Role: Thermally stable RF power device with 200°C max junction rating for continuous-duty air-cooled operation.

Use Value: Supports 24/7 operation in remote sites with minimal thermal management overhead and no active cooling required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF18060ALSR3Different package: NI-780S (Case 465A-06), smaller body dimension (A = 0.805–0.815″ vs. 1.335–1.345″), same electrical specs and pinout.Preferred for space-constrained modules where footprint reduction is critical; identical thermal and RF performance.Select MRF18060ALSR3 when PCB area is limited but same 60 W GSM1800 performance is required.
PD57060-ESTMicroelectronics 60 W LDMOS; 1805–1880 MHz; 12.5 dB gain, 42% efficiency; TO-270WB-4 package with different pin assignment.Requires redesign of gate bias network and output matching; not pin-compatible; higher Crss (4.5 pF) affects wideband linearity.Consider PD57060-E only if sourcing diversification is needed and layout revision is acceptable.

Compared with MRF18060ALSR3, the MRF18060ALR3 offers identical RF performance in a larger NI-780 package better suited for high-power thermal dissipation; versus PD57060-E, it provides superior gain flatness and lower reverse transfer capacitance but requires Freescale-specific biasing and layout practices.

Availability

MRF18060ALR3 is available at Aetrix Electronics and suitable for GSM base station transmitters, wireless local loop (WLL) infrastructure, and TDMA/CDMA cellular radio applications requiring stable component supply, long-lifecycle support, and traceable RF power transistor sourcing.

Supply support for MRF18060ALR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of high-performance RF power transistors for wireless infrastructure, emphasizing ruggedness, linearity, and thermal reliability.

The MRF18060ALR3 belongs to Freescale's MRF180xx family of laterally diffused MOSFETs, engineered specifically for 1.8–2.0 GHz base station amplifiers demanding high efficiency, VSWR tolerance, and stable multicarrier operation.

FAQ

What is the maximum junction temperature rating for the MRF18060ALR3?

The MRF18060ALR3 has a maximum operating junction temperature (TJ) of 200°C, as specified in Table 1 of the Freescale datasheet. This rating enables reliable continuous-wave operation in high-ambient environments such as outdoor base station cabinets, provided the thermal interface between the NI-780 flange and heatsink maintains the calculated junction temperature below this limit using the 0.97 °C/W RθJC value.

Does the MRF18060ALR3 require external input or output matching components?

No, the MRF18060ALR3 is internally matched for both input and output across the full 1805–1880 MHz GSM band, as confirmed in the "Features" section and Table 4 notes. This eliminates the need for external matching networks in standard 50 Ω systems, simplifying PCB layout and improving batch-to-batch consistency-though external harmonic filtering may still be required depending on regulatory compliance needs.

What is the gate threshold voltage range for the MRF18060ALR3?

The MRF18060ALR3 has a gate threshold voltage (VGS(th)) range of 2–4 Vdc, measured at VDS = 10 Vdc and ID = 300 μAdc (Table 4). This parameter defines the minimum gate voltage required to initiate conduction and informs bias network design-especially important for setting stable 500 mA IDQ in Class AB operation while maintaining linearity and efficiency.

How does the MRF18060ALR3 handle load mismatches in real-world antenna systems?

The MRF18060ALR3 is rated to withstand 10:1 VSWR at 1840 MHz, 26 Vdc, and 60 W CW output power without damage or parametric shift. This ruggedness stems from its lateral MOSFET structure and integrated ESD protection, allowing safe operation during antenna detuning, cable faults, or environmental impedance shifts-reducing reliance on external circulators in cost-sensitive WLL and small-cell deployments.

What packaging format is used for the MRF18060ALR3, and how many units are included per reel?

The MRF18060ALR3 is supplied in tape-and-reel format with the "R3" suffix indicating 250 units per 56 mm width, 13-inch diameter reel, as stated in the Features section. This packaging supports automated pick-and-place assembly in high-volume RF power module manufacturing, and the NI-780 metal-ceramic package is compatible with standard reflow or soldering processes for flange-mounted devices.

MRF18060ALR3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SOT-957A
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
1.81GHz ~ 1.88GHz
Gain:
13dB
Voltage - Test:
26 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
500 mA
Power - Output:
60W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-780H-2L

MRF18060ALR3 FAQ

1.How can I place an order for MRF18060ALR3 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF18060ALR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF18060ALR3 reliable?

The price and inventory of MRF18060ALR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF18060ALR3 is usually 5 days.

3.What payment methods are accepted for MRF18060ALR3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF18060ALR3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF18060ALR3?

MRF18060ALR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF18060ALR3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF18060ALR3?

For technical support, including MRF18060ALR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF18060ALR3 requirements.

6.How does Aetrix verify that MRF18060ALR3 is sourced from the original manufacturer or authorized distributors?

All MRF18060ALR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF18060ALR3 meets industry standards.

7.What is the process for return or replacement of MRF18060ALR3?

All MRF18060ALR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF18060ALR3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF18060ALR3 part is unused and in its original packaging.

Return procedure for MRF18060ALR3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF18060ALR3 Tags

  • MRF18060ALR3
  • MRF18060ALR3 PDF
  • MRF18060ALR3 Datasheet
  • MRF18060ALR3 Specifications
  • MRF18060ALR3 Images
  • NXP Semiconductors
  • NXP Semiconductors MRF18060ALR3
  • Buy MRF18060ALR3
  • MRF18060ALR3 Price
  • MRF18060ALR3 Distributor
  • MRF18060ALR3 Supplier
  • MRF18060ALR3 Wholesale
Related Products
3SK294(TE85L,F)
3SK294(TE85L,F)

Toshiba Semiconductor and Storage

SAV-551+
SAV-551+

Mini-Circuits

TAV2-501+
TAV2-501+

Mini-Circuits

CE3514M4-C2
CE3514M4-C2

CEL

AFT05MS004NT1
AFT05MS004NT1

NXP USA Inc.

SAV-541+
SAV-541+

Mini-Circuits

CE3512K2-C1
CE3512K2-C1

CEL

AFM907NT1
AFM907NT1

NXP Semiconductors

SKY65050-372LF
SKY65050-372LF

Skyworks Solutions Inc.

CE3520K3-C1
CE3520K3-C1

CEL

AFT09MS007NT1
AFT09MS007NT1

NXP USA Inc.

AFT09MS015NT1
AFT09MS015NT1

NXP USA Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER