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NXP Semiconductors MRF19030LR5

Part No.:
MRF19030LR5
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-400
Datasheet:
AetrixMRF19030LR5.pdf
Description:
RF MOSFET LDMOS 26V NI400
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,273

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Product details

Overview

MRF19030LR5 from NXP Semiconductors (formerly Freescale) is an N-channel enhancement-mode lateral RF power MOSFET designed for class AB base station amplifiers in PCN/PCS bands. It delivers 30 W PEP output at 1930–1990 MHz with 13 dB typical two-tone power gain, 36% drain efficiency, and −31 dBc third-order IMD under 26 Vdc bias and 300 mA quiescent current.

For engineers reviewing the MRF19030LR5 datasheet, MRF19030LR5 pinout, MRF19030LR5 application, or MRF19030LR5 equivalent, this device is selected for high-linearity multicarrier RF power stages in FM, TDMA, CDMA, and LTE-adjacent infrastructure where thermal stability, internal input/output matching, and 10:1 VSWR ruggedness are critical design requirements.

Technical Context

This device operates as a common-source RF power amplifier stage with internally matched 50 Ω input and output networks optimized for 1930–1990 MHz. Its lateral MOSFET architecture enables excellent phase flatness and thermal stability, supported by a low RθJC of 2.1 °C/W and rated junction temperature of 200 °C.

It is characterized using series-equivalent large-signal impedance parameters (e.g., Zsource = 10.47 − j7.21 Ω at 1960 MHz; Zload = 5.84 − j4.67 Ω), enabling accurate broadband matching network design. ESD protection meets HBM Class 2 and MM Class M3 standards.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 1930–1990 MHz - Validated bandwidth for PCS base station transmit stages with stable gain and linearity.
Output Power (PEP) 30 W - Sustained peak envelope power capability under two-tone test conditions (100 kHz spacing).
Power Gain 13 dB typ. - Measured in common-source configuration with 50 Ω system; enables reduced driver stage complexity.
Drain Efficiency 36% typ. - Achieved at 30 W PEP and 26 Vdc supply; reduces thermal load and power supply sizing.
Third-Order IMD −31 dBc typ. - At 30 W PEP, indicating suitability for multicarrier CDMA/LTE signal amplification without excessive spectral regrowth.
VSWR Tolerance 10:1 @ 1960 MHz, 26 Vdc, 30 W CW - Confirmed ruggedness against antenna mismatch without device failure.
Junction Temp. Rating 200 °C - Enables operation in high-ambient telecom enclosures with margin for transient thermal excursions.
Thermal Resistance 2.1 °C/W (Junction-to-Case) - Supports direct mounting to heatsink; simplifies thermal interface design.

Pinout & Package

Package: NI-400 (Case 465E-04, Style 1), hermetically sealed ceramic/metal flange-mount package with solderable leads. Dimensions: 20.19 × 9.65 × 4.14 mm (L × W × H), flange thickness 1.45–1.70 mm.

Pin/Terminal Circuit Role Design Meaning
1. Drain RF Power Output Terminal High-current RF output node; electrically connected to metal flange for thermal and RF grounding; requires low-inductance connection to output matching network.
2. Gate RF Signal Input Control High-impedance control terminal; biased via external network; integrated ESD protection limits gate oxide stress during handling and operation.
3. Source Common Reference / RF Return Path DC and RF return path; tied directly to flange ground plane; critical for stable biasing and minimizing source inductance in high-frequency operation.

Key Features

Feature Design Value
Internally Matched I/O Input and output networks integrated into package - eliminates discrete matching components at 1930–1990 MHz, reducing board area and tuning effort.
High Linearity −31 dBc IMD3 at 30 W PEP - Enables clean amplification of CDMA/LTE multicarrier signals without adjacent channel interference.
Rugged VSWR Handling 10:1 tolerance at full 30 W CW - Protects amplifier stage during antenna detuning or fault conditions without derating or shutdown circuitry.
Thermal Stability RθJC = 2.1 °C/W + TJ = 200 °C rating - Maintains gain and efficiency across −40 °C to +105 °C case temperature range in outdoor base stations.
ESD Protection HBM Class 2 / MM Class M3 - Ensures robustness during PCB assembly and field maintenance without additional external protection.
RoHS Compliant Lead-free terminations with 40 μ″ nominal gold plating - Meets environmental compliance for global telecom equipment deployment.

Applications

CDMA Base Station Transmitter LTE-FDD Remote Radio Head

Use Scenario: Final PA stage in macrocell BTS operating in PCS band (1930–1990 MHz) with IS-95 forward link modulation.

IC Role / Device Role / Timing Role: High-efficiency, high-linearity RF power amplifier delivering 30 W PEP to antenna feedline.

Use Value: Delivers −31 dBc IMD3 and 36% efficiency at 30 W, meeting ACPR and spectral mask requirements for CDMA pilot and traffic channels.

Use Scenario: Transmit chain in compact RRH units requiring high power density and thermal resilience in confined enclosures.

IC Role / Device Role / Timing Role: Final-stage RF power MOSFET with integrated matching and 2.1 °C/W thermal resistance.

Use Value: Enables 30 W output with minimal heatsink volume due to low RθJC, supporting fanless RRH designs in harsh ambient environments.

FM Broadcast Auxiliary Link TDMA Infrastructure Repeater

Use Scenario: High-reliability microwave link transmitter for studio-to-transmitter (STL) applications in 1960 MHz band.

IC Role / Device Role / Timing Role: Linear RF power amplifier with 10:1 VSWR tolerance protecting against antenna cable faults.

Use Value: Eliminates need for circulators or VSWR protection circuits, reducing BOM count and improving link uptime in remote sites.

Use Scenario: Bidirectional repeater PA in public safety TDMA networks operating at 1930 MHz with strict intermodulation limits.

IC Role / Device Role / Timing Role: Class AB RF power transistor delivering 30 W PEP with −28 dBc min IMD3 across band edge frequencies.

Use Value: Meets FCC Part 90 spectral purity requirements while maintaining >12 dB gain across 1930–1990 MHz without external tuning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF19030LSR5 Same die, NI-400S package (Case 465F-04); identical electrical specs but different flange geometry and lead pitch. Requires PCB footprint revision; suited for space-constrained modules where lower profile or alternate thermal interface is needed. Select MRF19030LSR5 only when mechanical integration with NI-400S land pattern is required; not drop-in compatible with MRF19030LR5 layout.
PD57018-E 18 W PEP, 28 V, 1800–2200 MHz; GaN HEMT with higher gain (15 dB) but lower ruggedness (6:1 VSWR). Better efficiency (55%) but narrower safe operating area; requires external ESD protection and precise gate bias control. Choose PD57018-E for new designs prioritizing efficiency over ruggedness; MRF19030LR5 remains preferred for legacy base station upgrades demanding proven VSWR tolerance.

Compared with MRF19030LSR5, MRF19030LR5 offers identical RF performance but requires the NI-400 footprint; versus PD57018-E, it trades 12 W lower PEP for superior 10:1 VSWR survivability and simplified biasing-critical for field-deployed infrastructure where reliability outweighs peak efficiency.

Availability

MRF19030LR5 is available at Aetrix Electronics and suitable for PCS base station transmitters, remote radio heads, and TDMA repeaters requiring stable component supply, long-lifecycle support, and RoHS-compliant RF power solutions.

Supply support for MRF19030LR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with deep heritage in RF power from its Freescale acquisition.

The MRF19030LR5 belongs to NXP's legacy RF Power Lateral MOSFET product line, engineered specifically for high-reliability, high-linearity cellular infrastructure amplifiers operating in licensed 1.9 GHz bands.

FAQ

What is the maximum continuous drain current rating for MRF19030LR5?

The MRF19030LR5 does not specify a maximum continuous drain current (ID) rating in its datasheet. Instead, it defines safe operating limits via total device dissipation (83.3 W at TC = 25°C, derated 0.48 W/°C above), drain-source voltage (−0.5 to +65 Vdc), and junction temperature (200 °C). Actual current depends on bias point, thermal management, and RF loading-designers must verify ID under operating conditions using measured VDS and PD.

Does MRF19030LR5 require external matching components for 1960 MHz operation?

No, MRF19030LR5 is internally matched for both input and output at 1930–1990 MHz. Its datasheet confirms integrated matching networks, and Figure 9 provides series-equivalent source/load impedances (e.g., Zsource = 10.47 − j7.21 Ω at 1960 MHz) for designing external broadband matching if needed-but basic operation requires only DC blocking and bias chokes per the reference schematic in Figure 1.

What is the gate threshold voltage range for MRF19030LR5?

The gate threshold voltage (VGS(th)) for MRF19030LR5 is specified as 2–4 Vdc (min–max) at VDS = 10 Vdc and ID = 100 μAdc. This range reflects process variation and ensures reliable turn-on across temperature and unit-to-unit spread in class AB bias networks.

Can MRF19030LR5 be used in pulsed RF applications?

Yes, MRF19030LR5 supports pulsed operation, as confirmed by its 30 W CW rating and 10:1 VSWR tolerance at CW power. While the datasheet emphasizes class AB continuous-wave performance, its lateral MOSFET structure, 200 °C TJ rating, and thermal resistance (2.1 °C/W) make it suitable for radar or burst-mode applications-provided pulse width, duty cycle, and average power remain within the device's safe operating area defined by RθJC and TJ limits.

Is MRF19030LR5 pin-compatible with MRF19030LR3?

Yes, MRF19030LR5 and MRF19030LR3 share identical NI-400 (Case 465E-04) packaging, pinout (Drain–Gate–Source), and mechanical dimensions. The "R5" and "R3" suffixes denote tape-and-reel quantities (500 vs. 250 units per reel) and do not indicate electrical or physical differences-the devices are functionally and mechanically interchangeable in existing designs.

MRF19030LR5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-400
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
1.96GHz
Gain:
13dB
Voltage - Test:
26 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
300 mA
Power - Output:
30W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-400

MRF19030LR5 FAQ

1.How can I place an order for MRF19030LR5 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF19030LR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF19030LR5 reliable?

The price and inventory of MRF19030LR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF19030LR5 is usually 5 days.

3.What payment methods are accepted for MRF19030LR5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF19030LR5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF19030LR5?

MRF19030LR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF19030LR5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF19030LR5?

For technical support, including MRF19030LR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF19030LR5 requirements.

6.How does Aetrix verify that MRF19030LR5 is sourced from the original manufacturer or authorized distributors?

All MRF19030LR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF19030LR5 meets industry standards.

7.What is the process for return or replacement of MRF19030LR5?

All MRF19030LR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF19030LR5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF19030LR5 part is unused and in its original packaging.

Return procedure for MRF19030LR5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF19030LR5 Tags

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