NXP Semiconductors MRF19030LSR3
- Part No.:
- MRF19030LSR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-400S
- Datasheet:
-
MRF19030LSR3.pdf
- Description:
- RF MOSFET LDMOS 26V NI400
- Quantity:
- Payment:

- Shipping:

Inventory:5,812
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Product details
Overview
MRF19030LSR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for class AB base station amplifiers operating at 1930–1990 MHz. It delivers 30 W PEP output power at 26 Vdc, achieves 13 dB typical two-tone power gain, and maintains −31 dBc third-order IMD under CDMA conditions. It is internally matched and qualified for PCS/PCN infrastructure applications including multicarrier and TDMA systems.
For engineers reviewing the MRF19030LSR3 datasheet, MRF19030LSR3 pinout, MRF19030LSR3 application, or MRF19030LSR3 equivalent, key selection criteria include its 1930–1990 MHz bandwidth, 30 W PEP capability, 2.1 °C/W thermal resistance, RoHS-compliant NI-400S package, and proven 10:1 VSWR ruggedness at 1960 MHz.
Technical Context
This device employs a laterally diffused MOS structure optimized for high-frequency linearity and thermal stability in broadband RF power stages. Its internal input/output matching network eliminates external tuning components for 50 Ω systems, and it operates with fixed 300 mA quiescent drain current at 26 Vdc supply.
The MRF19030LSR3 is characterized using series-equivalent large-signal impedance parameters (e.g., Zsource = 10.47 − j7.21 Ω at 1960 MHz), enabling accurate load-pull design. Its ESD protection meets HBM Class 2 and MM Class M3 standards, and gate threshold voltage is tightly specified at 2–4 Vdc.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1930–1990 MHz - Validated for PCS/PCN band base station amplifiers, not extrapolated beyond this range. |
| Output Power (PEP) | 30 W - Measured under two-tone test (100 kHz spacing) at 26 Vdc, 300 mA IDQ, enabling multicarrier CDMA operation. |
| Power Gain | 13 dB typical - Achieved without external matching; enables compact driver-stage design in macrocell PA modules. |
| Drain Efficiency | 36% typical - At 30 W PEP, reduces thermal load and DC power consumption in continuous-duty base station transmitters. |
| Thermal Resistance | 2.1 °C/W (Junction-to-Case) - Enables direct mounting to heatsink; supports case temperature up to 150°C without derating. |
| VSWR Tolerance | 10:1 @ 1960 MHz, 30 W CW - Confirmed ruggedness against antenna mismatch in deployed outdoor radio units. |
| ESD Rating | HBM Class 2, MM Class M3 - Integrated protection allows handling without special ESD precautions during assembly. |
Pinout & Package
Package: NI-400S (Case 465F-04, Style 1), hermetically sealed ceramic/metal flange-mount package with solderable leads and low-gold-plating (40 μ″ nominal).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | High-power RF output node | Connected directly to heatsink via flange; carries full RF output current and DC supply (26 Vdc). |
| 2. Gate | RF input control terminal | DC-biased to ~3.3 V for 300 mA IDQ; requires stable low-noise bias network per Figure 1. |
| 3. Source | RF and DC return path | Internally tied to flange ground; must be low-inductance RF grounded to chassis for stability. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Eliminates discrete matching networks at 1930–1990 MHz; reduces board area and tuning labor in production PA assemblies. |
| High linearity (−31 dBc IMD) | Meets IS-95 CDMA spectral mask requirements for pilot, sync, paging, and traffic channels at 1990 MHz. |
| 10:1 VSWR ruggedness | Survives worst-case antenna mismatch events without degradation-critical for unattended macrocell deployments. |
| Low thermal resistance (2.1 °C/W) | Enables >80% of rated power dissipation at TC = 150°C, supporting compact thermal designs in dense RF modules. |
| RoHS-compliant packaging | NI-400S construction uses lead-free solder-compatible terminations and meets EU Directive 2011/65/EU. |
Applications
| PCS Base Station Transmitter | CDMA Multicarrier Amplifier |
|---|---|
Use Scenario: High-reliability outdoor macrocell transmitter operating in 1930–1990 MHz PCS band with dynamic traffic loading. IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 30 W PEP to antenna feedline. Use Value: Internal matching and 10:1 VSWR tolerance eliminate need for circulator or VSWR protection circuitry, reducing BOM count and field failure risk. |
Use Scenario: Linear amplifier for IS-95 CDMA base station supporting simultaneous pilot, sync, paging, and 6 traffic channels. IC Role / Device Role / Timing Role: Class AB RF power stage maintaining spectral purity across multiple code channels. Use Value: −31 dBc third-order IMD at 30 W PEP ensures adjacent channel leakage remains within FCC Part 22 limits without digital predistortion overhead. |
| TDMA Cellular Infrastructure | FM Broadcast Auxiliary Link |
Use Scenario: High-efficiency repeater or donor amplifier in 1900 MHz TDMA networks with strict thermal constraints. IC Role / Device Role / Timing Role: High-gain, high-efficiency final PA operating at 26 Vdc with 300 mA quiescent current. Use Value: 36% drain efficiency at 30 W PEP minimizes heatsink size and cooling requirements in enclosed remote radio heads. |
Use Scenario: Studio-transmitter link (STL) amplifier for FM auxiliary broadcast at 1960 MHz with narrowband modulation. IC Role / Device Role / Timing Role: Linear RF power booster requiring stable gain flatness and low phase distortion. Use Value: Designed for maximum insertion phase flatness and gain consistency across 1930–1990 MHz, ensuring minimal group delay variation in analog STL paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF19030LR3 | Same die, NI-400 package (Case 465E-04); slightly different flange geometry and lead finish. | Identical RF performance; differs only in mechanical footprint and tape/reel packaging (R3 vs SR3). | Select MRF19030LSR3 when NI-400S (Case 465F-04) mechanical compatibility or 250-unit reel quantity is required. |
| PD57018-E | STMicroelectronics 30 W LDMOS; 1930–2110 MHz range; higher gain (15 dB), lower IMD (−34 dBc), but requires external matching. | Better linearity and wider bandwidth, but demands full external impedance tuning and bias sequencing. | Choose PD57018-E only if system-level redesign accommodates external matching and tighter bias control; MRF19030LSR3 offers faster time-to-market with internal match. |
Compared with MRF19030LR3, the MRF19030LSR3 provides identical electrical performance in a dimensionally distinct NI-400S package, while the PD57018-E trades internal matching for broader bandwidth and improved linearity-requiring additional design effort but enabling higher spectral efficiency in next-gen systems.
Availability
MRF19030LSR3 is available at Aetrix Electronics and suitable for PCS base station transmitters, CDMA multicarrier amplifiers, TDMA infrastructure repeaters, and FM STL links requiring stable component supply and long-lifecycle support.
Supply support for MRF19030LSR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of high-performance RF power transistors for wireless infrastructure, emphasizing ruggedness, linearity, and thermal reliability.
The MRF19030LSR3 belongs to Freescale's MRF190xx RF power MOSFET family, engineered specifically for class AB operation in 1800–2000 MHz base station amplifiers where VSWR tolerance and CDMA spectral purity are critical.
FAQ
What is the maximum operating junction temperature for the MRF19030LSR3?
The MRF19030LSR3 has a maximum operating junction temperature (TJ) of 200°C, as specified in Table 1 of the Freescale technical data. This rating enables reliable operation under high ambient conditions when mounted on a properly sized heatsink with thermal resistance ≤2.1 °C/W. The MRF19030LSR3 must be operated within this limit to avoid permanent degradation of RF performance or gate oxide integrity.
Does the MRF19030LSR3 require external matching components for 50 Ω systems?
No, the MRF19030LSR3 is internally matched for both input and output at 1930–1990 MHz, as confirmed in the "Features" section and Figure 9 source/load impedance data. The device achieves −13 dB input return loss and delivers full 30 W PEP into a 50 Ω load without external tuning capacitors or inductors-reducing bill-of-materials and simplifying layout for the MRF19030LSR3 in production base station PA modules.
What is the gate threshold voltage range for the MRF19030LSR3?
The gate threshold voltage (VGS(th)) for the MRF19030LSR3 is specified as 2–4 Vdc (min–max) at VDS = 10 Vdc and ID = 100 μAdc, per Table 4. This tight distribution ensures consistent turn-on behavior across production lots and supports stable 300 mA quiescent current setting using standard bias networks. The MRF19030LSR3's VGS(Q) is further characterized at 2–4.5 Vdc under operating conditions.
Can the MRF19030LSR3 withstand antenna VSWR mismatches in deployed systems?
Yes, the MRF19030LSR3 is explicitly characterized to handle 10:1 VSWR at 1960 MHz and 30 W CW output power without damage or parametric shift. This ruggedness is validated per Freescale's test methodology and makes the MRF19030LSR3 suitable for unattended outdoor macrocell installations where antenna detuning or cable faults may occur. No external circulator or protection circuit is required solely for VSWR survival.
What is the thermal resistance from junction to case for the MRF19030LSR3?
The thermal resistance from junction to case (RθJC) for the MRF19030LSR3 is 2.1 °C/W, as published in Table 2. This value applies to the NI-400S package (Case 465F-04) and assumes proper mounting with thermal interface material and sufficient heatsink mass. It enables calculation of junction temperature rise (ΔTJ = PD × 2.1) to ensure the MRF19030LSR3 remains within its 200°C TJ limit under full 30 W PEP operation.
MRF19030LSR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-400S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.96GHz
- Gain:
- 13dB
- Voltage - Test:
- 26 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 300 mA
- Power - Output:
- 30W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-400S
MRF19030LSR3 FAQ
1.How can I place an order for MRF19030LSR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF19030LSR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF19030LSR3 reliable?
The price and inventory of MRF19030LSR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF19030LSR3 is usually 5 days.
3.What payment methods are accepted for MRF19030LSR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF19030LSR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRF19030LSR3?
MRF19030LSR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF19030LSR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF19030LSR3?
For technical support, including MRF19030LSR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF19030LSR3 requirements.
6.How does Aetrix verify that MRF19030LSR3 is sourced from the original manufacturer or authorized distributors?
All MRF19030LSR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF19030LSR3 meets industry standards.
7.What is the process for return or replacement of MRF19030LSR3?
All MRF19030LSR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF19030LSR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF19030LSR3 part is unused and in its original packaging.
Return procedure for MRF19030LSR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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