Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MRF19030LSR5

Part No.:
MRF19030LSR5
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-400S
Datasheet:
AetrixMRF19030LSR5.pdf
Description:
RF MOSFET LDMOS 26V NI400
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,647

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MRF19030LSR5 from NXP Semiconductors (formerly Freescale) is an N-channel enhancement-mode lateral RF power MOSFET designed for Class AB base station amplifiers in PCN/PCS bands. It delivers 30 W PEP output at 1930–1990 MHz with 13 dB typical two-tone power gain, 36% drain efficiency, and -31 dBc third-order IMD under 26 Vdc bias and 300 mA quiescent current - deployed in multicarrier CDMA, TDMA, and FM cellular infrastructure.

For engineers reviewing the MRF19030LSR5 datasheet, MRF19030LSR5 pinout, MRF19030LSR5 application, or MRF19030LSR5 equivalent, this device requires attention to its internally matched 25 Ω input/output impedance, NI-400S package thermal resistance (2.1 °C/W), VSWR ruggedness (10:1 at 30 W CW), and gate threshold voltage range (2–4 Vdc) when designing broadband RF power stages for 1.9 GHz wireless infrastructure.

Technical Context

This device operates as a common-source RF power amplifier stage with fixed 26 Vdc drain supply and 300 mA quiescent bias. Its internal input/output matching network eliminates external tuning components across 1930–1990 MHz, while series-equivalent source/load impedances (e.g., Zsource = 10.47 − j7.21 Ω at 1960 MHz) are characterized for system-level impedance synthesis.

It features integrated ESD protection (HBM Class 2, MM Class M3), low gold plating (40 μ″) on leads, and RoHS-compliant construction. Thermal design relies on case-to-ambient conduction via the flanged NI-400S metal package, rated for 150 °C case temperature and 200 °C junction temperature.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range1930–1990 MHz - Validated bandwidth for CDMA/TDMA multicarrier base station amplifiers.
Output Power (PEP)30 W - Sustained peak envelope power under two-tone 100 kHz spacing test conditions.
Power Gain13 dB typ - Measured small-signal gain in 50 Ω test fixture; enables compact driver-stage design.
Drain Efficiency36% typ - Directly impacts thermal load and DC power budget in high-reliability macrocell sites.
IMD3−31 dBc typ - Third-order intermodulation distortion at 30 W PEP, critical for adjacent channel leakage compliance.
VSWR Tolerance10:1 @ 30 W CW - Enables operation into mismatched loads without damage in deployed antenna systems.
RθJC2.1 °C/W - Defines minimum heatsink requirement for 150 °C case temperature at full 30 W PEP.

Pinout & Package

Package: NI-400S (Case 465F-04, Style 1), flanged ceramic/metal hermetic package with solderable copper-tungsten baseplate and insulated lid. Dimensions: 10.03 × 10.03 × 4.14 mm (L × W × H), 3-pin configuration.

Pin/Terminal Circuit Role Design Meaning
1. DrainHigh-power RF output nodeConnected to output matching network and heatsink; carries full RF current and DC supply (26 Vdc).
2. GateRF input control terminalBias-controlled modulation point; requires stable 2–4.5 Vdc quiescent voltage and ESD-protected drive circuitry.
3. SourceCommon RF ground referenceDC return path and RF ground plane anchor; must be low-inductance bonded to heatsink/ground plane.

Key Features

Feature Design Value
Internally matched I/OEliminates external tuning capacitors/inductors across 1930–1990 MHz, reducing BOM count and layout sensitivity.
10:1 VSWR ruggednessWithstands severe antenna mismatches without degradation - essential for outdoor macrocell deployments.
Integrated ESD protectionHBM Class 2 / MM Class M3 rating enables robust handling during assembly and field maintenance.
Low RθJC (2.1 °C/W)Enables high-power operation with moderate heatsinking - reduces thermal interface complexity in dense RF modules.
Series-equivalent Z-parametersPublished source/load impedances (e.g., Zload = 5.84 − j4.67 Ω @ 1960 MHz) support precise external matching network synthesis.

Applications

CDMA Base Station Transmitter PCS Band Multicarrier Amplifier

Use Scenario: High-linearity final PA stage in 1930–1990 MHz macrocell BTS supporting IS-95 CDMA forward link (Pilot, Sync, Paging, Traffic channels).

IC Role / Device Role / Timing Role: RF power MOSFET operating in Class AB with 300 mA IDQ bias and 26 Vdc supply.

Use Value: Delivers −31 dBc IMD3 at 30 W PEP and meets ACPR requirements for 885 kHz/1.25 MHz/2.25 MHz offset bands per CDMA spec.

Use Scenario: Final amplifier in PCS band distributed antenna systems (DAS) handling multiple simultaneous carriers.

IC Role / Device Role / Timing Role: Common-source broadband RF power transistor with internally matched 25 Ω I/O ports.

Use Value: Achieves 13 dB gain and 36% efficiency across 1930–1990 MHz without external matching - simplifies DAS node integration.

FM Broadcast Booster Amplifier TDMA Cellular Infrastructure PA

Use Scenario: Medium-power FM broadcast repeater amplifier operating at 1960 MHz with high spectral purity.

IC Role / Device Role / Timing Role: Lateral N-channel MOSFET biased at 26 Vdc/300 mA for linear Class AB operation.

Use Value: Provides −13 dB input return loss and −31 dBc IMD3 - ensures clean harmonic suppression and minimal adjacent-channel interference.

Use Scenario: Linear PA in TDMA-based cellular base stations requiring stable gain flatness over temperature.

IC Role / Device Role / Timing Role: Thermally stable RF power transistor with 200 °C max junction temperature rating.

Use Value: Maintains consistent 13 dB gain and <±0.5 dB variation across −40 to +85 °C ambient due to excellent thermal stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF19030LR3Same die, NI-400 package (Case 465E-04); higher RθJC = 2.4 °C/W vs. 2.1 °C/W for LSR3/LSR5.Requires larger heatsink area for equivalent thermal performance at 30 W PEP.Select MRF19030LR3 only if NI-400 footprint compatibility is mandatory and thermal margin allows.
MRFE6VP6300HHigher Pout (300 W), LDMOS technology, 1.8–2.2 GHz range; not internally matched - requires external matching networks.Suitable for macrocell main PA, not small-cell or DAS where board space is constrained.Choose MRFE6VP6300H only for high-power (>100 W) applications where external tuning is acceptable.

Compared with MRF19030LSR5, MRF19030LR3 offers identical RF performance but less efficient thermal dissipation, while MRFE6VP6300H provides scalable power at the cost of design complexity and board area - making MRF19030LSR5 optimal for space-constrained, thermally sensitive 30 W multicarrier base station modules.

Availability

MRF19030LSR5 is available at Aetrix Electronics and suitable for CDMA base station transmitters, PCS multicarrier amplifiers, and FM broadcast booster applications requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom infrastructure OEMs.

Supply support for MRF19030LSR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets, with deep heritage in RF power from its Freescale acquisition.

The MRF19030LSR5 belongs to NXP's legacy RF Power MOSFET product line, engineered specifically for high-efficiency, high-linearity Class AB amplification in 1.9 GHz cellular infrastructure equipment.

FAQ

What is the maximum continuous drain current rating for MRF19030LSR5?

The MRF19030LSR5 does not specify a maximum continuous drain current (ID) rating. Instead, its safe operating area is defined by total device dissipation (83.3 W at TC = 25°C, derated 0.48 W/°C above), drain-source voltage (−0.5 to +65 Vdc), and case temperature limit (150 °C). Actual current depends on bias point, thermal design, and RF loading - typical Class AB operation uses 300 mA IDQ at 26 Vdc.

Does MRF19030LSR5 require external matching components for 1960 MHz operation?

No, the MRF19030LSR5 is internally matched for both input and output across 1930–1990 MHz, including 1960 MHz. Freescale's datasheet confirms "Part is internally matched both on input and output" and provides series-equivalent Z-parameters (e.g., Zsource = 10.47 − j7.21 Ω, Zload = 5.84 − j4.67 Ω) for verification - no external tuning capacitors or inductors are needed in the reference design.

What is the gate threshold voltage range for MRF19030LSR5?

The gate threshold voltage (VGS(th)) for MRF19030LSR5 is specified as 2–4 Vdc (min–max) at VDS = 10 Vdc and ID = 100 μAdc. This defines the minimum gate voltage required to initiate conduction and informs bias network design - the typical gate quiescent voltage (VGS(Q)) under 26 Vdc/300 mA operating conditions is 3.3 Vdc.

Can MRF19030LSR5 operate safely into a 10:1 VSWR load?

Yes, the MRF19030LSR5 is characterized to safely handle 10:1 VSWR at 1960 MHz, 26 Vdc, and 30 W CW output power without device failure. This ruggedness is enabled by its lateral MOSFET structure and integrated protection - a key requirement for base station amplifiers connected to real-world antenna systems with variable impedance.

What package type and pin configuration does MRF19030LSR5 use?

MRF19030LSR5 uses the NI-400S package (Case 465F-04, Style 1): a flanged ceramic/metal hermetic package with three terminals - Pin 1 (Drain), Pin 2 (Gate), Pin 3 (Source). The flange serves as thermal and electrical ground, and the package is optimized for surface-mount soldering onto copper heatsinks in RF power modules.

MRF19030LSR5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-400S
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
1.96GHz
Gain:
13dB
Voltage - Test:
26 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
300 mA
Power - Output:
30W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-400S

MRF19030LSR5 FAQ

1.How can I place an order for MRF19030LSR5 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF19030LSR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF19030LSR5 reliable?

The price and inventory of MRF19030LSR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF19030LSR5 is usually 5 days.

3.What payment methods are accepted for MRF19030LSR5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF19030LSR5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF19030LSR5?

MRF19030LSR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF19030LSR5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF19030LSR5?

For technical support, including MRF19030LSR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF19030LSR5 requirements.

6.How does Aetrix verify that MRF19030LSR5 is sourced from the original manufacturer or authorized distributors?

All MRF19030LSR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF19030LSR5 meets industry standards.

7.What is the process for return or replacement of MRF19030LSR5?

All MRF19030LSR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF19030LSR5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF19030LSR5 part is unused and in its original packaging.

Return procedure for MRF19030LSR5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF19030LSR5 Tags

  • MRF19030LSR5
  • MRF19030LSR5 PDF
  • MRF19030LSR5 Datasheet
  • MRF19030LSR5 Specifications
  • MRF19030LSR5 Images
  • NXP Semiconductors
  • NXP Semiconductors MRF19030LSR5
  • Buy MRF19030LSR5
  • MRF19030LSR5 Price
  • MRF19030LSR5 Distributor
  • MRF19030LSR5 Supplier
  • MRF19030LSR5 Wholesale
Related Products
3SK294(TE85L,F)
3SK294(TE85L,F)

Toshiba Semiconductor and Storage

SAV-551+
SAV-551+

Mini-Circuits

TAV2-501+
TAV2-501+

Mini-Circuits

CE3514M4-C2
CE3514M4-C2

CEL

AFT05MS004NT1
AFT05MS004NT1

NXP USA Inc.

SAV-541+
SAV-541+

Mini-Circuits

CE3512K2-C1
CE3512K2-C1

CEL

AFM907NT1
AFM907NT1

NXP Semiconductors

SKY65050-372LF
SKY65050-372LF

Skyworks Solutions Inc.

CE3520K3-C1
CE3520K3-C1

CEL

AFT09MS007NT1
AFT09MS007NT1

NXP USA Inc.

AFT09MS015NT1
AFT09MS015NT1

NXP USA Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER