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NXP Semiconductors MRF21045LR3

Part No.:
MRF21045LR3
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-400
Datasheet:
AetrixMRF21045LR3.pdf
Description:
RF MOSFET LDMOS 28V NI400
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,488

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Product details

Overview

MRF21045LR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for W-CDMA base station amplifiers operating at 2110–2170 MHz. It delivers 10 W average output power with 15 dB gain, 23.5% drain efficiency, and –41 dBc ACPR under two-carrier W-CDMA conditions (VDD = 28 V, IDQ = 500 mA). It is internally matched and rated for 45 W PEP CW operation into 5:1 VSWR.

For engineers reviewing the MRF21045LR3 datasheet, MRF21045LR3 pinout, MRF21045LR3 application, or MRF21045LR3 equivalent, key selection criteria include its 2110–2170 MHz frequency band, 28 V drain supply compatibility, 1.65 °C/W thermal resistance, RoHS-compliant NI-400 package, and verified two-tone IMD performance at 45 W PEP.

Technical Context

This device operates in Class AB for cellular infrastructure applications, using a laterally diffused MOS (LDMOS) structure optimized for linearity and thermal stability. Its internally matched 25 Ω input/output impedance simplifies external matching network design while maintaining flat insertion phase across the band.

The MRF21045LR3 features integrated ESD protection (HBM Class 1, MM Class M2), low gate threshold voltage (2–4 V), and high transconductance (typ. 3 S), enabling stable biasing and efficient drive. Its series-equivalent large-signal impedance data (e.g., Zsource = 3.12 – j3.72 Ω at 2140 MHz) supports accurate broadband amplifier synthesis.

Key Specifications

ParameterValue and Actual Design Meaning
Frequency Range2110–2170 MHz - fully characterized for W-CDMA base station bands with validated ACPR/IM3 performance.
Output Power (Avg)10 W - supports two-carrier W-CDMA signals with 8.3 dB peak-to-average ratio at 0.01% CCDF probability.
Drain Efficiency23.5% - enables thermally manageable operation at 28 V supply with 500 mA quiescent current.
Power Gain15 dB - provides sufficient small-signal and large-signal gain to reduce driver stage complexity.
VSWR Tolerance5:1 @ 2140 MHz - withstands mismatched loads without damage, critical for antenna interface robustness.
Thermal Resistance1.65 °C/W - allows high-power dissipation (105 W max) with moderate heatsinking in base station PA modules.
ESD RatingHBM Class 1, MM Class M2 - ensures handling safety during assembly and board-level integration.

Pinout & Package

Package: NI-400 (Case 465E-04, Style 1), hermetically sealed ceramic/metal flange-mount package with solderable leads and 40 μ″ nominal gold plating. Designed for high-reliability RF power amplifier modules requiring low thermal resistance and stable RF grounding.

Pin/TerminalCircuit RoleDesign Meaning
1. DrainHigh-current RF output terminalConnected to output matching network and heatsink; carries full RF output current and DC supply voltage (28 V).
2. GateRF input control terminalBias-controlled terminal for RF signal amplification; requires stable DC bias (VGS(Q) = 3.9 V typ.) and ESD-protected routing.
3. SourceCommon reference and RF return pathDC ground reference and RF return; must be low-inductance connected to PCB ground plane for stability and thermal conduction.

Key Features

FeatureDesign Value
Internally matched impedance25 Ω input/output - eliminates need for discrete input/output matching components in standard 50 Ω systems.
High linearity at 45 W PEPIM3 = –30 dBc, ACPR = –38 dBc - meets stringent W-CDMA adjacent channel requirements at maximum CW-rated power.
Thermal stabilityTJ = 200 °C max, RθJC = 1.65 °C/W - enables sustained operation in compact, air-cooled macrocell PA enclosures.
Large-signal impedance characterizationZsource/Zload provided at 2110/2140/2170 MHz - supports precise broadband matching network synthesis without de-embedding.
RoHS compliance & tape-and-reel packagingR3 suffix = 250 units per 32 mm, 13-inch reel - supports automated SMT placement in high-volume infrastructure module production.

Applications

W-CDMA Macrocell Base StationTDMA/CDMA Multicarrier Amplifier

Use Scenario: Final-stage power amplifier in outdoor macrocell BTS operating in 2110–2170 MHz band with dual-carrier W-CDMA modulation.

IC Role / Device Role / Timing Role: High-efficiency, high-linearity RF power transistor delivering 10 W average output with –41 dBc ACPR.

Use Value: Enables single-device final stage with verified 5:1 VSWR tolerance, reducing system-level protection circuitry and improving field reliability.

Use Scenario: Linear amplifier in legacy TDMA or CDMA base stations supporting multiple simultaneous carriers.

IC Role / Device Role / Timing Role: Lateral MOSFET providing broadband gain and efficiency across 2110–2170 MHz with low IMD.

Use Value: Delivers 14.9 dB gain and 36% drain efficiency at 45 W PEP, minimizing driver stage count and thermal management overhead.

Wireless Local Loop (WLL) TransmitterPCN/PCS Cellular Radio PA

Use Scenario: Outdoor point-to-multipoint transmitter in fixed wireless access networks requiring high output power and spectral purity.

IC Role / Device Role / Timing Role: Final-stage RF power device operating in Class AB with 28 V supply and 500 mA quiescent current.

Use Value: Achieves –37.5 dBc IM3 and 15 dB gain at 2157.5 MHz, meeting FCC spectral mask requirements for unlicensed WLL deployments.

Use Scenario: Power amplifier in portable or vehicular PCN/PCS radio equipment requiring rugged RF performance.

IC Role / Device Role / Timing Role: Laterally diffused MOSFET optimized for gain flatness and insertion phase stability over temperature.

Use Value: Maintains >13.5 dB gain and <1.65 °C/W thermal resistance across –40°C to +150°C case temperature, ensuring consistent RF output in mobile environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP MRFE6VP61K25HHigher P1dB (65 W), higher VDD rating (32 V), GaN-on-SiC process; not pin-compatible.Targets next-gen massive MIMO and active antenna systems requiring >50 W PEP and wider bandwidth.Select when upgrading for higher power density and bandwidth beyond 2170 MHz; requires new PCB layout and bias network redesign.
STMicroelectronics PD85003LDMOS, 2110–2170 MHz, 10 W avg, but lower gain (12.5 dB typ.) and higher VGS(th) (3–5 V); same NI-400 package footprint.Designed for cost-sensitive WLL and repeater applications where gain margin is less critical than BOM cost.Consider for drop-in replacement where gain tolerance allows; verify thermal derating due to higher RθJC (2.1 °C/W).

Compared with the MRF21045LR3, the MRFE6VP61K25H offers significantly higher power capability and bandwidth but demands full redesign, while the PD85003 provides mechanical compatibility and lower cost at the expense of gain and efficiency-making it suitable only for non-critical linearity applications.

Availability

MRF21045LR3 is available at Aetrix Electronics and suitable for W-CDMA base station development, wireless local loop (WLL) transmitter builds, and PCN/PCS cellular radio amplifier designs requiring stable component supply and long-term lifecycle support.

Supply support for MRF21045LR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of RF power transistors for wireless infrastructure, emphasizing high-efficiency LDMOS technology and rigorous thermal characterization.

The MRF21045LR3 belongs to Freescale's MRF210xx RF power MOSFET family, engineered specifically for linear, high-reliability amplification in 3G W-CDMA base stations and related broadband cellular infrastructure applications.

FAQ

What is the maximum continuous drain power dissipation for the MRF21045LR3?

The MRF21045LR3 has a maximum total device dissipation of 105 W at case temperature (TC) = 25°C, derating linearly at 0.60 W/°C above that temperature. This rating assumes proper heatsinking and adherence to the specified thermal resistance (RθJC = 1.65 °C/W) to maintain junction temperature below 200°C. The MRF21045LR3 must be mounted on a thermally optimized copper baseplate or heatsink to sustain this power level reliably.

Does the MRF21045LR3 require external matching networks for 50 Ω systems?

No-the MRF21045LR3 is internally matched for both input and output to 25 Ω, enabling direct integration into standard 50 Ω RF systems with minimal external components. Its datasheet provides verified series-equivalent source and load impedances (e.g., Zsource = 3.12 – j3.72 Ω at 2140 MHz), allowing designers to implement simple, high-performance matching networks. The MRF21045LR3 achieves –12 dB input return loss and >13.5 dB gain without complex tuning.

What is the gate threshold voltage range for the MRF21045LR3?

The MRF21045LR3 has a gate threshold voltage (VGS(th)) range of 2 V to 4 V, measured at VDS = 10 Vdc and ID = 100 μAdc. This low and well-defined threshold enables stable Class AB biasing with typical gate quiescent voltage (VGS(Q)) of 3.9 V at IDQ = 500 mA and VDD = 28 V. The MRF21045LR3's tight VGS(th) distribution supports consistent bias point setting across production lots.

Can the MRF21045LR3 operate safely under 5:1 VSWR conditions?

Yes-the MRF21045LR3 is explicitly rated to handle 5:1 VSWR at 28 Vdc and 2140 MHz with 45 W CW output power without degradation or failure. This ruggedness stems from its lateral MOSFET structure, integrated ESD protection, and thermal design margin. The MRF21045LR3's ability to survive high VSWR events makes it suitable for antenna-integrated base station modules where impedance mismatches may occur during deployment or environmental shifts.

Is the MRF21045LR3 still in active production or subject to end-of-life status?

The MRF21045LR3 is a lifetime buy product with last order date of 1 July 2011 and last shipment date of 30 June 2012, as documented in Freescale's official datasheet (Rev. 12, October 2008). While no longer in active production, Aetrix Electronics maintains legacy inventory and supports continued use in maintenance, repair, and obsolescence mitigation programs for deployed W-CDMA infrastructure. The MRF21045LR3 remains fully functional and qualified for its original specifications.

MRF21045LR3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-400
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
2.17GHz
Gain:
15dB
Voltage - Test:
28 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
500 mA
Power - Output:
10W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
NI-400-240

MRF21045LR3 FAQ

1.How can I place an order for MRF21045LR3 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF21045LR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF21045LR3 reliable?

The price and inventory of MRF21045LR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF21045LR3 is usually 5 days.

3.What payment methods are accepted for MRF21045LR3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF21045LR3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF21045LR3?

MRF21045LR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF21045LR3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF21045LR3?

For technical support, including MRF21045LR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF21045LR3 requirements.

6.How does Aetrix verify that MRF21045LR3 is sourced from the original manufacturer or authorized distributors?

All MRF21045LR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF21045LR3 meets industry standards.

7.What is the process for return or replacement of MRF21045LR3?

All MRF21045LR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF21045LR3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF21045LR3 part is unused and in its original packaging.

Return procedure for MRF21045LR3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF21045LR3 Tags

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