NXP Semiconductors MRF6S21050LR3
- Part No.:
- MRF6S21050LR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-400
- Datasheet:
-
MRF6S21050LR3.pdf
- Description:
- RF MOSFET LDMOS 28V NI400
- Quantity:
- Payment:

- Shipping:

Inventory:3,801
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MRF6S21050LR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for W-CDMA base station amplifiers operating at 2110–2170 MHz. It delivers 11.5 W average output power at 28 V, 450 mA quiescent drain current, with 16 dB power gain and 27.7% drain efficiency in 2-carrier W-CDMA operation. Its internal matching and 10:1 VSWR ruggedness support robust multicarrier cellular infrastructure deployment.
For engineers reviewing the MRF6S21050LR3 datasheet, MRF6S21050LR3 pinout, MRF6S21050LR3 application, or MRF6S21050LR3 equivalent, key selection criteria include its 2110–2170 MHz frequency band, 28 V operation, NI-400S package with drain-gate-source pinout, and verified W-CDMA linearity metrics (ACPR = –40 dBc, IM3 = –37 dBc).
Technical Context
This device employs a laterally diffused MOS (LDMOS) structure optimized for high-efficiency, high-linearity RF power amplification in Class AB configuration. Its internally matched input and output networks reduce external tuning complexity while maintaining broadband performance across the 2110–2170 MHz band.
Thermal design is enabled by a low junction-to-case thermal resistance of 1.16 °C/W at 50 W CW, with maximum junction temperature rated at 225 °C and case temperature limited to 150 °C. ESD protection meets JESD22-A114 Class 1C, JESD22-A115 Class A, and JESD22-C101 Class III standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2110–2170 MHz - Supports full W-CDMA uplink band without retuning. |
| Output Power (Avg.) | 11.5 W - Sustained average power under 2-carrier W-CDMA signal (PAR = 8.5 dB). |
| Power Gain | 16 dB (typ.) - Enables compact driver-stage architecture with minimal cascaded stages. |
| Drain Efficiency | 27.7% (typ.) - Reduces thermal load and DC power consumption in base station PA modules. |
| VSWR Tolerance | 10:1 @ 28 V, 2140 MHz, 50 W CW - Ensures survivability during antenna mismatch events. |
| Junction Temp. Max | 225 °C - Allows high-power operation with appropriate heatsinking per MTTF modeling. |
| Gate Threshold Voltage | 1–3 Vdc - Enables stable biasing with standard gate control circuitry. |
Pinout & Package
Package: NI-400S (Case 465F-04, Style 1), flange-mounted ceramic/metal hermetic package with solderable baseplate for thermal management. Dimensions: 10.03 × 10.03 × 4.14 mm (L × W × H), 3-terminal configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | High-current RF output node | Connected to output matching network and heatsink; carries full RF output current and DC supply (VDD = 28 V). |
| 2. Gate | Control electrode | Receives DC bias (VGS(Q) = 2–4 V) and RF drive signal; internally matched to ~25 Ω for simplified interface. |
| 3. Source | Reference and return path | DC ground reference and RF return; tied directly to PCB ground plane and heatsink for lowest inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Reduces external matching components; enables drop-in integration into 50 Ω systems without impedance transformation. |
| Rugged 10:1 VSWR capability | Withstands severe antenna mismatches at full 50 W CW output without degradation or failure. |
| Integrated ESD protection | Qualified to HBM Class 1C, MM Class A, CDM Class III - eliminates need for external ESD clamps in assembly. |
| Low memory effects | Minimizes AM–PM distortion and enables wide instantaneous bandwidth for multicarrier signals. |
| RoHS-compliant packaging | Tape-and-reel delivery (250 units/reel, 32 mm width) supports automated SMT placement in production environments. |
Applications
| W-CDMA Base Station PA | TDMA/CDMA Macrocell Amplifier |
|---|---|
|
Use Scenario: Final-stage power amplifier in outdoor macrocell BTS operating in 2110–2170 MHz uplink band with dual-carrier W-CDMA modulation. IC Role / Device Role / Timing Role: High-efficiency RF power transistor delivering 11.5 W avg. output with ACPR < –40 dBc and IM3 < –37 dBc. Use Value: Meets 3GPP spectral mask requirements without digital predistortion overhead, reducing system complexity and cost. |
Use Scenario: Linear PA in legacy TDMA/CDMA base stations requiring broadband operation from 2110–2170 MHz. IC Role / Device Role / Timing Role: Lateral MOSFET providing Class AB amplification with 16 dB small-signal gain and 27.7% efficiency at 28 V. Use Value: Enables single-device replacement across multiple air interface standards, simplifying inventory and board design. |
| WLL Transmitter Module | Multi-Carrier Cellular Repeater |
|
Use Scenario: Transmit amplifier in fixed wireless access (WLL) equipment deployed in rural broadband networks. IC Role / Device Role / Timing Role: Ruggedized RF power stage handling 10:1 VSWR events and delivering 50 W CW peak capability. Use Value: Eliminates need for circulators or isolators in cost-sensitive WLL designs, improving power-added efficiency. |
Use Scenario: Output stage in bi-directional cellular repeater supporting concurrent W-CDMA carriers across 2110–2170 MHz. IC Role / Device Role / Timing Role: Internally matched MOSFET enabling stable gain flatness over 60 MHz bandwidth with low intermodulation. Use Value: Maintains adjacent channel leakage below –40 dBc under multi-tone excitation, preventing interference in dense spectrum deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6S9060NR1 | Higher P1dB (60 W), wider bandwidth (1805–2200 MHz), but requires external input/output matching. | Better suited for multiband macrocells; less suitable for space-constrained W-CDMA-only designs. | Select when broader frequency coverage or higher peak power is required; expect added matching complexity. |
| Qorvo QPD1006 | Gallium nitride (GaN) process; 32 V operation, 22% higher efficiency (34% typ.), but higher gate sensitivity and no integrated ESD. | Preferred for new energy-efficient designs; not drop-in due to different biasing and layout requirements. | Choose for next-gen PA modules targeting >30% efficiency; requires redesign of gate drive and thermal interface. |
Compared with MRF6S21050LR3, MRFE6S9060NR1 offers extended bandwidth and higher output but increases design effort via external matching, while QPD1006 delivers superior efficiency using GaN but mandates revised gate protection and thermal management strategies.
Availability
MRF6S21050LR3 is available at Aetrix Electronics and suitable for W-CDMA base station transmitters, TDMA/CDMA macrocell amplifiers, and fixed wireless access (WLL) transmitter modules requiring stable component supply and long-term lifecycle support.
Supply support for MRF6S21050LR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in RF power solutions, specializing in high-reliability semiconductor devices for wireless infrastructure.
The MRF6S21050LR3 belongs to Freescale's MRF6S series of LDMOS RF power transistors, engineered specifically for high-efficiency, high-linearity cellular base station amplifiers operating in the 2–2.2 GHz band.
FAQ
What is the maximum continuous drain voltage rating for the MRF6S21050LR3?
The MRF6S21050LR3 has a maximum drain-source voltage (VDSS) rating of +68 Vdc. This allows safe operation at 28 V supply with margin for transient spikes and enables use in designs with up to 32 VDD operation as qualified in the datasheet. The –0.5 V lower limit prevents reverse conduction during switching transitions.
Does the MRF6S21050LR3 require external matching networks?
No - the MRF6S21050LR3 is internally matched on both input and output, optimized for 50 Ω systems at 2110–2170 MHz. While external tuning may further optimize performance in specific layouts, the device operates effectively without discrete matching components, as confirmed in Freescale's test circuit and functional characterization data.
What thermal resistance value applies to the MRF6S21050LR3 at 50 W CW output?
At 50 W CW output with case temperature held at 80 °C, the MRF6S21050LR3 exhibits a junction-to-case thermal resistance (RθJC) of 1.16 °C/W. This value is critical for heatsink sizing and MTTF estimation, and is validated per AN1955 thermal measurement methodology.
How does the MRF6S21050LR3 perform in 2-carrier W-CDMA with 3.84 MHz channel bandwidth?
In 2-carrier W-CDMA operation at 2157 MHz, the MRF6S21050LR3 delivers 11.5 W average output power with 16 dB power gain, 27.7% drain efficiency, –40 dBc ACPR at ±5 MHz offset, and –37 dBc IM3 at ±10 MHz offset - all measured under PAR = 8.5 dB at 0.01% CCDF probability, meeting 3GPP spectral emission limits.
Is the MRF6S21050LR3 RoHS compliant and what packaging format is used?
Yes, the MRF6S21050LR3 is RoHS compliant and supplied in tape-and-reel format with the "R3" suffix indicating 250 units per 32 mm wide, 13-inch reel. This packaging supports automated surface-mount assembly and aligns with IPC/JEDEC standards for moisture sensitivity level (MSL) handling.
MRF6S21050LR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-400
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 2.16GHz
- Gain:
- 16dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 450 mA
- Power - Output:
- 11.5W
- Voltage - Rated:
- 68 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-400
MRF6S21050LR3 FAQ
1.How can I place an order for MRF6S21050LR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF6S21050LR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF6S21050LR3 reliable?
The price and inventory of MRF6S21050LR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF6S21050LR3 is usually 5 days.
3.What payment methods are accepted for MRF6S21050LR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF6S21050LR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRF6S21050LR3?
MRF6S21050LR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF6S21050LR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF6S21050LR3?
For technical support, including MRF6S21050LR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF6S21050LR3 requirements.
6.How does Aetrix verify that MRF6S21050LR3 is sourced from the original manufacturer or authorized distributors?
All MRF6S21050LR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF6S21050LR3 meets industry standards.
7.What is the process for return or replacement of MRF6S21050LR3?
All MRF6S21050LR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF6S21050LR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF6S21050LR3 part is unused and in its original packaging.
Return procedure for MRF6S21050LR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MRF6S21050LR3 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
