NXP Semiconductors MRF6S23100HSR5
- Part No.:
- MRF6S23100HSR5
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-780S
- Datasheet:
-
MRF6S23100HSR5.pdf
- Description:
- RF MOSFET LDMOS 28V NI780
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MRF6S23100HSR5 from NXP Semiconductors (formerly Freescale) is a laterally diffused N-channel enhancement-mode RF power MOSFET designed for high-efficiency, high-linearity 2300–2400 MHz base station amplifiers. It delivers 20 W average output power at 28 Vdc with 15.4 dB power gain and 23.5% drain efficiency under 2-carrier W-CDMA conditions (2390 MHz, 3.84 MHz channel bandwidth, PAR = 8.5 dB). Its primary circuit role is as the final-stage RF power amplifier in CDMA/WiMAX/WiBro infrastructure transmitters.
For engineers reviewing the MRF6S23100HSR5 datasheet, MRF6S23100HSR5 pinout, MRF6S23100HSR5 application, or MRF6S23100HSR5 equivalent, this page provides verified specifications, thermal performance data, impedance matching parameters, ESD protection class ratings, and real-world W-CDMA distortion metrics - all critical for PA stage design validation and reliability assurance in multi-carrier wireless infrastructure.
Technical Context
This device operates in Class AB or Class C configurations and is internally matched for 50 Ω input/output systems across 2300–2400 MHz. Its lateral MOSFET architecture enables wide instantaneous bandwidth and reduced memory effects, supporting multicarrier signals with up to 10:1 VSWR tolerance at 100 W CW output.
It features integrated ESD protection rated to Human Body Model Class 3A, Machine Model Class A, and Charge Device Model Class IV. Thermal resistance is specified at 0.59 °C/W (junction-to-case, 20 W CW, TC = 75°C), enabling robust thermal management in compact macrocell and small-cell PA modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2300–2400 MHz - supports full-band operation in B40 LTE and WiMAX 2.3 GHz systems without retuning. |
| Output Power (Avg.) | 20 W @ 2390 MHz, 2-carrier W-CDMA - sufficient for 2×20 MHz carrier aggregation in small-cell BTS. |
| Power Gain | 15.4 dB typical - reduces driver stage complexity and improves overall PA chain efficiency. |
| Drain Efficiency | 23.5% @ Pout = 20 W Avg. - lowers heat dissipation and DC power draw in continuous transmission modes. |
| ACPR (±5 MHz) | −40.5 dBc @ 3.84 MHz BW - meets stringent spectral mask requirements for 3GPP-compliant base stations. |
| IM3 (±10 MHz) | −37 dBc @ 3.84 MHz BW - ensures low intermodulation distortion in dense multicarrier deployments. |
| Junction Temp. Max | 225°C - enables high-power density packaging and extended lifetime under thermal stress. |
| VSWR Tolerance | 10:1 @ 28 Vdc, 2390 MHz, 100 W CW - protects against antenna mismatch-induced failure in outdoor installations. |
Pinout & Package
Package: NI-780S (Case 465A-06, Style 1), hermetically sealed ceramic/metal flange-mount package with copper-tungsten base for low thermal resistance and high RF stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | RF Power Output Terminal | High-current RF output node; electrically and thermally connected to flange; requires direct thermal interface to heatsink. |
| 2. Gate | RF Input Control Terminal | High-impedance control node; biased at ~2.8 Vdc quiescent; sensitive to ESD and layout parasitics. |
| 5. Source | RF/DC Common Reference | Low-inductance RF return path; tied to ground plane; critical for stability and harmonic suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Internally Matched Impedances | Series-equivalent Zsource = 2.06 − j4.69 Ω and Zload = 12.20 − j6.20 Ω at 2300 MHz - eliminates need for external broadband matching networks. |
| ESD Protection | HBM Class 3A (≥8 kV), MM Class A, CDM Class IV - enables safe handling and assembly without special ESD protocols beyond standard Class 1B. |
| Maximum VDD Rating | 68 Vdc drain-source rating - supports transient overvoltage resilience and flexible bias sequencing in 28 V systems. |
| Thermal Resistance | RθJC = 0.59 °C/W (20 W CW, TC = 75°C) - allows >100 W peak envelope power operation with conservative heatsink design. |
| Wide Instantaneous Bandwidth | Operates across full 2300–2400 MHz band with <0.2 dB gain variation - simplifies broadband PA design for multi-standard radios. |
Applications
| CDMA Base Station Transmitter | WiMAX/WiBro Infrastructure Amplifier |
|---|---|
Use Scenario: Final-stage PA in 2300–2400 MHz macrocell base stations supporting IS-2000 and cdma2000 standards. IC Role / Device Role / Timing Role: High-efficiency RF power amplifier delivering 20 W avg. output with linearized W-CDMA signal fidelity. Use Value: Enables >23% drain efficiency and −40.5 dBc ACPR compliance without digital predistortion overhead. |
Use Scenario: Multicarrier PA in fixed wireless access nodes operating in IEEE 802.16e bands. IC Role / Device Role / Timing Role: Linear RF power stage handling 10-MHz tone spacing and 8.5-dB PAR signals. Use Value: Delivers −37 dBc IM3 and 15.4 dB gain across 2300–2400 MHz, reducing adjacent-channel interference in dense deployments. |
| Small-Cell LTE Band 40 PA | WLL Point-to-Multipoint Amplifier |
Use Scenario: Compact outdoor small-cell unit covering LTE Band 40 (2300–2400 MHz) with 20 MHz channel support. IC Role / Device Role / Timing Role: Final-stage RF amplifier optimized for 2-carrier W-CDMA and OFDMA modulation. Use Value: Supports 10:1 VSWR tolerance and 225°C junction temperature, ensuring field reliability in uncontrolled environmental enclosures. |
Use Scenario: Wideband Local Loop transmitter requiring high linearity and stable gain over temperature. IC Role / Device Role / Timing Role: Class AB/C RF power device delivering 20 W avg. output with minimal memory effects. Use Value: Internally matched design reduces PCB area by >30% versus discrete-matched alternatives while maintaining −40.5 dBc ACPR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AFM905S | Higher gain (17.5 dB), lower efficiency (21%), same 2300–2400 MHz range and NI-780S package. | Better suited for driver-stage amplification where gain is prioritized over thermal budget. | Select AFM905S when system-level gain distribution favors higher driver gain and lower output power. |
| MRF6P23100HR5 | Same die but in NI-780 (larger) package; RθJC = 0.53 °C/W (100 W CW); higher VDD max (32 V). | Preferred for macrocell designs requiring higher CW power headroom and enhanced thermal margin. | Choose MRF6P23100HR5 when operating above 20 W avg. or requiring >100 W CW capability with identical RF performance. |
Compared with MRF6S23100HSR5, AFM905S trades efficiency for gain and suits driver roles, while MRF6P23100HR5 offers superior thermal performance in a larger package for higher-power macrocell use - both share identical frequency coverage and W-CDMA linearity specs but differ in thermal design flexibility and gain-efficiency balance.
Availability
MRF6S23100HSR5 is available at Aetrix Electronics and suitable for CDMA base station transmitters, WiMAX infrastructure amplifiers, and small-cell LTE Band 40 power stages requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MRF6S23100HSR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale's RF Power business in 2015 and continues to manufacture, qualify, and support legacy RF LDMOS products including the MRF6S series for wireless infrastructure.
The MRF6S family targets high-efficiency, high-linearity RF power amplification in 2–2.7 GHz cellular infrastructure, emphasizing thermal robustness, internal impedance matching, and multicarrier W-CDMA performance.
FAQ
What is the maximum continuous drain current rating for the MRF6S23100HSR5?
The MRF6S23100HSR5 does not specify a maximum continuous drain current in its datasheet. Instead, it defines absolute maximum ratings via voltage and thermal limits: VDSS = +68 Vdc, TJ(max) = 225°C, and RθJC = 0.59 °C/W. Actual safe operating current depends on bias point, thermal design, and output power level - for example, IDQ = 1000 mA is used in the 20 W W-CDMA test condition. The MRF6S23100HSR5 must be operated within its safe operating area (SOA) defined by these boundaries.
Does the MRF6S23100HSR5 require external matching networks for 2300–2400 MHz operation?
No, the MRF6S23100HSR5 is internally matched for 50 Ω systems across 2300–2400 MHz. Its datasheet provides series-equivalent source and load impedances (e.g., Zsource = 2.06 − j4.69 Ω, Zload = 12.20 − j6.20 Ω at 2300 MHz), confirming that no external broadband matching is needed for nominal operation. However, narrowband optimization or harmonic filtering may still require supplemental components depending on system-level requirements.
What is the gate threshold voltage range of the MRF6S23100HSR5?
The MRF6S23100HSR5 has a gate threshold voltage (VGS(th)) range of 1.0–3.0 Vdc, measured at VDS = 10 Vdc and ID = 250 μAdc. This parameter defines the minimum gate voltage required to initiate conduction. In practical operation, the device is biased at VGS(Q) = 2.0–4.0 Vdc under typical 28 Vdc, 1000 mA quiescent conditions - a value well above threshold to ensure stable Class AB operation and avoid cutoff distortion.
Can the MRF6S23100HSR5 be used in Class C mode for WLL applications?
Yes, the MRF6S23100HSR5 is explicitly qualified for Class C operation in Wireless Local Loop (WLL) applications per its Freescale datasheet. Its lateral MOSFET structure supports efficient switching-mode operation while retaining sufficient linearity for constant-envelope WLL signals. Designers must ensure proper harmonic termination and gate drive timing to maintain stability and avoid oscillation in Class C configuration.
What is the RoHS status and packaging format of the MRF6S23100HSR5?
The MRF6S23100HSR5 is RoHS compliant and supplied in tape-and-reel format. The "SR5" suffix indicates packaging in a 56 mm, 13-inch reel containing 250 units - consistent with industry-standard handling for surface-mount RF power transistors. The NI-780S package uses lead-free terminations and complies with EU Directive 2011/65/EU and related amendments.
MRF6S23100HSR5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-780S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 2.4GHz
- Gain:
- 15.4dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1 A
- Power - Output:
- 20W
- Voltage - Rated:
- 68 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-780S
MRF6S23100HSR5 FAQ
1.How can I place an order for MRF6S23100HSR5 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF6S23100HSR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF6S23100HSR5 reliable?
The price and inventory of MRF6S23100HSR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF6S23100HSR5 is usually 5 days.
3.What payment methods are accepted for MRF6S23100HSR5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF6S23100HSR5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRF6S23100HSR5?
MRF6S23100HSR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF6S23100HSR5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF6S23100HSR5?
For technical support, including MRF6S23100HSR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF6S23100HSR5 requirements.
6.How does Aetrix verify that MRF6S23100HSR5 is sourced from the original manufacturer or authorized distributors?
All MRF6S23100HSR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF6S23100HSR5 meets industry standards.
7.What is the process for return or replacement of MRF6S23100HSR5?
All MRF6S23100HSR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF6S23100HSR5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF6S23100HSR5 part is unused and in its original packaging.
Return procedure for MRF6S23100HSR5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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