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NXP Semiconductors MRF6S27015GNR1

Part No.:
MRF6S27015GNR1
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
TO-270BA
Datasheet:
AetrixMRF6S27015GNR1.pdf
Description:
RF MOSFET LDMOS 28V TO270-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,866

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Product details

Overview

MRF6S27015GNR1 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for 2300–2700 MHz base station amplifier stages. It delivers 3 W average output power at 2600 MHz under W-CDMA conditions (VDD = 28 V, IDQ = 160 mA), achieves 14 dB power gain and –45 dBc ACPR at ±5 MHz offset in 3.84 MHz bandwidth, and supports Class AB/C operation in WiMAX and OFDM multicarrier systems.

For engineers reviewing the MRF6S27015GNR1 datasheet, MRF6S27015GNR1 pinout, MRF6S27015GNR1 application, or MRF6S27015GNR1 equivalent, this device is selected for high-efficiency, thermally robust RF final-stage amplification where 225°C junction rating, internal input matching, and 5:1 VSWR ruggedness are critical design requirements.

Technical Context

This LDMOS transistor operates in common-source configuration with characterized series-equivalent large-signal impedances at 2500–2700 MHz. Its gate threshold voltage (1.5–3.5 V) and quiescent gate voltage (typ. 2.8 V) support stable Class AB biasing, while integrated ESD protection (HBM Class 1A) and RoHS-compliant plastic TO-270-2 GULL package enable reliable deployment in outdoor base station environments.

The device is internally input-matched and qualified for continuous operation up to 32 VDD, with thermal resistance RθJC = 2.2°C/W at 3 W CW. Its S-parameters (e.g., |S21| = 0.639 @ 2600 MHz) and broadband performance across 2300–2700 MHz confirm suitability for multiband 4G infrastructure applications requiring consistent gain and linearity.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 2300–2700 MHz - Validated for W-CDMA, WiMAX, and OFDM multicarrier amplifiers in licensed 2.5–2.7 GHz bands.
Output Power 3 W avg. @ 2600 MHz - Measured under single-carrier W-CDMA (3.84 MHz BW, PAR = 8.5 dB), enabling 2×2 MIMO PA modules.
Power Gain 14 dB typ. - Delivers sufficient small-signal gain to reduce driver stage complexity in cascaded PA architectures.
Drain Efficiency 22% typ. - Enables thermally manageable power dissipation in air-cooled macrocell designs without forced convection.
ACPR –45 dBc @ ±5 MHz - Meets 3GPP TS 25.104 spectral mask for adjacent channel leakage in base station transmitters.
Junction Temp. Max 225°C - Supports high-reliability operation under sustained 3 W avg. load with calculated MTTF > 107 hours at TJ = 150°C.
VSWR Tolerance 5:1 @ 28 V, 2600 MHz, 15 W CW - Ensures survivability during antenna mismatch events in deployed macrocells.

Pinout & Package

Package: TO-270-2 GULL (Case 1265A-03, Style 1), plastic, RoHS-compliant, 225°C capable, supplied in tape-and-reel (500 units per 24 mm, 13-inch reel).

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Source) Source terminal (common reference) Internally connected to metal tab; requires low-inductance grounding to minimize source inductance and stabilize bias.
Pin 2 (Gate) Control electrode High-impedance input requiring DC blocking and RF bypass; gate threshold 1.5–3.5 V enables precise Class AB setting.
Pin 3 (Drain) RF power output node High-current output terminal; must be impedance-matched to 50 Ω system via external network per Zload data (e.g., 2.727 – j0.182 Ω @ 2600 MHz).

Key Features

Feature Design Value
Internally matched input Reduces external matching component count; validated S11 ≤ –18 dB across 2300–2700 MHz in 50 Ω test fixture.
ESD protection HBM Class 1A (≥2 kV), MM Class A, CDM Class IV - Eliminates need for external ESD clamps in PCB layout.
Thermal robustness RθJC = 2.2°C/W at 3 W CW - Enables compact heatsink design with case temperature limited to 150°C.
High-VDD rating Qualified to 32 VDD - Allows headroom for transient overvoltage events in 28 V supply rails without derating.
Rugged VSWR handling Withstands 5:1 mismatch at 15 W CW - Prevents failure during antenna detuning or cable fault conditions.

Applications

Base Station Transmitter WiMAX Base Station PA

Use Scenario: Final-stage power amplification in 2.6 GHz LTE/WiMAX macrocell BTS operating with 3.84 MHz W-CDMA or 7 MHz WiMAX 802.16 signals.

IC Role / Device Role / Timing Role: RF power MOSFET in common-source Class AB configuration delivering 3 W avg. output with linearized ACPR performance.

Use Value: Achieves –45 dBc ACPR at ±5 MHz offset and 22% drain efficiency, reducing cooling requirements and meeting 3GPP spectral masks without digital predistortion overhead.

Use Scenario: High-efficiency PA in fixed wireless access (FWA) base stations supporting 64-QAM 3/4 modulation at 2600 MHz.

IC Role / Device Role / Timing Role: Final-stage RF amplifier biased at IDQ = 160 mA, delivering 3 W avg. into 50 Ω load with EVM < 2.5% at Pout = 25 dBm.

Use Value: Maintains <2.5% EVM at 25 dBm output (Figure 13), enabling high-throughput 7 MHz channel operation with minimal constellation distortion.

OFDM Multicarrier Amplifier Small Cell Remote Radio Head

Use Scenario: Linear amplifier in distributed antenna systems (DAS) using OFDM multicarrier waveforms with 8.5 dB PAR.

IC Role / Device Role / Timing Role: Single-carrier or dual-tone RF power stage operating at 2600 MHz with pulsed CW duty cycle (12 μs on, 1% duty).

Use Value: Delivers P1dB = 43 dBm (20 W) and P3dB = 43.7 dBm (27 W) in pulsed mode, supporting burst-mode transmission with peak envelope tracking.

Use Scenario: Compact, thermally efficient PA module in outdoor small cell RRH units requiring high reliability in uncontrolled ambient conditions.

IC Role / Device Role / Timing Role: Final-stage LDMOS transistor mounted on aluminum-core PCB with direct tab-to-heatsink interface.

Use Value: 225°C junction rating and 2.2°C/W thermal resistance allow continuous 3 W avg. operation at case temperatures up to 150°C without thermal shutdown.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP MRFE6S9015N Same frequency range (2300–2700 MHz), higher Pout = 15 W avg., but requires external input matching and has lower gain (12.5 dB). Better suited for high-power macrocell final stages; not drop-in due to different S-parameter behavior and bias network requirements. Select when >3 W avg. output is required and board space allows full external matching network redesign.
STMicroelectronics PD85003 2600 MHz optimized, 3 W avg. output, but rated only to 200°C junction and lacks integrated ESD protection (Class 0 HBM). Requires external ESD diodes and tighter thermal management; less rugged under VSWR stress. Choose only for cost-sensitive indoor applications where ambient temperature remains <60°C and antenna VSWR is tightly controlled.

Compared with MRF6S27015GNR1, MRFE6S9015N offers higher output power but demands more complex matching, while PD85003 reduces cost at the expense of thermal margin and ESD resilience-making MRF6S27015GNR1 the balanced choice for field-deployed 2.6 GHz base station PAs requiring ruggedness, integration, and proven reliability.

Availability

MRF6S27015GNR1 is available at Aetrix Electronics and suitable for base station transmitter modules, WiMAX infrastructure equipment, OFDM multicarrier amplifiers, and small cell remote radio heads requiring stable component supply across multi-year production cycles.

Supply support for MRF6S27015GNR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a leader in RF power solutions for wireless infrastructure, specializing in high-voltage LDMOS technology for cellular base stations.

The MRF6S27015GNR1 belongs to Freescale's MRF6S27015 family of 2.6 GHz RF power MOSFETs, engineered specifically for energy-efficient, thermally resilient amplification in CDMA, W-CDMA, and WiMAX base station transmitters.

FAQ

What is the maximum continuous drain current rating for MRF6S27015GNR1?

The MRF6S27015GNR1 does not specify a maximum continuous drain current (ID) rating directly; instead, its safe operating area is defined by maximum ratings including VDSS = +68 V, TJ = 225°C, and thermal resistance RθJC = 2.2°C/W. Under typical 3 W avg. operation at 28 V, IDQ = 160 mA establishes the quiescent point, and peak current remains within SOA limits per the device's large-signal impedance data.

Does MRF6S27015GNR1 require external input matching components?

No, MRF6S27015GNR1 is internally input-matched, as confirmed by measured S11 ≤ –18 dB across 2300–2700 MHz in a 50 Ω test fixture. The datasheet provides series-equivalent source impedance (e.g., 2.075 – j1.657 Ω @ 2600 MHz) for designing minimal external networks-typically just DC blocking and RF bypass capacitors.

What is the gate threshold voltage range for MRF6S27015GNR1?

The gate threshold voltage (VGS(th)) for MRF6S27015GNR1 is specified as 1.5–3.5 V (min–max) at VDS = 10 V and ID = 40 μA. This range ensures stable turn-on behavior across process variation and supports precise Class AB biasing using the typical VGS(Q) of 2.8 V at IDQ = 160 mA and VDD = 28 V.

Can MRF6S27015GNR1 operate reliably at 32 V drain supply?

Yes, MRF6S27015GNR1 is qualified for continuous operation up to 32 VDD, as explicitly stated in the Features section. This rating provides design margin for transient overvoltage events on 28 V supply rails, though standard W-CDMA characterization uses VDD = 28 V to meet efficiency and linearity targets.

What is the moisture sensitivity level (MSL) for MRF6S27015GNR1?

MRF6S27015GNR1 has a Moisture Sensitivity Level (MSL) of 3 per J-STD-020, with a peak reflow temperature rating of 260°C. This allows standard lead-free reflow profiles without preconditioning, provided the device is used within its floor life after dry pack opening.

MRF6S27015GNR1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
TO-270BA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
2.6GHz
Gain:
14dB
Voltage - Test:
28 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
160 mA
Power - Output:
3W
Voltage - Rated:
68 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-270-2 GULL

MRF6S27015GNR1 FAQ

1.How can I place an order for MRF6S27015GNR1 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF6S27015GNR1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF6S27015GNR1 reliable?

The price and inventory of MRF6S27015GNR1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF6S27015GNR1 is usually 5 days.

3.What payment methods are accepted for MRF6S27015GNR1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF6S27015GNR1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF6S27015GNR1?

MRF6S27015GNR1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF6S27015GNR1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF6S27015GNR1?

For technical support, including MRF6S27015GNR1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF6S27015GNR1 requirements.

6.How does Aetrix verify that MRF6S27015GNR1 is sourced from the original manufacturer or authorized distributors?

All MRF6S27015GNR1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF6S27015GNR1 meets industry standards.

7.What is the process for return or replacement of MRF6S27015GNR1?

All MRF6S27015GNR1 units undergo pre-shipment inspection (PSI). If there is an issue with MRF6S27015GNR1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF6S27015GNR1 part is unused and in its original packaging.

Return procedure for MRF6S27015GNR1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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