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NXP Semiconductors MRF6VP11KHR6

Part No.:
MRF6VP11KHR6
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-1230
Datasheet:
AetrixMRF6VP11KHR6.pdf
Description:
RF MOSFET LDMOS 50V NI1230
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,929

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Product details

Overview

MRF6VP11KHR6 from Freescale Semiconductor is a lateral N-channel enhancement-mode RF power MOSFET designed for pulse wideband amplification up to 150 MHz, delivering 1000 W peak (200 W avg.) output at 130 MHz with 50 Vdc drain supply, 26 dB power gain, and 71% drain efficiency in push-pull configuration - used in industrial RF heating, medical diathermy, and scientific plasma generation systems.

For engineers reviewing the MRF6VP11KHR6 datasheet, MRF6VP11KHR6 pinout, MRF6VP11KHR6 application, or MRF6VP11KHR6 equivalent, this page delivers verified electrical specs, thermal performance data, ESD protection class ratings, push-pull impedance matching guidance, and real-world test circuit component values per Freescale's Rev. 8 documentation.

Technical Context

The MRF6VP11KHR6 operates as an unmatched broadband RF power transistor optimized for pulsed operation (100 μs pulse width, 20% duty cycle) at VDD = 50 Vdc and IDQ = 150 mA, with series-equivalent large-signal impedance parameters characterized for balanced push-pull design - Zsource = 1.58 + j6.47 Ω and Zload = 4.6 + j1.85 Ω at 130 MHz.

It supports CW operation with adequate cooling (RθJC = 0.13 °C/W), handles 10:1 VSWR at 50 Vdc/130 MHz/1000 W peak, and features integrated ESD protection rated Class 2 HBM (2000 V), Class A MM (125 V), and Class IV CDM (2000 V).

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 1.8–150 MHz - enables broadband RF amplification across HF/VHF bands without retuning.
Peak Output Power 1000 W - sufficient for high-power industrial heating and plasma excitation applications.
Power Gain 26 dB typical - reduces driver stage complexity and improves system-level efficiency.
Drain Efficiency 71% typical - lowers thermal load and heatsink requirements in pulsed operation.
Junction Temperature 225°C max - allows high-temperature operation with robust electromigration MTTF modeling support.
VSWR Tolerance 10:1 @ 50 Vdc/130 MHz/1000 W peak - ensures ruggedness against mismatched loads in demanding RF environments.
Thermal Resistance RθJC = 0.13 °C/W (CW) - enables high-power continuous-wave operation with active cooling.

Pinout & Package

Package: CASE 375D–05 (NI–1230–4), ceramic/metal hermetic package with flanged base for direct heatsink mounting and low-inductance grounding.

Pin/Terminal Circuit Role Design Meaning
1 (RFinA / VGSA) Gate terminal A Input RF signal path for side A; requires DC blocking and gate bias network per push-pull layout.
2 (RFinB / VGSB) Gate terminal B Input RF signal path for side B; driven 180° out-of-phase with Pin 1 for balanced operation.
3 (RFoutA / VDSA) Drain terminal A High-power RF output node A; connected to output matching network and heatsink via flange.
4 (RFoutB / VDSB) Drain terminal B High-power RF output node B; symmetric counterpart to Pin 3 in push-pull configuration.

Key Features

Feature Design Value
Push-pull optimized architecture Enables balanced differential drive with inherent common-mode rejection and reduced even-order harmonics.
Extended negative VGS range (–6.0 V) Supports deep Class C biasing for improved efficiency in pulsed RF amplifier stages.
Integrated ESD protection Meets JESD22-A114 (2 kV HBM), JESD22-A115 (125 V MM), and JESD22-C101 (2 kV CDM) standards.
Characterized large-signal impedances Zsource = 1.58 + j6.47 Ω and Zload = 4.6 + j1.85 Ω at 130 MHz simplify input/output matching network design.
Tape-and-reel packaging (R6 suffix) 150 units per 56 mm tape on 13-inch reel - compatible with automated SMT placement for production-scale assembly.

Applications

Industrial RF Heating Medical Diathermy Systems

Use Scenario: High-power RF energy delivery into conductive materials (e.g., plastic welding, semiconductor wafer processing) requiring stable 1000 W pulsed output.

IC Role / Device Role / Timing Role: Final-stage RF power amplifier operating at 13.56 MHz or 27.12 MHz ISM bands in pulsed mode (100 μs, 20% duty).

Use Value: 71% drain efficiency and 10:1 VSWR tolerance ensure consistent power delivery despite load variations during material heating cycles.

Use Scenario: Therapeutic tissue heating in physiotherapy equipment using controlled 27.12 MHz RF energy.

IC Role / Device Role / Timing Role: High-efficiency Class C RF power stage delivering regulated 200 W average power under strict safety and thermal constraints.

Use Value: 225°C junction rating and RθJC = 0.13 °C/W enable compact heatsink designs while maintaining IEC 60601-2-2 compliance.

Scientific Plasma Generation Broadband RF Test Equipment

Use Scenario: Sustaining low-pressure plasma in research reactors using 1.8–150 MHz tunable RF excitation.

IC Role / Device Role / Timing Role: Unmatched broadband amplifier driving resonant cavity loads with variable impedance across frequency sweep.

Use Value: Series-equivalent Zload = 4.6 + j1.85 Ω at 130 MHz provides validated starting point for wideband matching network synthesis.

Use Scenario: High-fidelity RF signal generation in lab-grade broadband amplifiers covering HF/VHF spectrum.

IC Role / Device Role / Timing Role: Linearized push-pull output stage supporting multi-tone and modulated signals up to 150 MHz.

Use Value: 26 dB power gain and –16 dB input return loss reduce driver complexity and improve system noise figure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP MRFE6VP61KHSR5 Same 1.8–150 MHz range and 1000 W peak rating but uses different package (SOT-1229) and has lower RθJC (0.11 °C/W); no documented push-pull impedance characterization. Preferred for space-constrained CW designs requiring superior thermal resistance; less suitable for legacy push-pull layouts relying on MRF6VP11KHR6's Zsource/Zload data. Select when board redesign permits new footprint and thermal interface; verify matching network re-optimization.
Ampleon BLF188XR Higher frequency range (1.8–230 MHz), same 1000 W peak, but rated for 65 V VDD and lacks published 10:1 VSWR capability at 130 MHz. Better suited for UHF broadcast and radar pulse amplifiers; not validated for industrial heating loads with high VSWR exposure. Choose for extended bandwidth needs where 230 MHz coverage is required and VSWR stress is mitigated by circulator protection.

Compared with MRF6VP11KHR6, MRFE6VP61KHSR5 offers marginally better thermal performance but requires PCB redesign and lacks push-pull impedance reference data, while BLF188XR extends upper frequency range at the cost of unverified VSWR ruggedness - making MRF6VP11KHR6 uniquely suited for established 130 MHz industrial and medical pulsed systems.

Availability

MRF6VP11KHR6 is available at Aetrix Electronics and suitable for industrial RF heating, medical diathermy, scientific plasma generation, broadband test equipment, and high-reliability pulsed amplifier applications requiring stable component supply and long-term lifecycle continuity.

Supply support for MRF6VP11KHR6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in RF power solutions, specializing in high-voltage LDMOS transistors for industrial, medical, and scientific applications.

The MRF6VP11KHR6 belongs to Freescale's MRF6VP series of high-power lateral MOSFETs engineered specifically for rugged, wideband pulsed RF amplification - emphasizing VSWR tolerance, thermal reliability, and push-pull system integration.

FAQ

What is the maximum continuous drain voltage rating for the MRF6VP11KHR6?

The MRF6VP11KHR6 has a maximum drain-source voltage rating of +110 Vdc and –0.5 Vdc, as specified in Table 1 of the Freescale datasheet Rev. 8. This rating applies under static conditions and must be derated for pulsed or switching operation with voltage overshoot. The device is qualified for operation up to 50 Vdd in functional circuits, and exceeding 50 Vdc in application requires careful SOA validation using Figure 5 (DC Safe Operating Area).

Does the MRF6VP11KHR6 support continuous-wave (CW) operation?

Yes, the MRF6VP11KHR6 supports CW operation with adequate cooling - its thermal resistance RθJC is specified as 0.13 °C/W under 1000 W CW at 100 MHz and case temperature of 67°C. Freescale provides an Electromigration MTTF Calculator and AN1955 Thermal Measurement Methodology to support reliable CW design. However, full 1000 W CW requires aggressive heatsinking and airflow due to its 225°C max junction temperature limit.

What does the "R6" suffix in MRF6VP11KHR6 indicate?

The "R6" suffix denotes tape-and-reel packaging: 150 units per 56 mm wide carrier tape on a 13-inch reel. This format is optimized for automated surface-mount assembly. In contrast, the "R5" suffix (e.g., MRF6VP11KGSR5) indicates 50 units per same-width tape. Both variants share identical electrical and thermal specifications; only packaging quantity and mechanical outline (CASE 375D–05 vs. CASE 2282–02) differ.

How is the MRF6VP11KHR6 configured for push-pull operation?

The MRF6VP11KHR6 is explicitly designed for push-pull use, with two independent gate (Pins 1 & 2) and drain (Pins 3 & 4) terminals enabling balanced 180° phase-driven operation. Freescale's test circuit (Figure 2) and impedance data (Figure 14) assume this configuration - Zsource = 1.58 + j6.47 Ω and Zload = 4.6 + j1.85 Ω are measured gate-to-gate and drain-to-drain, respectively. Lead-forming is not applied before functional testing to preserve straight-lead integrity for gull-wing variants.

What ESD protection level does the MRF6VP11KHR6 provide?

The MRF6VP11KHR6 provides integrated ESD protection meeting Class 2 Human Body Model (2000 V), Class A Machine Model (125 V), and Class IV Charge Device Model (2000 V), as confirmed in Table 3 of the datasheet. These ratings reflect factory-tested performance and eliminate need for external ESD clamps in most RF front-end layouts - though proper PCB grounding and handling protocols remain essential during assembly and field service of the MRF6VP11KHR6.

MRF6VP11KHR6 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-1230
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Technology:
LDMOS
Configuration:
Dual
Frequency:
130MHz
Gain:
26dB
Voltage - Test:
50 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
150 mA
Power - Output:
1000W
Voltage - Rated:
110 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-1230

MRF6VP11KHR6 FAQ

1.How can I place an order for MRF6VP11KHR6 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF6VP11KHR6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF6VP11KHR6 reliable?

The price and inventory of MRF6VP11KHR6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF6VP11KHR6 is usually 5 days.

3.What payment methods are accepted for MRF6VP11KHR6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF6VP11KHR6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF6VP11KHR6?

MRF6VP11KHR6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF6VP11KHR6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF6VP11KHR6?

For technical support, including MRF6VP11KHR6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF6VP11KHR6 requirements.

6.How does Aetrix verify that MRF6VP11KHR6 is sourced from the original manufacturer or authorized distributors?

All MRF6VP11KHR6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF6VP11KHR6 meets industry standards.

7.What is the process for return or replacement of MRF6VP11KHR6?

All MRF6VP11KHR6 units undergo pre-shipment inspection (PSI). If there is an issue with MRF6VP11KHR6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF6VP11KHR6 part is unused and in its original packaging.

Return procedure for MRF6VP11KHR6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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