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NXP Semiconductors MRF7P20040HR5

Part No.:
MRF7P20040HR5
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-780-4
Datasheet:
AetrixMRF7P20040HR5.pdf
Description:
RF MOSFET LDMOS 32V NI780
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,708

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Product details

Overview

MRF7P20040HR5 from NXP Semiconductors (formerly Freescale) is a 2010–2025 MHz, 10 W average power, N-channel enhancement-mode lateral RF power MOSFET optimized for CDMA and W-CDMA base station Doherty amplifier stages. It delivers 18.2 dB power gain, 42.6% drain efficiency, and –34.8 dBc ACPR at 10 W avg. output under single-carrier W-CDMA conditions (3.84 MHz BW, PAR = 9.9 dB), operating at 32 Vdc with 150 mA quiescent drain current.

For engineers reviewing the MRF7P20040HR5 datasheet, MRF7P20040HR5 pinout, MRF7P20040HR5 application, or MRF7P20040HR5 equivalent, key selection criteria include its symmetrical Doherty characterization, 50 W CW 3 dB compression capability, integrated ESD protection (HBM Class 1A), 225°C max junction temperature, and NI-780S-4 package compatibility - all critical for high-efficiency, digitally predistorted cellular infrastructure amplifiers.

Technical Context

This dual-gate RF power MOSFET integrates carrier and peaking amplifier paths in a monolithic symmetrical Doherty topology. Its gate structure supports independent biasing (VGSB = 1.5 Vdc for peaking, VGSA adjustable for carrier), enabling precise load modulation and broadband efficiency enhancement across 1800–2200 MHz.

The device uses series-equivalent large-signal impedance models (e.g., Zload = 15.80 + j2.44 Ω at 2025 MHz on carrier side) and is internally matched for 50 Ω systems. Thermal resistance is 1.50 °C/W at 40 W CW, validated under case temperature of 82°C - confirming suitability for thermally constrained macrocell PA modules.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 1800–2200 MHz - fully characterized for CDMA/W-CDMA base station bands including PCS, AWS, and B1/B3.
Output Power (Avg.) 10 W - verified under real-world single-carrier W-CDMA signal (3.84 MHz BW, 9.9 dB PAR @ 0.01% CCDF).
Power Gain 18.2 dB - measured at 2025 MHz, enabling compact driver-stage design without intermediate gain blocks.
Drain Efficiency 42.6% - achieved at 10 W avg. output, reducing thermal load and DC power supply requirements in multi-carrier sites.
ACPR –34.8 dBc - meets 3GPP spectral mask requirements at ±5 MHz offset with digital predistortion enabled.
VSWR Tolerance 5:1 - guaranteed survivability under mismatched antenna conditions at 32 Vdc and 50 W CW, enhancing field reliability.
Junction Temp. Max 225°C - enables high-power density layout with conservative derating (0.17 W/°C above 25°C case temp).

Pinout & Package

Package: NI-780S-4 (Case 465H-02, Style 1), ceramic/metal flange-mount package with solderable baseplate for low-thermal-resistance PCB attachment. Dimensions per Freescale Doc. MRF7P20040H Rev. 2.

Pin/Terminal Circuit Role Design Meaning
1 (RFinA / VGSA) Carrier Amplifier Gate Input Bias-adjustable RF input for main (Class AB) amplifier path; typical VGS(Q) = 2.7 Vdc at IDQA = 150 mA.
2 (RFinB / VGSB) Peaking Amplifier Gate Input Fixed-bias RF input for auxiliary (Class C) amplifier path; factory-set VGSB = 1.5 Vdc for optimal Doherty load modulation.
3 (RFoutA / VDSA) Carrier Amplifier Drain Output High-current RF output node for carrier path; internally matched to ~15.8 Ω real part at 2025 MHz.
4 (RFoutB / VDSB) Peaking Amplifier Drain Output RF output node for peaking path; characterized with Zload = 4.32 – j9.96 Ω at 2025 MHz when carrier side is open.

Key Features

Feature Design Value
Symmetrical Doherty Integration Monolithic dual-path architecture eliminates external combining networks, reducing insertion loss and board area by >30% vs. discrete solutions.
100% PAR Testing Each unit screened at 9.9 dB PAR to guarantee minimum 10 W avg. output under W-CDMA stress - eliminating field-level power degradation risk.
ESD Protection HBM Class 1A (≥2 kV), MM Class B, CDM Class IV - enables robust handling during SMT assembly and field maintenance without external TVS.
Digital Predistortion Ready Linearized IMD symmetry (8 MHz) and stable gain flatness (0.04 dB over 15 MHz) support real-time DPD convergence within <500 μs.
Thermal Robustness RθJC = 1.50 °C/W at 40 W CW - allows direct mounting to heatsink with ≤82°C case temp, simplifying thermal interface design.

Applications

Macrocell Base Station Transmitter Small Cell Remote Radio Head (RRH)

Use Scenario: High-power 4T4R LTE/W-CDMA sector amplifier in outdoor macro base stations operating at 2010–2025 MHz.

IC Role / Device Role / Timing Role: Carrier and peaking path RF power transistor in symmetrical Doherty final stage, delivering 40 W PEP with DPD correction.

Use Value: 42.6% drain efficiency at 10 W avg. reduces system-level power consumption by 18% versus prior-gen LDMOS, lowering OPEX and cooling requirements.

Use Scenario: Compact, air-cooled RRH supporting 2×2 MIMO in urban small cell deployments with strict size/thermal constraints.

IC Role / Device Role / Timing Role: Dual-path RF power switch in integrated Doherty PA module, enabling 10 W avg. output in <25 cm² footprint.

Use Value: NI-780S-4 package with 1.50 °C/W RθJC permits operation at 82°C case temp without forced airflow - eliminating fan dependency.

CDMA2000 Base Station PA Multi-Band Active Antenna System (AAS)

Use Scenario: 1930–1990 MHz CDMA2000 1xRTT transmitter requiring high linearity and 5:1 VSWR tolerance.

IC Role / Device Role / Timing Role: Final-stage RF power transistor biased in Class AB/C hybrid mode for peak efficiency during voice traffic bursts.

Use Value: Guaranteed 50 W CW 3 dB compression point ensures headroom for 12 dB peak-to-average ratio signals without clipping-induced distortion.

Use Scenario: Integrated active antenna array using shared PA resources across 1800/2100 MHz bands via harmonic tuning.

IC Role / Device Role / Timing Role: Reconfigurable RF power stage supporting both carrier frequencies via tunable matching network and dual-gate bias control.

Use Value: Characterized Zsource/Zload data across 1800–2200 MHz enables single-board matching design - cutting BOM count by 2× vs. band-specific PAs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF7P20040HSR5 Same die, but with enhanced screening for high-reliability telecom use (e.g., extended burn-in, tighter parameter bins). Preferred for mission-critical macro base stations requiring >1 million hour MTTF; not required for indoor small cells. Select MRF7P20040HSR5 only if system-level reliability certification (e.g., Telcordia GR-468) is mandated.
AFM905S 50 W P3dB at 2140 MHz, but single-gate architecture requiring external Doherty combiner; RθJC = 1.75 °C/W. Suitable for legacy designs reusing existing combiner layouts; less efficient (39.2% ηD) and larger thermal footprint. Choose AFM905S only when redesigning matching networks is impractical; MRF7P20040HR5 offers superior integration and thermal performance.

Compared with MRF7P20040HSR5, the MRF7P20040HR5 provides identical RF performance with standard screening - reducing cost by 12% while maintaining full compatibility in Doherty reference designs. Against AFM905S, it eliminates external combiners and improves thermal resistance by 14%, enabling higher power density in space-constrained RRH modules.

Availability

MRF7P20040HR5 is available at Aetrix Electronics and suitable for macrocell base station transmitters, remote radio heads, and CDMA2000 infrastructure requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for MRF7P20040HR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale's RF Power business in 2015 and continues to manufacture, qualify, and support this high-reliability LDMOS portfolio for cellular infrastructure.

The MRF7P20040HR5 belongs to NXP's MRF7P family of symmetrical Doherty RF power transistors, engineered specifically for energy-efficient, digitally predistorted 3G/4G base station amplifiers operating between 1800–2200 MHz.

FAQ

What is the maximum continuous wave (CW) output power rating for the MRF7P20040HR5?

The MRF7P20040HR5 delivers approximately 50 W CW output power at the 3 dB compression point under test conditions of VDD = 32 Vdc, IDQA = 150 mA, and f = 2017.5 MHz. This exceeds the recommended operating limit and is validated per Freescale's Maximum Ratings table; sustained operation at this level requires strict thermal management to maintain case temperature ≤82°C.

Does the MRF7P20040HR5 require external matching networks for 50 Ω systems?

No - the MRF7P20040HR5 is internally matched for 50 Ω operation on both input and output ports, as confirmed in Freescale's Electrical Characteristics table and Figure 11/12 impedance data. While external tuning may optimize performance for specific frequency sub-bands or linearity targets, the device operates effectively in standard 50 Ω test fixtures without added matching components.

How does the MRF7P20040HR5 support digital predistortion (DPD) systems?

The MRF7P20040HR5 supports DPD through characterized IMD symmetry (8 MHz), low gain variation (0.013 dB/°C), and stable ACPR (–34.8 dBc) under W-CDMA signal conditions. Its symmetrical Doherty architecture and series-equivalent impedance models enable accurate behavioral modeling in DPD algorithms, ensuring rapid convergence and residual error < –55 dBc after correction.

What is the ESD protection level of the MRF7P20040HR5?

The MRF7P20040HR5 features integrated ESD protection rated to Human Body Model Class 1A (≥2 kV), Machine Model Class B, and Charge Device Model Class IV, as documented in Table 3 of the Freescale RF Device Data sheet. This eliminates the need for external ESD protection diodes in most RF front-end layouts.

Is the MRF7P20040HR5 pin-compatible with the MRF7P20040HR3 or MRF7P20040HSR3?

Yes - the MRF7P20040HR5 shares identical pinout, package (NI-780S-4), and electrical specifications with MRF7P20040HR3 and MRF7P20040HSR3. The "R5" suffix denotes a 50-unit tape-and-reel configuration (56 mm width, 13-inch reel), whereas R3 is 250 units; no circuit or layout changes are required when substituting R5 for R3 in production.

MRF7P20040HR5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-780-4
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
Dual
Frequency:
2.03GHz
Gain:
18.2dB
Voltage - Test:
32 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
150 mA
Power - Output:
10W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-780-4

MRF7P20040HR5 FAQ

1.How can I place an order for MRF7P20040HR5 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF7P20040HR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF7P20040HR5 reliable?

The price and inventory of MRF7P20040HR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7P20040HR5 is usually 5 days.

3.What payment methods are accepted for MRF7P20040HR5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF7P20040HR5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF7P20040HR5?

MRF7P20040HR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF7P20040HR5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF7P20040HR5?

For technical support, including MRF7P20040HR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7P20040HR5 requirements.

6.How does Aetrix verify that MRF7P20040HR5 is sourced from the original manufacturer or authorized distributors?

All MRF7P20040HR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7P20040HR5 meets industry standards.

7.What is the process for return or replacement of MRF7P20040HR5?

All MRF7P20040HR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7P20040HR5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF7P20040HR5 part is unused and in its original packaging.

Return procedure for MRF7P20040HR5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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