NXP Semiconductors MRF7S18125AHR3
- Part No.:
- MRF7S18125AHR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-957A
- Datasheet:
-
MRF7S18125AHR3.pdf
- Description:
- RF MOSFET LDMOS 28V NI780
- Quantity:
- Payment:

- Shipping:

Inventory:2,281
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Product details
Overview
MRF7S18125AHR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for GSM and GSM EDGE base station final-stage amplification at 1805–1880 MHz. It delivers 125 W CW output at 28 V, achieves 17 dB power gain and 55% drain efficiency in GSM mode, and supports Class AB/C operation with 5:1 VSWR tolerance at 125 W.
For engineers reviewing the MRF7S18125AHR3 datasheet, MRF7S18125AHR3 pinout, MRF7S18125AHR3 application, or MRF7S18125AHR3 equivalent, key selection criteria include its 1805–1880 MHz bandwidth, 140 W P1dB compression point, integrated ESD protection (HBM Class 1B), NI-780 package with drain-gate-source terminal assignment, and thermal resistance of 0.31 °C/W at 125 W CW.
Technical Context
This device employs a laterally diffused MOS (LDMOS) structure optimized for high-efficiency, high-linearity cellular infrastructure amplification. Its internally matched input and output enable direct integration into 50 Ω systems without external matching networks, and it operates with fixed 28 V DC supply and 1100 mA quiescent drain current.
The MRF7S18125AHR3 is characterized using series-equivalent large-signal impedance parameters (e.g., Zsource = 1.18 − j2.66 Ω, Zload = 1.34 − j2.02 Ω at 1840 MHz), supporting precise load-pull design. It sustains junction temperatures up to 225 °C and features RoHS-compliant packaging in tape-and-reel (250 units per 56 mm, 13-inch reel).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1805–1880 MHz - Full-band operation across GSM/EDGE uplink/downlink segments without retuning. |
| Output Power (CW) | 125 W - Sustained continuous-wave output at 28 V, enabling high-power macrocell coverage. |
| P1dB Compression | 140 W - Linear operating headroom above rated CW output, critical for peak-envelope handling in EDGE signals. |
| Power Gain | 17 dB - Delivers >50× voltage gain, reducing driver stage complexity in multi-stage PA designs. |
| Drain Efficiency (GSM) | 55% - Minimizes heat generation and power supply demand in energy-sensitive base station cabinets. |
| VSWR Tolerance | 5:1 @ 125 W - Survives antenna mismatch events without damage, improving system reliability in field deployments. |
| Junction Temp. Max | 225 °C - Enables high-power density operation with appropriate heatsinking per RθJC = 0.31 °C/W. |
| ESD Rating | HBM Class 1B (≥500 V) - Integrated protection reduces need for external transient suppression on gate lines. |
Pinout & Package
Package: NI-780 (Case 465-06, Style 1), ceramic/metal hermetic package with flange-mount thermal interface. Dimensions: 33.91–34.16 mm × 9.65–9.91 mm × 3.18–4.32 mm (L × W × H), flange thickness 0.057–0.067 inch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | High-power RF output node | Connected directly to heatsink via flange; carries full 125 W RF output current and DC supply (VDD = 28 V). |
| 2. Gate | Control electrode for channel conduction | Accepts bias voltage (VGS(Q) = 2.7 V typ.) and RF drive; requires ESD-safe handling and stable gate bias network. |
| 3. Source | Reference node and RF return path | DC ground reference and RF return; tied to system ground plane; critical for stability and thermal path continuity. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Eliminates discrete matching components at 1805–1880 MHz, reducing PCB area and tuning labor in production. |
| Series-equivalent Z-parameters | Published source/load impedances (e.g., Zload = 1.34 − j2.02 Ω @ 1840 MHz) enable accurate PA synthesis without de-embedding. |
| Integrated ESD protection | HBM Class 1B, MM Class A, CDM Class IV - allows safe handling and eliminates gate-series resistors in most layouts. |
| Thermal robustness | RθJC = 0.31 °C/W at 125 W CW - enables compact heatsink designs while maintaining TJ < 225 °C under full load. |
| Tape-and-reel packaging | R3 suffix = 250 units per 56 mm, 13-inch reel - supports automated SMT placement in high-volume base station PA module assembly. |
Applications
| GSM Macrocell Transmitter | GSM EDGE Base Station PA |
|---|---|
|
Use Scenario: Final-stage power amplifier in 3-sector macrocell BTS operating at 1805–1880 MHz with 125 W CW output requirement. IC Role / Device Role / Timing Role: High-efficiency RF power transistor delivering linear amplification for GMSK-modulated carriers. Use Value: 55% drain efficiency reduces cooling load by ~20% vs. typical 45% alternatives, lowering total system power consumption. |
Use Scenario: Linear PA stage in EDGE-compliant base station supporting 8-PSK modulation across full 1805–1880 MHz band. IC Role / Device Role / Timing Role: High-linearity RF power MOSFET maintaining EVM ≤1.75% rms and spectral regrowth ≤−63 dBc at 400 kHz offset. Use Value: Meets 3GPP TS 45.005 spectral mask requirements without digital pre-distortion (DPD) at 57 W avg. output. |
| Multi-Carrier GSM Amplifier | Field-Deployable Remote Radio Head |
|
Use Scenario: Two-tone or multi-carrier amplification in distributed antenna systems requiring IMD symmetry <8 MHz and VBW resonance at 35 MHz. IC Role / Device Role / Timing Role: Broadband RF power device with 0.8 dB gain flatness over 75 MHz bandwidth at 125 W CW. Use Value: Supports simultaneous amplification of up to 4 GSM carriers within 75 MHz span without intermodulation degradation. |
Use Scenario: Compact, ruggedized PA module mounted directly at cell tower antenna, exposed to −30°C to +85°C ambient. IC Role / Device Role / Timing Role: Thermally stable RF transistor with ΔG = 0.016 dB/°C gain drift and ΔP1dB = 0.01 dBm/°C output variation. Use Value: Maintains consistent output power and gain across temperature extremes, eliminating need for closed-loop bias compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MRFE6VP61K25HR5 | Higher P1dB (180 W), wider bandwidth (1805–2200 MHz), higher VDD rating (32 V), but RθJC = 0.35 °C/W. | Better suited for wideband LTE+GSM coexistence; requires larger heatsink for same thermal margin. | Select when future-proofing for 2.1 GHz bands or needing >140 W linear headroom. |
| Qorvo QPD1025 | Same 1805–1880 MHz band, 125 W CW, but GaN-on-SiC technology; RθJC = 0.25 °C/W, VDD = 50 V, no internal matching. | Requires external input/output matching; superior efficiency (65%) but higher gate drive complexity. | Select when maximizing efficiency and thermal margin is critical, and matching network design resources are available. |
Compared with NXP MRFE6VP61K25HR5 and Qorvo QPD1025, the MRF7S18125AHR3 offers optimal balance of proven LDMOS reliability, fully integrated matching, and cost-effective manufacturability for dedicated GSM/EDGE macrocell deployments - especially where legacy design reuse and simplified qualification are priorities.
Availability
MRF7S18125AHR3 is available at Aetrix Electronics and suitable for GSM macrocell transmitters, EDGE base station power amplifiers, multi-carrier DAS nodes, and remote radio heads requiring stable component supply and long-term lifecycle support.
Supply support for MRF7S18125AHR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a pioneer in RF power LDMOS technology, specializing in high-reliability semiconductor solutions for wireless infrastructure.
The MRF7S18125AHR3 belongs to Freescale's MRF7S family of RF power transistors, engineered specifically for high-efficiency, high-linearity amplification in cellular base stations operating in the 1.8–2.2 GHz bands.
FAQ
What is the maximum continuous drain current rating for the MRF7S18125AHR3?
The MRF7S18125AHR3 does not specify a maximum continuous drain current (ID) rating independently; instead, its safe operating area is defined by VDD = 28 V, Pout = 125 W CW, and TC = 80 °C. Under these conditions, typical IDQ = 1100 mA, and peak pulsed current reaches ~13.5 A at P1dB. The absolute maximum VDSS = +65 Vdc and TJ = 225 °C govern electrical and thermal limits-not current alone.
Does the MRF7S18125AHR3 require external matching components in a 50 Ω system?
No - the MRF7S18125AHR3 is internally matched for 50 Ω operation across 1805–1880 MHz, as confirmed in Table 4 footnote "Part internally matched both on input and output." Freescale's test circuit (Figure 1) uses only DC blocking and bypass capacitors; no series/shunt resonators or transmission-line transformers are needed for fundamental-band operation.
What is the gate threshold voltage range for the MRF7S18125AHR3?
The gate threshold voltage (VGS(th)) for the MRF7S18125AHR3 is specified as 1.2 V (min) to 2.7 V (max), measured at VDS = 10 Vdc and ID = 316 μAdc (Table 4). This range ensures consistent turn-on behavior across process variation while allowing stable Class AB biasing at VGS(Q) = 2.7 V typical.
Can the MRF7S18125AHR3 be used in Class C mode for GSM applications?
Yes - the MRF7S18125AHR3 is explicitly qualified for both Class AB and Class C operation in GSM and GSM EDGE base station applications (first paragraph of datasheet). Its high gain, low distortion, and 5:1 VSWR tolerance make it suitable for saturated Class C operation where efficiency is prioritized over linearity, such as in constant-envelope GMSK transmission.
What is the thermal resistance junction-to-case (RθJC) for the MRF7S18125AHR3 at 125 W CW?
The thermal resistance junction-to-case (RθJC) for the MRF7S18125AHR3 is 0.31 °C/W when operated at 125 W CW with case temperature maintained at 80 °C (Table 2). This value assumes proper mounting to a flat, smooth heatsink with recommended torque and thermal interface material, and is validated per AN1955 methodology.
MRF7S18125AHR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-957A
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.88GHz
- Gain:
- 17dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.1 A
- Power - Output:
- 125W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-780H-2L
MRF7S18125AHR3 FAQ
1.How can I place an order for MRF7S18125AHR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF7S18125AHR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF7S18125AHR3 reliable?
The price and inventory of MRF7S18125AHR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7S18125AHR3 is usually 5 days.
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MRF7S18125AHR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF7S18125AHR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF7S18125AHR3?
For technical support, including MRF7S18125AHR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7S18125AHR3 requirements.
6.How does Aetrix verify that MRF7S18125AHR3 is sourced from the original manufacturer or authorized distributors?
All MRF7S18125AHR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7S18125AHR3 meets industry standards.
7.What is the process for return or replacement of MRF7S18125AHR3?
All MRF7S18125AHR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7S18125AHR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF7S18125AHR3 part is unused and in its original packaging.
Return procedure for MRF7S18125AHR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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