NXP Semiconductors MRF7S18125AHR5
- Part No.:
- MRF7S18125AHR5
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-957A
- Datasheet:
-
MRF7S18125AHR5.pdf
- Description:
- RF MOSFET LDMOS 28V NI780
- Quantity:
- Payment:

- Shipping:

Inventory:4,086
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Product details
Overview
MRF7S18125AHR5 from NXP Semiconductors (formerly Freescale) is an N-channel enhancement-mode lateral RF power MOSFET designed for GSM and GSM EDGE base station final-stage amplification in the 1805–1880 MHz band. It delivers 125 W CW output at 28 V, achieves 17 dB power gain and 55% drain efficiency under GSM conditions, and supports Class AB/C operation with 5:1 VSWR tolerance at 125 W CW.
For engineers reviewing the MRF7S18125AHR5 datasheet, MRF7S18125AHR5 pinout, MRF7S18125AHR5 application, or MRF7S18125AHR5 equivalent, this device is selected for high-efficiency, high-linearity cellular infrastructure PA stages where thermal robustness, ESD protection, and broadband impedance matching are critical design requirements.
Technical Context
This LDMOS transistor operates with a fixed 28 V drain supply and 1100 mA quiescent drain current, enabling stable large-signal performance across the 1805–1880 MHz band. Its internally matched input and output impedances simplify external network design, while series-equivalent large-signal Z-parameters support accurate load-pull modeling.
The device features integrated ESD protection rated to Human Body Model Class 1B, Machine Model Class A, and Charge Device Model Class IV. Thermal resistance from junction to case is 0.31 °C/W at 125 W CW, supporting reliable operation up to 150 °C case temperature and 225 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1805–1880 MHz - Fully characterized for GSM/GSM EDGE base station bands; not rated outside this range. |
| Output Power (CW) | 125 W - Rated continuous-wave output at 28 V, 1100 mA IDQ, f = 1880 MHz; P1dB = 140 W CW. |
| Power Gain | 17 dB - Typical small-signal-to-large-signal conversion efficiency at 125 W CW; ±1.5 dB flatness over 75 MHz bandwidth. |
| Drain Efficiency | 55% - DC-to-RF conversion efficiency under GSM CW conditions; drops to 38% under GSM EDGE modulation. |
| VSWR Tolerance | 5:1 - Guaranteed survivability at 28 Vdc, 1840 MHz, 125 W CW without degradation or latch-up. |
| Junction Temperature | 225 °C - Maximum allowable operating junction temperature; MTTF > 10⁵ hours at TJ = 190 °C per Freescale calculator. |
| ESD Rating | HBM Class 1B - Minimum 1.5 kV human-body-model withstand; validated per JESD22-A114. |
Pinout & Package
Package: NI-780 (Case 465-06, Style 1), hermetically sealed ceramic/metal flange-mount package with integral heat slug. Dimensions: 34.16 mm × 9.91 mm × 4.32 mm (L×W×H); flange-mounted for direct thermal coupling to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | High-power RF output terminal | Connected to RF output matching network; carries full 125 W CW RF current and DC bias; requires low-inductance thermal path to heatsink. |
| 2. Gate | RF input control terminal | High-impedance control node; biased at ~2.7 Vdc quiescent; requires ESD-protected gate drive and stable DC blocking. |
| 3. Source | RF/DC common reference terminal | DC return path for IDQ; RF ground reference for input/output matching networks; bonded directly to flange for lowest inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Reduces external matching complexity: input Zsource ≈ 1.18 − j2.66 Ω and output Zload ≈ 1.34 − j2.02 Ω at 1840 MHz enable simplified 50 Ω interface design. |
| Integrated ESD protection | Validated HBM Class 1B, MM Class A, CDM Class IV - eliminates need for external gate protection diodes in production PA modules. |
| GSM EDGE linearity | EVM = 1.75% rms and spectral regrowth of –63 dBc @ 400 kHz offset - meets 3GPP TS 45.005 mask requirements for EDGE Class B transmitters. |
| Thermal robustness | RθJC = 0.31 °C/W at 125 W CW - enables compact heatsink designs with <10 °C rise above ambient at full power. |
| High VSWR survivability | Rated for 5:1 mismatch at 125 W CW, 1840 MHz - ensures field reliability in antenna-tuning or cable-fault scenarios without device failure. |
Applications
| GSM Base Station Transmitter | GSM EDGE Macrocell PA |
|---|---|
|
Use Scenario: Final-stage power amplifier in 1800 MHz GSM macrocell BTS operating at 125 W CW output. IC Role / Device Role / Timing Role: High-efficiency RF power switch delivering modulated carrier with minimal thermal drift. Use Value: 55% drain efficiency reduces cooling requirements and AC power draw; 17 dB gain simplifies driver stage design. |
Use Scenario: Linear PA in multi-carrier GSM EDGE base station supporting 57 W average output across full 1805–1880 MHz band. IC Role / Device Role / Timing Role: Broadband linear amplifier maintaining EVM ≤1.75% rms under EDGE modulation. Use Value: –63 dBc spectral regrowth at 400 kHz offset meets adjacent-channel leakage ratio (ACLR) specs without digital predistortion overhead. |
| Multi-Carrier Cellular Infrastructure | Field-Deployable Remote Radio Head |
|
Use Scenario: Two-tone intermodulation-critical PA in distributed antenna system (DAS) head-end requiring IMD symmetry <8 MHz at 125 W PEP. IC Role / Device Role / Timing Role: High-linearity RF power device suppressing third-order intermodulation products. Use Value: IMDsym = 8 MHz ensures balanced upper/lower sideband distortion, minimizing baseband correction complexity. |
Use Scenario: Compact, ruggedized RRH PA module operating outdoors with wide temperature range (–30°C to +85°C). IC Role / Device Role / Timing Role: Thermally stable RF power transistor with <0.016 dB/°C gain variation. Use Value: Minimal gain drift over temperature avoids real-time calibration; 225 °C max TJ enables derated operation in unventilated enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF7S18125AHSR3 | Different package: NI-780S (Case 465A-06), smaller footprint (20.70 mm × 9.91 mm), same electrical specs and pinout (Drain/Gate/Source). | Preferred for space-constrained RRH or blade-server PA modules where board area is limited. | Select MRF7S18125AHSR3 when mechanical envelope is tighter but thermal mass and mounting constraints allow smaller flange. |
| PD85018L | STMicroelectronics 1800 MHz LDMOS; 125 W CW, 17 dB gain, 54% efficiency; different pinout (Drain/Gate/Source/Sense), higher Ciss (380 pF vs 312 pF). | Requires redesigned gate bias network and output matching due to distinct Z-parameters and sense pin. | Choose PD85018L only if ST's qualification ecosystem or long-term supply assurance outweighs redesign effort. |
Compared with MRF7S18125AHR5, the MRF7S18125AHSR3 offers identical RF performance in a reduced footprint, while the PD85018L provides comparable output power but demands layout and bias circuit changes due to differing pin configuration and parasitic capacitance.
Availability
MRF7S18125AHR5 is available at Aetrix Electronics and suitable for GSM base station transmitters, GSM EDGE macrocell PAs, multi-carrier DAS head-ends, remote radio heads, and field-deployable cellular infrastructure requiring stable component supply and long-lifecycle support.
Supply support for MRF7S18125AHR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale Semiconductor in 2015 and maintains its RF Power portfolio for cellular infrastructure, broadcast, and industrial heating applications.
The MRF7S18125AHR5 belongs to the MRF7S family of high-efficiency LDMOS transistors engineered specifically for 1800–2000 MHz GSM/GSM EDGE base station final amplifiers demanding high linearity, thermal resilience, and VSWR ruggedness.
FAQ
What is the maximum continuous drain voltage rating for the MRF7S18125AHR5?
The MRF7S18125AHR5 has a maximum drain-source voltage rating (VDSS) of +65 Vdc. This rating applies under static off-state conditions; during RF operation, the device must be operated within the safe operating area defined by VDD = 28 Vdc and peak RF voltage swing constrained by the 5:1 VSWR survivability specification at 125 W CW. Exceeding 65 Vdc risks permanent breakdown.
Does the MRF7S18125AHR5 require external gate protection diodes?
No, the MRF7S18125AHR5 incorporates integrated ESD protection meeting HBM Class 1B (≥1.5 kV), Machine Model Class A, and CDM Class IV standards. External gate protection diodes are not required in standard GSM/GSM EDGE PA designs, provided PCB layout follows Freescale's recommended grounding and trace routing practices from AN1955 and EB212.
What is the typical gate quiescent voltage (VGS(Q)) for the MRF7S18125AHR5 at 28 V operation?
The typical gate quiescent voltage (VGS(Q)) for the MRF7S18125AHR5 is 2.7 Vdc when biased at VDD = 28 Vdc and IDQ = 1100 mA. This value is measured directly at the gate terminal under DC conditions; the fixture gate voltage (VGG(Q)) is higher (5.3 Vdc typical) due to an on-board resistive divider, but VGS(Q) reflects the actual device-level control voltage.
Can the MRF7S18125AHR5 be used in Class C amplifier configurations?
Yes, the MRF7S18125AHR5 is explicitly characterized for both Class AB and Class C operation in GSM and GSM EDGE base station applications. Its lateral LDMOS structure and optimized doping profile support efficient switching behavior in Class C, particularly for constant-envelope GSM GMSK modulation where harmonic content is managed by output filtering.
What thermal resistance value should be used for heatsink design with the MRF7S18125AHR5?
For heatsink thermal design, use RθJC = 0.31 °C/W - the junction-to-case thermal resistance measured at 125 W CW output and 80 °C case temperature. This value assumes proper mounting torque (15–20 in·lb), thermal interface material (e.g., 0.5 mm thick, 1.5 W/m·K conductivity), and full flange contact. Derating is required above 125 W CW per Freescale's MTTF calculator.
MRF7S18125AHR5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-957A
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.88GHz
- Gain:
- 17dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.1 A
- Power - Output:
- 125W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-780H-2L
MRF7S18125AHR5 FAQ
1.How can I place an order for MRF7S18125AHR5 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF7S18125AHR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF7S18125AHR5 reliable?
The price and inventory of MRF7S18125AHR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7S18125AHR5 is usually 5 days.
3.What payment methods are accepted for MRF7S18125AHR5?
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MRF7S18125AHR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF7S18125AHR5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF7S18125AHR5?
For technical support, including MRF7S18125AHR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7S18125AHR5 requirements.
6.How does Aetrix verify that MRF7S18125AHR5 is sourced from the original manufacturer or authorized distributors?
All MRF7S18125AHR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7S18125AHR5 meets industry standards.
7.What is the process for return or replacement of MRF7S18125AHR5?
All MRF7S18125AHR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7S18125AHR5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF7S18125AHR5 part is unused and in its original packaging.
Return procedure for MRF7S18125AHR5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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