NXP Semiconductors MRF7S18125BHSR3
- Part No.:
- MRF7S18125BHSR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-780S
- Datasheet:
-
MRF7S18125BHSR3.pdf
- Description:
- RF MOSFET LDMOS 28V NI780
- Quantity:
- Payment:

- Shipping:

Inventory:4,443
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Product details
Overview
MRF7S18125BHSR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for GSM and GSM EDGE base station amplifiers operating at 1930–1990 MHz. It delivers 125 W CW output at 28 V with 16.5 dB power gain and 55% drain efficiency, and supports 57 W average output under EDGE modulation with 2.6% EVM and −60 dBc spectral regrowth at 400 kHz offset.
For engineers reviewing the MRF7S18125BHSR3 datasheet, MRF7S18125BHSR3 pinout, MRF7S18125BHSR3 application, or MRF7S18125BHSR3 equivalent, key selection criteria include its NI-780S package, 1930–1990 MHz bandwidth, 125 W CW Pout capability, thermal resistance of 0.35 °C/W at 71 W CW, and integrated ESD protection rated Class 1B HBM.
Technical Context
This device employs a laterally diffused MOS (LDMOS) structure optimized for high-efficiency linear amplification in cellular infrastructure. Its internally matched input and output enable direct integration into 50 Ω systems without external matching networks, and it operates in Class AB or Class C with stable performance across −30°C to +85°C ambient temperature.
The MRF7S18125BHSR3 features series-equivalent large-signal impedance characterization for precise load-pull design, supports 5:1 VSWR tolerance at 125 W CW, and maintains <1.02 dB gain flatness over 60 MHz bandwidth - critical for wideband EDGE signal fidelity and adjacent channel leakage control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1930–1990 MHz - fully specified for GSM/EDGE band operation with validated performance across full bandwidth |
| Output Power (CW) | 125 W - guaranteed continuous-wave output at 28 V, 1100 mA quiescent current, enabling high-power macro base station stages |
| Power Gain | 16.5 dB typical - provides sufficient small-signal gain to drive final stage with minimal preceding amplification |
| Drain Efficiency | 55% at 125 W CW - reduces thermal load and power supply requirements in energy-sensitive base station deployments |
| P1dB Compression | 140 W CW - defines usable linear output range before significant distortion onset, supporting headroom for peak envelope power |
| Thermal Resistance | 0.35 °C/W at 71 W CW - enables predictable junction temperature rise for thermal management in forced-air or heatsink-cooled enclosures |
| EVM (EDGE) | 2.6% rms - meets 3GPP GSM EDGE linearity requirements for 8-PSK modulation fidelity |
| Spectral Regrowth | −60 dBc at 400 kHz offset - ensures compliance with ACPR masks for co-channel interference suppression |
Pinout & Package
Package: NI-780S (Case 465A-06, Style 1), flange-mounted ceramic/metal hermetic package with solderable baseplate for high-power thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. DRAIN | High-current RF output node | Connected to output matching network and heat sink; carries full RF output current and DC supply voltage (28 V) |
| 2. GATE | RF input control terminal | Bias-controlled terminal requiring stable DC gate voltage (~5.3 V typical) and RF input matching; sensitive to ESD |
| 5. SOURCE | Common reference and RF return path | Internally connected to flange; must be low-inductance RF ground for stability and thermal conduction |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Eliminates need for external input/output matching networks in standard 50 Ω test fixtures and production designs |
| Integrated ESD protection | HBM Class 1B (≥500 V), MM Class A, CDM Class IV - enables robust handling and assembly without additional protection circuitry |
| 5:1 VSWR ruggedness | Withstands 5:1 load mismatch at 125 W CW and 1960 MHz without degradation - enhances system reliability in antenna fault conditions |
| Tape-and-reel packaging | R3 suffix = 250 units per 56 mm, 13-inch reel - supports automated SMT placement in high-volume RF power amplifier module manufacturing |
| Lateral N-channel MOSFET | Superior thermal stability and higher fT vs. vertical MOSFETs - enables consistent gain and efficiency across temperature and frequency |
Applications
| GSM Macro Base Station Transmitter | GSM EDGE Multi-Carrier Amplifier |
|---|---|
Use Scenario: Final-stage RF power amplification in outdoor macro cell sites covering urban and suburban areas. IC Role / Device Role / Timing Role: High-efficiency RF power MOSFET delivering 125 W CW output in Class AB configuration. Use Value: 55% drain efficiency reduces cooling requirements and power supply sizing, while 16.5 dB gain minimizes driver stage complexity. | Use Scenario: Linear amplification of multi-carrier EDGE signals in distributed antenna systems (DAS). IC Role / Device Role / Timing Role: Final-stage LDMOS transistor operating under 57 W average output with 8-PSK modulation. Use Value: 2.6% EVM and −60 dBc spectral regrowth meet 3GPP TS 45.005 ACPR limits, ensuring clean multi-carrier transmission. |
| Wideband Cellular Repeaters | High-Power LTE Band 3 Uplink Booster |
Use Scenario: Bidirectional repeater unit amplifying uplink/downlink signals in remote rural coverage extension. IC Role / Device Role / Timing Role: Output stage transistor handling 125 W CW with 5:1 VSWR tolerance during antenna impedance variations. Use Value: Ruggedness against load mismatch prevents failure during antenna detuning or cable faults, improving field reliability. | Use Scenario: Uplink power booster in LTE FDD Band 3 (1710–1785 MHz) infrastructure where legacy GSM spectrum is repurposed. IC Role / Device Role / Timing Role: High-gain, high-linearity RF power amplifier operating near upper edge of specified 1930–1990 MHz band. Use Value: Verified gain flatness (1.02 dB over 60 MHz) and phase stability (3.3° deviation) support wideband LTE signal integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF7S18125BHR3 | Different package: NI-780 (Case 465-06) vs. NI-780S; thermal resistance 0.31 °C/W at 125 W CW vs. 0.35 °C/W at 71 W CW | Same RF specs but higher thermal conductivity; requires different PCB footprint and mounting hardware | Select MRF7S18125BHR3 when maximum thermal performance is prioritized and mechanical redesign is feasible |
| PD57018-E | STMicroelectronics 1800–2000 MHz 125 W LDMOS; 17 dB gain, 53% efficiency at 125 W; RoHS-compliant NI-780S package | Similar power and frequency rating but different biasing (VGSQ = 3.2 V typ.) and slightly lower ESD rating (HBM Class 1A) | Choose PD57018-E for dual-sourcing flexibility where identical NI-780S mechanical fit and 125 W CW capability are required |
Compared with MRF7S18125BHR3, the MRF7S18125BHSR3 trades marginal thermal resistance for standardized tape-and-reel logistics and compatibility with existing NI-780S assembly lines; versus PD57018-E, it offers superior ESD robustness and tighter gain flatness but requires Freescale-specific bias network tuning.
Availability
MRF7S18125BHSR3 is available at Aetrix Electronics and suitable for GSM macro base stations, EDGE multi-carrier amplifiers, and wideband cellular repeaters requiring stable component supply, long-lifecycle support, and traceable RF power transistor sourcing.
Supply support for MRF7S18125BHSR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in RF power solutions for wireless infrastructure, with deep expertise in LDMOS technology and cellular base station design.
The MRF7S18125BHSR3 belongs to Freescale's MRF7S family of high-efficiency RF power transistors engineered specifically for 1.8–2.0 GHz GSM/EDGE macro and micro base station applications demanding high linearity and ruggedness.
FAQ
What is the maximum operating junction temperature for the MRF7S18125BHSR3?
The MRF7S18125BHSR3 has a maximum operating junction temperature (TJ) of 225°C, as specified in Table 1 of the datasheet. This high limit supports reliable operation under sustained 125 W CW output with appropriate heatsinking. Thermal design must ensure that actual junction temperature remains below this value during all operating conditions, especially at elevated ambient temperatures or reduced airflow.
Does the MRF7S18125BHSR3 require external input/output matching networks?
No, the MRF7S18125BHSR3 is internally matched for 50 Ω systems, as confirmed in the Features section and Table 4 notes. Its input and output impedances are characterized and optimized for direct integration into standard 50 Ω test fixtures and production amplifiers, eliminating discrete matching components in many designs - though fine-tuning may still be needed for specific PA architectures or efficiency targets.
What is the gate quiescent voltage specification for the MRF7S18125BHSR3?
The gate quiescent voltage (VGS(Q)) for the MRF7S18125BHSR3 is 2.7 V typical at VDD = 28 Vdc and ID = 1100 mAdc (Table 4). The fixture gate voltage (VGG(Q)) is 4–7 V due to an on-board resistive divider; actual gate bias circuitry must deliver ~2.7 V to the gate terminal itself to achieve the specified 1100 mA quiescent current.
How does the MRF7S18125BHSR3 perform under GSM EDGE modulation?
Under GSM EDGE modulation at 57 W average output, the MRF7S18125BHSR3 achieves 17 dB power gain, 39% drain efficiency, 2.6% rms EVM, −60 dBc spectral regrowth at 400 kHz offset, and −74 dBc at 600 kHz offset - all verified across the 1930–1990 MHz band. These values meet 3GPP linearity and spectral mask requirements for commercial base station deployment.
Is the MRF7S18125BHSR3 RoHS compliant and what is its ESD rating?
Yes, the MRF7S18125BHSR3 is RoHS compliant and features integrated ESD protection rated per industry standards: Human Body Model Class 1B (≥500 V), Machine Model Class A, and Charge Device Model Class IV - as documented in Table 3. This eliminates need for external ESD protection diodes in most board-level implementations.
MRF7S18125BHSR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-780S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.93GHz
- Gain:
- 16.5dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.1 A
- Power - Output:
- 125W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-780S
MRF7S18125BHSR3 FAQ
1.How can I place an order for MRF7S18125BHSR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF7S18125BHSR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF7S18125BHSR3 reliable?
The price and inventory of MRF7S18125BHSR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7S18125BHSR3 is usually 5 days.
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MRF7S18125BHSR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF7S18125BHSR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF7S18125BHSR3?
For technical support, including MRF7S18125BHSR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7S18125BHSR3 requirements.
6.How does Aetrix verify that MRF7S18125BHSR3 is sourced from the original manufacturer or authorized distributors?
All MRF7S18125BHSR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7S18125BHSR3 meets industry standards.
7.What is the process for return or replacement of MRF7S18125BHSR3?
All MRF7S18125BHSR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7S18125BHSR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF7S18125BHSR3 part is unused and in its original packaging.
Return procedure for MRF7S18125BHSR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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