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NXP Semiconductors MRF7S21170HR3

Part No.:
MRF7S21170HR3
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
SOT-957A
Datasheet:
AetrixMRF7S21170HR3.pdf
Description:
RF MOSFET LDMOS 28V NI880H
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,699

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Product details

Overview

MRF7S21170HR3 from NXP Semiconductors (formerly Freescale) is a laterally diffused N-channel enhancement-mode RF power MOSFET designed for high-efficiency, high-linearity amplification in 2110–2170 MHz CDMA and W-CDMA base station transmitters. It delivers 50 W average output power at 28 V with 16 dB power gain and 31% drain efficiency under single-carrier W-CDMA conditions, and supports Class AB/C operation in multicarrier and Doherty amplifier architectures.

For engineers reviewing the MRF7S21170HR3 datasheet, MRF7S21170HR3 pinout, MRF7S21170HR3 application, or MRF7S21170HR3 equivalent, this device is selected for its guaranteed 5:1 VSWR ruggedness at 32 V, 170 W CW P1dB, integrated ESD protection (HBM Class 1A), and internal input/output matching optimized for 50 Ω systems in cellular infrastructure designs.

Technical Context

This LDMOS transistor operates as a final-stage RF power amplifier core in macrocell and remote radio head (RRH) transmitters. Its series-equivalent large-signal impedance parameters (e.g., Zsource = 4.40 – j9.42 Ω, Zload = 0.92 – j2.76 Ω at 2140 MHz) are characterized for direct integration into broadband matching networks without external harmonic tuning.

The device features a negative gate-source voltage range extended to –6.0 Vdc for stable Class C biasing, supports digital predistortion (DPD) correction with <–37 dBc ACPR at ±5 MHz offset, and maintains <0.015 dB/°C gain variation across –30°C to +85°C ambient temperature.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range2110–2170 MHz - Covers full PCS/UMTS Band I uplink and downlink for CDMA/W-CDMA base stations.
POUT @ 1 dB Compression≈170 W CW - Enables high peak-envelope-power (PEP) operation in multicarrier and Doherty configurations.
Power Gain (Gps)16 dB typical - Delivers sufficient small-signal gain to reduce driver stage complexity in multi-stage PA designs.
Drain Efficiency (ηD)31% typical at 50 W avg - Reduces thermal load and DC power consumption in thermally constrained RRH enclosures.
VSWR Tolerance5:1 @ 32 Vdc, 2140 MHz - Ensures survivability during antenna mismatch events without external circulator or isolator.
ESD ProtectionHBM Class 1A (≥2 kV), MM Class B - Eliminates need for discrete ESD clamps in production PCB layouts.
Junction Temperature (TJ)225°C maximum - Supports high-power density packaging with thermal resistance RθJC = 0.31°C/W at 170 W CW.

Pinout & Package

Package: NI-880S (Case 465C-03), flanged ceramic/metal hermetic package with solderable baseplate for direct thermal mounting to heatsink. Dimensions: 22.56 mm × 22.58 mm × 4.45 mm (L × W × H), 3-pin configuration (Gate, Drain, Source).

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Gate)Control electrodeAccepts DC bias (VGS(Q) = 2.7 Vdc typical) and RF drive; internally matched to ~5 Ω real + reactive impedance for broadband 50 Ω interface.
Pin 2 (Drain)High-power RF output nodeDelivers 170 W CW output; connected to case via internal metalization; requires low-inductance RF grounding and thermal interface to heatsink.
Pin 3 (Source)Common reference terminalDC return path for quiescent current (IDQ = 1400 mA); tied to ground plane; serves as RF return for both gate and drain matching networks.

Key Features

Feature Design Value
Internally matched I/OEliminates need for external broadband matching components-reduces bill-of-materials and layout area in compact RRH modules.
Optimized for Doherty topologyEnables >10% efficiency improvement over Class AB in back-off regions typical of OFDMA/W-CDMA signals with 7.5 dB PAR.
100% PAR-testedEach unit validated for ≥170 W CW output capability-ensures yield consistency in high-volume infrastructure production.
Enhanced negative VGS range–6.0 Vdc rating allows deeper Class C biasing for improved efficiency in envelope-tracking or asymmetrical Doherty applications.
Series-equivalent impedance dataFull Zsource/Zload tables provided per frequency (2060–2220 MHz)-enables accurate EM-simulation of matching networks without de-embedding.

Applications

Macrocell Base Station Transmitter Remote Radio Head (RRH)

Use Scenario: High-power final-stage amplifier in outdoor macrocell BTS operating in UMTS Band I (2110–2170 MHz) with multicarrier W-CDMA signals.

IC Role / Device Role / Timing Role: RF power MOSFET delivering 50 W average output with <–37 dBc ACPR at ±5 MHz offset under 7.5 dB PAR input.

Use Value: 31% drain efficiency reduces cooling requirements and enables air-cooled chassis design; 5:1 VSWR tolerance ensures reliability during antenna detuning.

Use Scenario: Compact, thermally efficient PA module mounted directly on tower-mounted antenna array in LTE-Advanced distributed systems.

IC Role / Device Role / Timing Role: Final-stage LDMOS transistor in Doherty architecture supporting 2×20 MHz carrier aggregation with digital predistortion.

Use Value: Internal matching and 0.31°C/W thermal resistance enable <85°C case temperature at full 170 W PEP-meeting IP65 enclosure thermal limits.

WLL Point-to-Multipoint Base Station CDMA2000 Picocell Amplifier

Use Scenario: Fixed wireless access (FWA) base station serving rural broadband users in 2.1 GHz licensed spectrum with QPSK/16-QAM modulation.

IC Role / Device Role / Timing Role: Linear RF power amplifier operating in Class AB with 16 dB gain and 0.4 dB gain flatness over 60 MHz bandwidth.

Use Value: Low group delay variation (±1.7 ns) and <1.95° phase deviation preserve signal integrity for wideband OFDM symbols in high-speed data links.

Use Scenario: Indoor picocell repeater amplifier deployed in enterprise buildings supporting CDMA2000 1xEV-DO Rev. A traffic.

IC Role / Device Role / Timing Role: Medium-power PA core delivering 50 W avg. output with 6.1 dB output PAR handling and <–15 dB input return loss.

Use Value: Integrated ESD protection (HBM Class 1A) eliminates need for external TVS diodes-reducing component count and board space in space-constrained indoor units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF7S21170HSR3Different package: NI-880 (Case 465B-04); identical electrical specs and thermal performance; same pinout but smaller footprint (22.12 mm × 22.15 mm vs. 22.56 mm × 22.58 mm).Suitable for space-constrained RRH modules where 0.4 mm reduction in package length/width is critical; requires updated stencil and reflow profile due to different thermal mass.Select MRF7S21170HSR3 when board area is limited and thermal interface design accommodates lower-case-height mounting.
AFM906SHigher frequency range (1805–2200 MHz); slightly lower P1dB (150 W CW); higher gain (17.5 dB typ); same 225°C TJ and NI-880S package.Better suited for dual-band (PCS + UMTS) base stations requiring broader instantaneous bandwidth; less optimal for pure 2110–2170 MHz narrowband deployment due to reduced output power headroom.Choose AFM906S only if system requires simultaneous operation across 1805–2200 MHz with minimal gain ripple-otherwise MRF7S21170HR3 provides superior 2110–2170 MHz power density.

Compared with MRF7S21170HSR3 and AFM906S, the MRF7S21170HR3 offers the highest CW output power (170 W) specifically optimized for the 2110–2170 MHz band, making it the preferred choice for dedicated UMTS Band I macrocell and RRH deployments where spectral efficiency and thermal margin are prioritized over multi-band flexibility.

Availability

MRF7S21170HR3 is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, fixed wireless access (WLL) systems, and CDMA2000 picocell amplifiers requiring stable component supply, long-term lifecycle support, and traceable sourcing for telecom infrastructure programs.

Supply support for MRF7S21170HR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale Semiconductor in 2015 and continues to manufacture, support, and extend the RF Power portfolio for cellular infrastructure, broadcast, and industrial heating applications.

The MRF7S21170HR3 belongs to the MRF7S family of high-efficiency LDMOS transistors engineered specifically for 3G/4G base station power amplifiers operating between 1.8–2.2 GHz, emphasizing ruggedness, linearity, and thermal reliability in continuous-wave and modulated signal environments.

FAQ

What is the maximum continuous drain current rating for the MRF7S21170HR3?

The MRF7S21170HR3 does not specify a maximum continuous drain current (ID) rating independent of thermal conditions. Its safe operating area is defined by junction temperature (TJ ≤ 225°C), case temperature (TC ≤ 150°C), and thermal resistance (RθJC = 0.31°C/W at 170 W CW). At 28 V and 1400 mA quiescent current, the device delivers 50 W average output in W-CDMA operation-current must be derated per thermal design to maintain TJ < 225°C.

Does the MRF7S21170HR3 require external input/output matching networks?

No-the MRF7S21170HR3 is internally matched for 50 Ω systems across 2110–2170 MHz. Freescale's datasheet provides series-equivalent source and load impedances (e.g., Zsource = 4.40 – j9.42 Ω, Zload = 0.92 – j2.76 Ω at 2140 MHz) to guide matching network design, but no discrete matching components are required for basic functional operation in the specified band.

What is the gate threshold voltage range for the MRF7S21170HR3?

The gate threshold voltage (VGS(th)) for the MRF7S21170HR3 is specified as 1.2 Vdc minimum to 2.7 Vdc maximum, measured at VDS = 10 Vdc and ID = 372 µAdc. This range ensures consistent turn-on behavior across process variation while supporting stable Class AB biasing with VGS(Q) = 2.7 Vdc typical at IDQ = 1400 mA.

Can the MRF7S21170HR3 be used in Class C amplifier configurations?

Yes-the MRF7S21170HR3 is explicitly designed for Class C operation, featuring an extended negative gate-source voltage range (–6.0 Vdc) to support deep cutoff biasing. Its optimized transconductance and capacitance profile (Crss = 0.9 pF, Coss = 703 pF) enable high-efficiency switching-mode amplification in tuned RF power stages for narrowband applications.

What is the thermal resistance from junction to case (RθJC) for the MRF7S21170HR3?

The thermal resistance from junction to case (RθJC) for the MRF7S21170HR3 is 0.31°C/W when operating at 170 W CW with case temperature maintained at 80°C. This value is measured per AN1955 methodology and reflects the device's high thermal conductivity ceramic/metal package (NI-880S, Case 465C-03), enabling efficient heat transfer to external heatsinks in base station PA modules.

MRF7S21170HR3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SOT-957A
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
LDMOS
Configuration:
-
Frequency:
2.17GHz
Gain:
16dB
Voltage - Test:
28 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
1.4 A
Power - Output:
50W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
NI-880H-2L

MRF7S21170HR3 FAQ

1.How can I place an order for MRF7S21170HR3 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF7S21170HR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF7S21170HR3 reliable?

The price and inventory of MRF7S21170HR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7S21170HR3 is usually 5 days.

3.What payment methods are accepted for MRF7S21170HR3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF7S21170HR3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF7S21170HR3?

MRF7S21170HR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF7S21170HR3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF7S21170HR3?

For technical support, including MRF7S21170HR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7S21170HR3 requirements.

6.How does Aetrix verify that MRF7S21170HR3 is sourced from the original manufacturer or authorized distributors?

All MRF7S21170HR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7S21170HR3 meets industry standards.

7.What is the process for return or replacement of MRF7S21170HR3?

All MRF7S21170HR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7S21170HR3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF7S21170HR3 part is unused and in its original packaging.

Return procedure for MRF7S21170HR3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF7S21170HR3 Tags

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