NXP Semiconductors MRF7S21210HSR5
- Part No.:
- MRF7S21210HSR5
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-780S
- Datasheet:
-
MRF7S21210HSR5.pdf
- Description:
- RF MOSFET LDMOS 28V NI780
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MRF7S21210HSR5 from NXP Semiconductors (formerly Freescale) is a laterally diffused N-channel enhancement-mode RF power MOSFET designed for 2110–2170 MHz CDMA/W-CDMA base station final-stage amplification. It delivers 63 W average output power at 28 V, 1400 mA quiescent drain current, with 18.5 dB power gain and −33 dBc ACPR in 3.84 MHz channel bandwidth under single-carrier W-CDMA modulation.
For engineers reviewing the MRF7S21210HSR5 datasheet, MRF7S21210HSR5 pinout, MRF7S21210HSR5 application, or MRF7S21210HSR5 equivalent, this device is selected for high-efficiency, digitally predistorted cellular infrastructure transmitters requiring robust 5:1 VSWR tolerance, guaranteed PAR handling, and integrated ESD protection in NI-780S package.
Technical Context
This LDMOS transistor operates in Class AB or Class C with internally matched input/output impedances optimized for 2110–2170 MHz band. Its large-signal series-equivalent impedance parameters (e.g., Zsource = 4.34 − j1.05 Ω, Zload = 1.32 − j0.99 Ω at 2140 MHz) are characterized for direct integration into broadband matching networks without external tuning.
The device supports digital predistortion (DPD) via low group delay variation (2.5 ns avg.), tight phase linearity (1.1° avg. deviation), and stable gain flatness (1.2 dB over 60 MHz). Its −6.0 to +10 VGS rating enables extended negative gate bias for improved Class C efficiency and thermal robustness up to TJ = 225°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2110–2170 MHz - Covers full UMTS Band I uplink; validated across 60 MHz bandwidth with ≤1.2 dB gain flatness. |
| Output Power (Avg.) | 63 W @ 28 V, 1400 mA - Sustains W-CDMA signal with 7.5 dB PAR at 0.01% CCDF probability. |
| Power Gain | 18.5 dB typ. - Enables compact driver stage design; ≥17 dB min. ensures margin across temperature (−30°C to +85°C). |
| Drain Efficiency | 29% typ. - Reduces thermal load in densely packed macrocell PA modules; derates linearly above 25°C case temp. |
| VSWR Tolerance | 5:1 @ 32 V, 2140 MHz, 190 W CW - Eliminates need for external circulators in outdoor base station deployments. |
| ESD Rating | HBM Class 1C (≥2 kV), MM Class A - Survives handling and board-level ESD events without gate oxide damage. |
| Junction Temp. Max | 225°C - Supports high-power density layouts with RθJC = 0.37°C/W at 63 W operation. |
Pinout & Package
Package: NI-780S (Case 465A-06, Style 1), thermally enhanced ceramic/metal flange-mount package with solderable baseplate and 3-terminal configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | High-current RF output node | Electrically and thermally connected to metal flange; requires low-impedance RF ground and heatsink interface. |
| Source | RF return path and DC reference | Internally tied to flange; must be DC-grounded via low-inductance path to maintain stability and thermal conduction. |
| Gate | RF input control terminal | High-impedance node requiring ESD-protected bias network; gate threshold is 1.2–2.7 V, quiescent VGS = 2.7 V. |
Key Features
| Feature | Design Value |
|---|---|
| 100% PAR-tested output capability | Guarantees 63 W avg. W-CDMA output with ≤5.9 dB device PAR at 0.01% CCDF - eliminates post-screening yield loss. |
| Internally matched impedance | Zin ≈ 4.34 − j1.05 Ω, Zout ≈ 1.32 − j0.99 Ω at 2140 MHz - reduces external matching complexity and PCB area. |
| Digital predistortion optimization | Group delay variation ≤26° (6σ), phase linearity ≤1.1° deviation - minimizes DPD convergence time and residual error. |
| Enhanced negative VGS range | −6.0 V rating - enables deeper Class C biasing for higher efficiency in burst-mode TD-SCDMA or LTE-TDD applications. |
| RoHS-compliant tape-and-reel | R5 suffix = 500 units, 56 mm tape width, 13-inch reel - supports automated SMT placement in high-volume base station PA assembly. |
Applications
| Macrocell Base Station Transmitter | Remote Radio Head (RRH) |
|---|---|
|
Use Scenario: High-power uplink amplifier in 3G/4G macrocell BTS operating in Band I (2110–2170 MHz) with W-CDMA or LTE modulation. IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 63 W avg. output with −33 dBc ACPR after DPD correction. Use Value: 29% drain efficiency and 5:1 VSWR tolerance reduce cooling requirements and improve field reliability in uncontrolled environmental enclosures. |
Use Scenario: Compact, thermally constrained amplifier module in fiber-fed remote radio head deployed on cell tower antennas. IC Role / Device Role / Timing Role: High-efficiency RF output stage enabling >60 W avg. output in <100 cm³ form factor with minimal heatsinking. Use Value: Low RθJC (0.37°C/W) and 225°C max junction temperature allow operation at elevated ambient temperatures without derating. |
| Multi-Carrier Doherty Amplifier | Wideband Digital Pre-Distortion System |
|
Use Scenario: Peak power transistor in asymmetric Doherty architecture for 20+ MHz LTE carriers with high PAPR. IC Role / Device Role / Timing Role: Auxiliary (peaking) amplifier biased in Class C, leveraging −6 VGS rating for optimal efficiency compression tracking. Use Value: Tight part-to-part phase variation (≤26° at 190 W) ensures consistent combining network performance across production lots. |
Use Scenario: Linearized PA core in closed-loop DPD system using FPGA-based real-time correction algorithms. IC Role / Device Role / Timing Role: RF power device with predictable memoryless nonlinearity and low group delay dispersion for accurate model extraction. Use Value: Characterized large-signal impedance data and IMD symmetry (15 MHz) simplify behavioral model generation and reduce DPD calibration time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF7S21210HR5 | Same die, NI-780 (not NI-780S) package; RθJC = 0.33°C/W at 190 W but no flange solderability; different test fixture layout (Z12/Z13 dimensions). | Preferred for legacy designs using older Freescale test board; lacks NI-780S's enhanced thermal interface for high-reliability outdoor deployment. | Select MRF7S21210HR5 only when reusing existing PCB footprints and thermal pads designed for NI-780. |
| AFM906S | Same frequency band and power class (60 W avg.), but GaN-on-SiC; 55% efficiency vs. 29%, 10× higher gain (22 dB), RθJC = 0.25°C/W. | Enables smaller heatsinks and lower supply current, but requires stricter gate drive protection and different bias sequencing. | Choose AFM906S for new designs prioritizing efficiency and size reduction; retain MRF7S21210HSR5 for cost-sensitive, proven-LDMOS infrastructure upgrades. |
Compared with MRF7S21210HR5, MRF7S21210HSR5 offers superior thermal interface and compatibility with modern high-power RF PCB stackups; versus AFM906S, it provides lower gate drive complexity and broader legacy ecosystem support despite lower efficiency.
Availability
MRF7S21210HSR5 is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, multi-carrier Doherty amplifiers, and wideband digital predistortion systems requiring stable component supply, long lifecycle assurance, and traceable sourcing for telecom infrastructure programs.
Supply support for MRF7S21210HSR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in high-performance RF power solutions, formed from the acquisition of Freescale Semiconductor in 2015. The company specializes in silicon and GaN RF transistors for wireless infrastructure, broadcast, and industrial heating.
The MRF7S21210HSR5 belongs to NXP's LDMOS RF power transistor family, engineered specifically for energy-efficient, thermally robust cellular base station amplifiers operating in licensed sub-3 GHz spectrum bands.
FAQ
What is the maximum continuous drain current rating for MRF7S21210HSR5?
The MRF7S21210HSR5 does not specify a standalone maximum continuous drain current (ID) rating. Instead, its safe operating area is defined by voltage, power, and thermal limits: VDS ≤ +65 V, PDC ≤ 253 W at TC = 25°C (derating 1.5 W/°C above), and TJ ≤ 225°C. At typical 28 V operation with 1400 mA quiescent current, the device sustains 63 W average RF output under W-CDMA modulation without exceeding thermal limits.
Does MRF7S21210HSR5 require external input/output matching networks?
No, the MRF7S21210HSR5 is internally matched for 50 Ω systems across 2110–2170 MHz. Its characterized source and load impedances (e.g., Zsource = 4.34 − j1.05 Ω, Zload = 1.32 − j0.99 Ω at 2140 MHz) are intended for direct integration into microstrip-based matching circuits per Freescale's published test fixture. External lumped-element matching is unnecessary for standard applications but may be added for narrowband optimization.
What is the gate threshold voltage range for MRF7S21210HSR5?
The gate threshold voltage (VGS(th)) for MRF7S21210HSR5 is specified as 1.2 V minimum, 2.0 V typical, and 2.7 V maximum, measured at VDS = 10 V and ID = 513 μA. This range ensures consistent turn-on behavior across process variation and supports stable Class AB biasing with VGS(Q) = 2.7 V typical at IDQ = 1400 mA and VDD = 28 V.
How does MRF7S21210HSR5 support digital predistortion (DPD) systems?
The MRF7S21210HSR5 supports DPD through low group delay variation (2.5 ns average), tight phase linearity (1.1° deviation over 60 MHz), and characterized large-signal impedance data. Its IMD symmetry (15 MHz) and predictable memoryless distortion enable accurate behavioral modeling. The device's 100% PAR testing ensures consistent peak power capability, reducing DPD loop convergence time and residual error in live W-CDMA/LTE signals.
What is the difference between MRF7S21210HSR3 and MRF7S21210HSR5?
The MRF7S21210HSR5 and MRF7S21210HSR3 share identical die, electrical specifications, and NI-780S package. The suffix "R5" denotes 500-unit tape-and-reel packaging (56 mm tape width, 13-inch reel), while "R3" indicates 250-unit packaging. Both are RoHS-compliant and functionally interchangeable; selection depends solely on production volume and SMT line feed requirements.
MRF7S21210HSR5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-780S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 2.17GHz
- Gain:
- 18.5dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.4 A
- Power - Output:
- 63W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-780S
MRF7S21210HSR5 FAQ
1.How can I place an order for MRF7S21210HSR5 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRF7S21210HSR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRF7S21210HSR5 reliable?
The price and inventory of MRF7S21210HSR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF7S21210HSR5 is usually 5 days.
3.What payment methods are accepted for MRF7S21210HSR5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF7S21210HSR5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRF7S21210HSR5?
MRF7S21210HSR5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRF7S21210HSR5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRF7S21210HSR5?
For technical support, including MRF7S21210HSR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF7S21210HSR5 requirements.
6.How does Aetrix verify that MRF7S21210HSR5 is sourced from the original manufacturer or authorized distributors?
All MRF7S21210HSR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF7S21210HSR5 meets industry standards.
7.What is the process for return or replacement of MRF7S21210HSR5?
All MRF7S21210HSR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRF7S21210HSR5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRF7S21210HSR5 part is unused and in its original packaging.
Return procedure for MRF7S21210HSR5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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