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NXP Semiconductors MRF8P23160WHSR3

Part No.:
MRF8P23160WHSR3
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
NI-780-4
Datasheet:
AetrixMRF8P23160WHSR3.pdf
Description:
RF MOSFET 28V NI780
Quantity:
Payment:
Payment
Shipping:
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Inventory:7,807

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Product details

Overview

MRF8P23160WHSR3 from Freescale Semiconductor is a 2300–2400 MHz, 30 W average output power, N-channel enhancement-mode lateral RF power MOSFET designed for symmetrical Doherty amplifier stages in base station transmitters. It delivers 14.1 dB power gain, 38.3% drain efficiency, and –32.2 dBc ACPR at 2350 MHz under single-carrier W-CDMA conditions (3.84 MHz bandwidth, 9.9 dB PAR), supporting digital predistortion linearization.

For engineers reviewing the MRF8P23160WHSR3 datasheet, MRF8P23160WHSR3 pinout, MRF8P23160WHSR3 application, or MRF8P23160WHSR3 equivalent, this device requires attention to gate biasing (VGSB = 1.2 Vdc), dual-input/dual-output Doherty configuration, thermal derating above 25°C, and NI-780S-4 package handling with 32 mm tape width.

Technical Context

This device operates as a carrier-side transistor in a symmetrical Doherty architecture, with separate RF input (RFinA/VGSA and RFinB/VGSB) and RF output (RFoutA/VDSA and RFoutB/VDSB) terminals. Its internal matching enables 50 Ω system integration without external broadband matching networks.

It supports wide instantaneous bandwidth (100 MHz), handles 10:1 VSWR at 144 W CW, and features integrated ESD protection rated Class 2 HBM. The gate threshold voltage (1.2–2.7 Vdc) and quiescent gate voltage (typ. 2.8 Vdc) are optimized for Class AB/C operation with digital predistortion feedback loops.

Key Specifications

ParameterValue and Actual Design Meaning
Frequency Range2300–2400 MHz - Supports full LTE Band 40 (TDD) and WiMAX 2.3–2.4 GHz infrastructure.
Avg. Output Power30 W - Sustained average RF output under W-CDMA single-carrier signal with 9.9 dB PAR.
Power Gain14.1 dB typ. @ 2350 MHz - Enables compact driver stage design with minimal cascaded gain stages.
Drain Efficiency38.3% typ. @ 2350 MHz - Reduces thermal load and DC power consumption in high-density macro base stations.
ACPR–32.2 dBc @ ±5 MHz offset - Meets 3GPP spectral mask requirements for adjacent channel leakage.
P3dB Output190 W - Provides headroom for transient peaks and ensures linearity margin in DPD-enabled systems.
VSWR Tolerance10:1 @ 144 W CW - Allows robust operation into mismatched antenna loads without protection circuitry.
Junction Temp225°C max - Enables high-power density packaging with thermal resistance of 0.43°C/W at 101°C case temp.

Pinout & Package

Package: NI-780S-4 (Case 465M-01, Style 1), surface-mount ceramic/metal hybrid with exposed thermal pad. Dimensions per Freescale drawing; 32 mm tape width, 250 units/reel (R3 suffix).

Pin/TerminalCircuit RoleDesign Meaning
1 (RFinA / VGSA)Carrier Amplifier Gate InputBias-controlled RF input for main (carrier) transistor; requires stable 2.8 Vdc quiescent gate voltage.
2 (RFinB / VGSB)Peaking Amplifier Gate InputSeparate gate terminal for peaking path; biased at 1.2 Vdc for Class C operation in Doherty mode.
3 (RFoutA / VDSA)Carrier Amplifier Drain OutputMain RF output node; internally matched to ~5.6 Ω real part at 2350 MHz for optimal P1dB tuning.
4 (RFoutB / VDSB)Peaking Amplifier Drain OutputSecondary RF output; combined with Pin 3 via hybrid coupler to achieve Doherty power combining.

Key Features

FeatureDesign Value
Internally Matched I/OEliminates discrete matching networks for 50 Ω system integration, reducing PCB area and assembly cost.
Symmetrical Doherty Validation100% production-tested in Freescale's reference Doherty fixture, guaranteeing gain/efficiency performance at 30 W avg.
Wide Instantaneous Bandwidth100 MHz signal bandwidth support enables multi-carrier LTE and future 5G NR TDD deployments.
Integrated ESD ProtectionHBM Class 2 (2 kV) and MM Class B ensure robustness during board assembly and field operation.
Negative VGS Capability–6.0 Vdc gate-source rating enables deep Class C biasing for peaking path efficiency optimization.
Digital Predistortion ReadyCharacterized with large-signal load-pull and common-source S-parameters for accurate behavioral model extraction.

Applications

Macro Base Station TransmitterSmall Cell Remote Radio Head

Use Scenario: High-power outdoor macro cell site operating in 2300–2400 MHz TDD-LTE band with 20 MHz channel bandwidth and 8×8 MIMO.

IC Role / Device Role / Timing Role: Carrier-path RF power transistor in symmetrical Doherty PA module delivering 30 W avg. per antenna branch.

Use Value: Delivers 38.3% drain efficiency and –32.2 dBc ACPR while maintaining 14.1 dB gain, enabling energy-efficient 4G/5G co-location.

Use Scenario: Indoor/outdoor distributed antenna system (DAS) node requiring compact, thermally efficient 2.3 GHz amplification.

IC Role / Device Role / Timing Role: Final-stage power transistor in dual-path Doherty PA module integrated into remote radio head (RRH) assembly.

Use Value: NI-780S-4 package with 0.43°C/W thermal resistance enables passive cooling in space-constrained RRH enclosures.

WiMAX Base Station PADPD-Enabled Test Equipment

Use Scenario: Fixed wireless access base station compliant with IEEE 802.16e-2005 operating across 2300–2400 MHz spectrum.

IC Role / Device Role / Timing Role: Linearized RF output stage using digital predistortion to meet stringent ACLR requirements.

Use Value: 100% PAR-tested output capability and characterized load-pull data simplify DPD model training and convergence.

Use Scenario: Lab-grade RF signal generator or vector signal analyzer output stage requiring high-fidelity, broadband W-CDMA stimulus.

IC Role / Device Role / Timing Role: Calibrated high-linearity output amplifier for generating standardized test signals with controlled PAR and spectral purity.

Use Value: Guaranteed –31.0 to –33.1 dBc ACPR across 2300–2400 MHz enables repeatable conformance testing per 3GPP TS 34.121.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AFM8P23160WHR3Same die, different package (NI-780-4, 56 mm tape); identical electrical specs and thermal resistance (0.69°C/W at 80°C case).Requires wider tape feed mechanism; not interchangeable in automated placement without retooling.Select MRF8P23160WHSR3 for 32 mm tape width compatibility and lower thermal resistance at elevated case temps.
QPD1025Gallium nitride HEMT; higher P3dB (220 W), higher gain (15.5 dB), but requires +50 V bias and external gate protection.Not drop-in; needs redesigned bias network, thermal interface, and layout due to higher power density and voltage.Choose QPD1025 only when >200 W P3dB and >40% efficiency at 2.35 GHz are mandatory and 50 V infrastructure exists.

Compared with AFM8P23160WHR3, MRF8P23160WHSR3 offers superior thermal performance at high case temperatures (0.43 vs. 0.69°C/W) and narrower tape compatibility; versus QPD1025, it provides proven LDMOS reliability at 28 V with no gate protection overhead, but trades peak power and gain for ease of adoption.

Availability

MRF8P23160WHSR3 is available at Aetrix Electronics and suitable for macro base station transmitters, small cell remote radio heads, WiMAX infrastructure, and DPD-enabled test equipment requiring stable component supply across multi-year production cycles.

Supply support for MRF8P23160WHSR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in RF power solutions for wireless infrastructure, with decades of LDMOS process expertise and rigorous qualification for telecom applications.

The MRF8P23160WHSR3 belongs to Freescale's MRF8P family of high-efficiency, broadband RF power transistors engineered specifically for Doherty-based base station PAs operating in 1.8–2.7 GHz bands.

FAQ

What is the recommended gate bias configuration for MRF8P23160WHSR3 in Doherty operation?

The MRF8P23160WHSR3 requires two independent gate biases: VGSA ≈ 2.8 Vdc for the carrier path (Pin 1) and VGSB = 1.2 Vdc for the peaking path (Pin 2). These values are validated in Freescale's symmetrical Doherty test fixture and ensure optimal gain balance and efficiency tracking. Deviations beyond ±0.1 Vdc degrade PAR handling and ACPR performance. The MRF8P23160WHSR3 datasheet specifies fixture gate quiescent voltage (VGGA(Q)) as 4.1–7.1 Vdc due to on-board resistor divider networks, but actual device-level VGS must remain within the stated range.

Does MRF8P23160WHSR3 require external output matching networks?

No, the MRF8P23160WHSR3 is internally matched for 50 Ω systems at 2300–2400 MHz, eliminating the need for discrete output matching components in standard Doherty implementations. Freescale characterizes the device with Zload = 5.58–j10.3 Ω (2300 MHz) to 5.96–j10.5 Ω (2400 MHz) for maximum P1dB, and these impedances are realized through integrated passive structures. External matching is only required for non-standard load conditions or harmonic suppression.

What thermal derating applies to MRF8P23160WHSR3 above 25°C case temperature?

The MRF8P23160WHSR3 has a thermal resistance of 0.43°C/W at 101°C case temperature (per Table 2), meaning its safe continuous-wave power must be reduced by 0.43 W per °C rise above 25°C. At TC = 80°C, the derated CW limit is 129 W (from 129 W @ 25°C with 0.48 W/°C slope), and junction temperature must not exceed 225°C. Proper heatsinking and airflow are essential to maintain TC ≤ 101°C for full 144 W CW capability.

Can MRF8P23160WHSR3 be used in non-Doherty Class AB amplifiers?

Yes, the MRF8P23160WHSR3 functions as a high-gain, high-efficiency RF power transistor in Class AB configurations, though its internal matching and characterization emphasize Doherty use. At 2350 MHz, it delivers 14.1 dB gain and 38.3% efficiency at 30 W avg. in single-ended mode. However, its dual-gate/dual-drain structure is optimized for Doherty signal combining; standalone use forfeits the 100 MHz bandwidth advantage and requires re-optimization of input/output impedance for best P1dB.

What ESD protection level does MRF8P23160WHSR3 provide, and how is it verified?

The MRF8P23160WHSR3 incorporates integrated ESD protection rated Class 2 per JESD22-A114 (2 kV HBM), Class B per EIA/JESD22-A115 (machine model), and Class IV per JESD22-C101 (charge device model). This is confirmed through wafer-level and final-test screening per Freescale's qualified process flow. The protection circuitry is monolithically integrated and does not require external TVS diodes, simplifying layout and improving reliability in automated assembly environments where static discharge risk is elevated.

MRF8P23160WHSR3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
NI-780-4
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
MOSFET (Metal Oxide)
Configuration:
N-Channel
Frequency:
2.32GHz
Gain:
14.1dB
Voltage - Test:
28 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
600 mA
Power - Output:
30W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
NI-780-4

MRF8P23160WHSR3 FAQ

1.How can I place an order for MRF8P23160WHSR3 through Aetrix?

Please submit a Request for Quotation (RFQ) for MRF8P23160WHSR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MRF8P23160WHSR3 reliable?

The price and inventory of MRF8P23160WHSR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRF8P23160WHSR3 is usually 5 days.

3.What payment methods are accepted for MRF8P23160WHSR3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRF8P23160WHSR3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MRF8P23160WHSR3?

MRF8P23160WHSR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MRF8P23160WHSR3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MRF8P23160WHSR3?

For technical support, including MRF8P23160WHSR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRF8P23160WHSR3 requirements.

6.How does Aetrix verify that MRF8P23160WHSR3 is sourced from the original manufacturer or authorized distributors?

All MRF8P23160WHSR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRF8P23160WHSR3 meets industry standards.

7.What is the process for return or replacement of MRF8P23160WHSR3?

All MRF8P23160WHSR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRF8P23160WHSR3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MRF8P23160WHSR3 part is unused and in its original packaging.

Return procedure for MRF8P23160WHSR3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MRF8P23160WHSR3 Tags

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