NXP Semiconductors MRFE6P3300HR3
- Part No.:
- MRFE6P3300HR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-860C3
- Datasheet:
-
MRFE6P3300HR3.pdf
- Description:
- RF MOSFET LDMOS 32V NI860C3
- Quantity:
- Payment:

- Shipping:

Inventory:8,249
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MRFE6P3300HR3 from NXP Semiconductors (formerly Freescale) is an N-channel enhancement-mode lateral RF power MOSFET designed for broadband large-signal amplifier applications in 32 V analog/digital TV transmitters. It delivers 270 W PEP output at 860 MHz, with 20.4 dB power gain, 44.8% drain efficiency, and -28.8 dBc intermodulation distortion under narrowband two-tone test conditions.
For engineers reviewing the MRFE6P3300HR3 datasheet, MRFE6P3300HR3 pinout, MRFE6P3300HR3 application, or MRFE6P3300HR3 equivalent, this device requires push-pull configuration, operates up to 32 VDD, handles 10:1 VSWR at 860 MHz, and is internally matched for 470–860 MHz commercial broadcast systems.
Technical Context
This RF power transistor uses a laterally diffused MOS (LDMOS) structure optimized for high-voltage, high-power operation in common-source amplifier topologies. Its internal matching network targets 50 Ω source and load impedances across 470–860 MHz, with series-equivalent impedance characterization provided for design-in accuracy.
The device is qualified for 32 VDC drain supply, features integrated ESD protection rated Class 3B HBM, and is thermally characterized with junction-to-case thermal resistance as low as 0.23 °C/W at 300 W CW - enabling robust thermal management in high-reliability broadcast amplifiers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 470–860 MHz - supports full UHF TV broadcast band without external tuning. |
| Output Power (PEP) | 270 W @ 860 MHz - sufficient for high-power single-carrier and OFDM DVB-T transmitter stages. |
| Power Gain | 20.4 dB @ 860 MHz - enables compact multi-stage amplifier designs with minimal driver stage complexity. |
| Drain Efficiency | 44.8% @ 270 W PEP - reduces heat dissipation and power supply burden in continuous-duty broadcast systems. |
| VSWR Tolerance | 10:1 @ 32 V, 860 MHz, 3 dB overdrive - ensures operational ruggedness against antenna mismatch in field-deployed transmitters. |
| Junction Temp. Max | 225 °C - allows sustained high-power operation with appropriate heatsinking per RθJC = 0.23 °C/W. |
| ESD Rating | HBM Class 3B (≥8 kV) - provides built-in protection against handling-induced gate damage during assembly. |
Pinout & Package
MRFE6P3300HR3 is housed in the NI-860C3 package (Case 375G-04, Style 1), a ceramic/metal flanged package with five terminals optimized for RF power dissipation and thermal stability. The flange serves as the primary thermal path and must be mounted to a heatsink with controlled torque (recommended bolt center: 1.140″).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | Drain | Parallel-connected drain terminals - carry full RF output current; require low-inductance connection to output matching network and DC supply. |
| 3, 4 | Gate | Differential gate inputs - configured for balanced push-pull drive; internal matching applies to gate-to-gate impedance (e.g., 4.22 − j6.38 Ω @ 860 MHz). |
| 5 | Source | Common source reference - serves as RF ground return and bias reference point; must be low-impedance to minimize instability. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Eliminates need for external input/output matching networks in 470–860 MHz band - reduces PCB area and tuning complexity. |
| Push-pull only operation | Optimized gate and drain layout for balanced differential drive - prevents single-ended use and ensures thermal symmetry. |
| Ruggedized construction | Rated for 10:1 VSWR at full power - protects against reflected energy in antenna-coupled broadcast systems without external circulators. |
| Integrated ESD protection | HBM Class 3B, MM Class C, CDM Class IV - enables safe handling and assembly without additional gate protection circuitry. |
| RoHS-compliant packaging | Tape-and-reel (R3 suffix: 250 units/reel) - supports automated SMT placement in high-volume broadcast equipment manufacturing. |
Applications
| UHF Digital TV Transmitter | FM/TV Broadcast Amplifier |
|---|---|
|
Use Scenario: Final-stage power amplification in 8K-mode DVB-T OFDM transmitters operating at 860 MHz with 64-QAM modulation. IC Role / Device Role / Timing Role: High-efficiency RF power MOSFET in push-pull common-source configuration delivering 270 W PEP output. Use Value: Achieves -28.8 dBc IMD and 44.8% drain efficiency at 270 W - directly meets ETSI EN 300 744 spectral mask requirements for terrestrial broadcast. |
Use Scenario: Solid-state replacement for vacuum tube amplifiers in analog/digital TV headend distribution systems. IC Role / Device Role / Timing Role: Primary RF power gain element in broadband 470–860 MHz linear amplifier modules. Use Value: Handles 10:1 VSWR without derating - eliminates need for external isolators in antenna feedline mismatch scenarios. |
| OFDM Signal Amplification | High-Power RF Test Equipment |
|
Use Scenario: Linear amplification of high-PAR OFDM signals (e.g., DVB-T, LTE) requiring wide instantaneous bandwidth and low ACPR. IC Role / Device Role / Timing Role: Final-stage LDMOS transistor biased at 1600 mA quiescent current for optimal linearity. Use Value: Delivers -50 dBc ACPR at 60 W avg. output - supports clean spectral regrowth performance in multi-carrier signal generation. |
Use Scenario: Programmable RF power source in automated test systems requiring stable 300 W CW output capability. IC Role / Device Role / Timing Role: High-reliability RF power device operated in pulsed-CW mode (12 μs on, 1% duty cycle). Use Value: MTTF > 1 million hours at 150 °C junction temperature - ensures long-term calibration stability in production test environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRFE6P3300HR5 | Same die, different tape-and-reel packaging (50 units/reel vs. 250); identical electrical specs and thermal ratings. | No functional difference - used interchangeably where reel size or inventory logistics dictate smaller batches. | Select MRFE6P3300HR5 only when lower per-reel quantity aligns with pilot production or qualification testing needs. |
| AFM30500N | Higher P1dB (340 W), wider bandwidth (10–1000 MHz), but lower gain (17.5 dB @ 860 MHz) and no internal matching. | Suitable for multi-band lab-grade amplifiers but requires full external matching - not drop-in for broadcast TV final stages. | Choose AFM30500N only when broader frequency coverage and higher peak power outweigh the need for simplified layout and proven broadcast reliability. |
Compared with MRFE6P3300HR3, MRFE6P3300HR5 offers identical RF performance in a smaller reel format, while AFM30500N trades ease of integration and broadcast-optimized linearity for wider bandwidth and higher peak power - making MRFE6P3300HR3 the preferred choice for production UHF TV transmitter final stages.
Availability
MRFE6P3300HR3 is available at Aetrix Electronics and suitable for UHF broadcast transmitters, digital TV headends, and high-power RF test instrumentation requiring stable component supply, long-lifecycle support, and RoHS-compliant sourcing.
Supply support for MRFE6P3300HR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in high-performance RF, automotive, and secure connectivity solutions, with deep heritage in RF power technology from its Freescale acquisition.
The MRFE6P3300HR3 belongs to NXP's MRFE6P family of LDMOS RF power transistors, engineered specifically for high-efficiency, high-ruggedness UHF broadcast amplifier applications demanding reliability under continuous high-VSWR conditions.
FAQ
What is the maximum drain voltage rating for MRFE6P3300HR3?
The MRFE6P3300HR3 has a maximum drain-source voltage (VDSS) rating of +66 VDC. However, it is qualified and characterized for operation up to 32 VDC in standard applications - exceeding this voltage risks permanent device failure and voids reliability guarantees. All published performance data, including 270 W PEP output and 44.8% efficiency, assume VDD = 32 VDC.
Can MRFE6P3300HR3 be used in single-ended amplifier configurations?
No, MRFE6P3300HR3 is explicitly designed for push-pull operation only, as stated in its official documentation. Its internal layout, gate terminal configuration (dual gate pins), and impedance characteristics assume balanced differential drive. Attempting single-ended use violates the device's design intent and may cause thermal imbalance, instability, or premature failure.
What thermal resistance value applies to MRFE6P3300HR3 at full 300 W CW output?
At 300 W CW with case temperature maintained at 80°C, the MRFE6P3300HR3 exhibits a junction-to-case thermal resistance (RθJC) of 0.23 °C/W. This value is measured under controlled lab conditions and assumes proper mounting with recommended torque and thermal interface material - actual system-level RθJA will depend on heatsink design and airflow.
Does MRFE6P3300HR3 include integrated ESD protection, and what standards does it meet?
Yes, MRFE6P3300HR3 includes integrated ESD protection meeting Human Body Model Class 3B (≥8 kV), Machine Model Class C, and Charge Device Model Class IV. These ratings are verified per JESD22-A114, EIA/JESD22-A115, and JESD22-C101 - eliminating the need for external gate protection diodes in standard handling and assembly environments.
What is the gate threshold voltage range for MRFE6P3300HR3 at 25°C?
The gate threshold voltage (VGS(th)) for MRFE6P3300HR3 is specified from 1.0 V to 3.0 V at VDS = 10 VDC and ID = 350 μADC, with a typical value of 2.2 V. This parameter defines the minimum gate voltage required to initiate conduction and is critical for setting accurate quiescent bias - the device's typical gate quiescent voltage (VGS(Q)) is 2.8 V at IDQ = 1600 mADC and VDD = 32 VDC.
MRFE6P3300HR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-860C3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 857MHz ~ 863MHz
- Gain:
- 20.4dB
- Voltage - Test:
- 32 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.6 A
- Power - Output:
- 270W
- Voltage - Rated:
- 66 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-860C3
MRFE6P3300HR3 FAQ
1.How can I place an order for MRFE6P3300HR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFE6P3300HR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFE6P3300HR3 reliable?
The price and inventory of MRFE6P3300HR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFE6P3300HR3 is usually 5 days.
3.What payment methods are accepted for MRFE6P3300HR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFE6P3300HR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFE6P3300HR3?
MRFE6P3300HR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFE6P3300HR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFE6P3300HR3?
For technical support, including MRFE6P3300HR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFE6P3300HR3 requirements.
6.How does Aetrix verify that MRFE6P3300HR3 is sourced from the original manufacturer or authorized distributors?
All MRFE6P3300HR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFE6P3300HR3 meets industry standards.
7.What is the process for return or replacement of MRFE6P3300HR3?
All MRFE6P3300HR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRFE6P3300HR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFE6P3300HR3 part is unused and in its original packaging.
Return procedure for MRFE6P3300HR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MRFE6P3300HR3 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
