NXP Semiconductors MRFE6P9220HR3
- Part No.:
- MRFE6P9220HR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-860C3
- Datasheet:
-
MRFE6P9220HR3.pdf
- Description:
- RF MOSFET LDMOS 28V NI860C3
- Quantity:
- Payment:

- Shipping:

Inventory:3,139
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MRFE6P9220HR3 from Freescale Semiconductor is an N-channel enhancement-mode lateral RF power MOSFET designed for broadband common-source amplifier applications in 28 V base station equipment. It delivers 47 W average output power at 880 MHz under N-CDMA modulation, achieves 20 dB power gain and 30% drain efficiency, and supports 865–900 MHz operation with rugged 10:1 VSWR tolerance at 350 W CW.
For engineers reviewing the MRFE6P9220HR3 datasheet, MRFE6P9220HR3 pinout, MRFE6P9220HR3 application, or MRFE6P9220HR3 equivalent, this device is selected for high-reliability, high-efficiency RF power amplification in cellular infrastructure where thermal robustness, intermodulation linearity, and push-pull configuration stability are critical design requirements.
Technical Context
This device operates as a single-ended, internally matched RF power transistor optimized for push-pull configurations only. Its lateral LDMOS structure enables stable operation up to 225°C junction temperature, with series-equivalent large-signal impedance characterization provided across 850–910 MHz for precise matching network design.
Thermal resistance is specified at 0.25°C/W (junction-to-case, 220 W CW), and ESD protection meets Class 3B HBM, Class C MM, and Class IV CDM per JEDEC standards. The NI-860C3 package (Case 375G-04, Style 1) integrates a flanged metal-ceramic construction for direct heatsink mounting and low-inductance drain connections.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 865–900 MHz - Validated bandwidth for N-CDMA base station amplifiers with flat gain response. |
| Pout (Avg., N-CDMA) | 47 W @ 880 MHz - Sustained average output under IS-95 CDMA signal with 9.8 dB PAR. |
| P1dB (CW) | 220 W - Output power at 1 dB compression point, defining linear operating ceiling for CW signals. |
| Power Gain | 20 dB typical - Enables compact driver stage design with minimal cascaded gain stages required. |
| Drain Efficiency | 30% @ 47 W Avg. - Reduces thermal load and DC power consumption in 28 V macrocell PA designs. |
| VSWR Tolerance | 10:1 @ 350 W CW - Supports antenna mismatch resilience without device failure in deployed systems. |
| Junction Temp. Max | 225°C - Enables high-power density layout with conservative derating margins for long-term reliability. |
| RθJC | 0.25°C/W @ 220 W - Confirms effective thermal path to heatsink, critical for continuous-wave thermal management. |
Pinout & Package
The MRFE6P9220HR3 uses the NI-860C3 metal-ceramic flange package (Case 375G-04, Style 1), featuring a thermally optimized lid-and-insulator construction with four mounting holes and direct-drain thermal path. Pin numbering follows standard top-view orientation with pin 1 at top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | Drain | Parallel-connected high-current RF output terminals; require low-inductance PCB microstrip routing and direct heatsink contact. |
| 3, 4 | Gate | Differential gate inputs for push-pull drive; internally isolated and matched for balanced operation only. |
| 5 | Source | Common source reference node; serves as RF ground return and thermal conduction path via flange mounting. |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched I/O | Reduces external matching complexity - input/output impedances characterized as series equivalents (e.g., Zsource = 3.59 − j7.07 Ω @ 880 MHz). |
| Push-pull only design | Ensures optimal linearity and thermal symmetry - not rated for single-ended operation per datasheet qualification. |
| Enhanced ruggedness | Validated for 10:1 VSWR at 350 W CW with 2 dB input overdrive - eliminates need for external circulators in many macrocell deployments. |
| Integrated ESD protection | Meets JESD22-A114 Class 3B (HBM), enabling safer handling and reduced board-level protection circuitry. |
| RoHS-compliant packaging | Lead-free ceramic/metal construction with Ni/Au plating - compliant with EU Directive 2011/65/EU and industrial environmental requirements. |
Applications
| Cellular Base Station PA | ISM Band Amplifier |
|---|---|
|
Use Scenario: High-efficiency final-stage power amplifier in 850–900 MHz macrocell BTS supporting N-CDMA and LTE FDD bands. IC Role / Device Role / Timing Role: RF power transistor operating in common-source push-pull configuration delivering 47 W avg. output with ACPR < −46 dBc. Use Value: Enables 30% drain efficiency and 20 dB gain at 880 MHz, reducing system power supply size and thermal management cost. |
Use Scenario: Industrial RF heating amplifier in 915 MHz ISM band requiring high CW output and VSWR tolerance. IC Role / Device Role / Timing Role: Final-stage power device delivering 220 W CW at P1dB with rugged 10:1 VSWR capability. Use Value: Eliminates need for external VSWR protection circuits, lowering BOM count and improving field reliability in uncontrolled load environments. |
| Broadband Wireless Access | Public Safety Radio PA |
|
Use Scenario: Power amplifier in 869–894 MHz broadband wireless access systems (e.g., WiMAX, private LTE) requiring wide instantaneous bandwidth. IC Role / Device Role / Timing Role: Internally matched RF transistor providing 1.1 dB gain flatness over 60 MHz bandwidth at 47 W output. Use Value: Simplifies broadband matching network design while maintaining phase linearity (3.1° avg. deviation) for OFDMA signal fidelity. |
Use Scenario: Mission-critical land-mobile radio (LMR) repeater amplifier operating in 806–869 MHz public safety band. IC Role / Device Role / Timing Role: Ruggedized RF power device qualified for 32 VDD max and 225°C junction temperature. Use Value: Ensures operational continuity under extreme ambient conditions and sustained high-duty-cycle transmission. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRFE6P9300HR5 | Higher P1dB (300 W CW), wider frequency range (700–1000 MHz), same NI-860C3 package but higher IDQ (2000 mA). | Better suited for multi-band macrocell PAs requiring extended low-band coverage and higher peak power headroom. | Select MRFE6P9300HR5 when designing for 700 MHz LTE or hybrid 800/900 MHz systems needing >250 W CW capability. |
| PD85008-E | Lower Pout (25 W avg.), narrower bandwidth (869–894 MHz), different package (SOT-1227), no internal matching - requires full external network. | Targeted at lower-cost, space-constrained small-cell or repeater designs where thermal budget and layout area are tighter. | Choose PD85008-E for compact form factor and simplified procurement, but expect added matching design effort and reduced ruggedness margin. |
Compared with MRFE6P9220HR3, MRFE6P9300HR5 offers greater power headroom and broader frequency support at the cost of higher bias current, while PD85008-E trades performance and ruggedness for smaller footprint and lower unit cost - making MRFE6P9220HR3 the optimal balance for 47 W N-CDMA macrocell PAs requiring proven thermal and VSWR resilience.
Availability
MRFE6P9220HR3 is available at Aetrix Electronics and suitable for cellular infrastructure, broadband wireless access, and public safety radio systems requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.
Supply support for MRFE6P9220HR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in RF power solutions, specializing in high-voltage LDMOS technology for wireless infrastructure and industrial RF applications.
The MRFE6P9220HR3 belongs to Freescale's MRFE6P family of high-ruggedness, internally matched RF power transistors engineered specifically for 28 V base station amplifiers operating in the 800–1000 MHz band.
FAQ
What is the maximum recommended drain voltage for MRFE6P9220HR3?
The MRFE6P9220HR3 is qualified for operation up to +66 VDS and −0.5 VDS, but its rated application specifies 28 VDD operation. Freescale explicitly qualifies the device for "up to a maximum of 32 VDD" in push-pull configuration - exceeding this risks parametric shift and reduced MTTF. Always maintain VGS within −0.5 to +12 V to avoid gate oxide stress.
Can MRFE6P9220HR3 be used in single-ended amplifier configurations?
No - the MRFE6P9220HR3 is explicitly designed for push-pull operation only, as stated in its datasheet features and functional test conditions. All electrical characteristics, including gain, efficiency, and ACPR, are measured and guaranteed only in balanced push-pull configuration. Single-ended use violates qualification and may result in thermal imbalance, instability, or premature failure.
What does the "R3" suffix indicate in MRFE6P9220HR3?
The "R3" suffix denotes tape-and-reel packaging: 250 units per 56 mm width, 13-inch diameter reel. This format ensures automated placement compatibility and ESD-safe handling. The base part number MRFE6P9220H refers to the die and package configuration; R3 adds packaging and logistics specification without altering electrical or thermal performance.
How is thermal performance validated for MRFE6P9220HR3?
Thermal resistance RθJC is measured per AN1955 methodology: 0.25°C/W at 220 W CW with case temperature held at 80°C. Freescale provides an online MTTF calculator (accessible via www.freescale.com/rf) that uses junction temperature, bias, and output power to estimate lifetime - for MRFE6P9220HR3 at 28 V, 47 W avg., and 30% efficiency, calculated MTTF exceeds 106 hours.
What are the key impedance values for matching networks with MRFE6P9220HR3?
At 880 MHz, the MRFE6P9220HR3 exhibits series-equivalent source impedance Zsource = 3.59 − j7.07 Ω and load impedance Zload = 7.41 − j1.19 Ω (balanced push-pull). These values are measured from gate-to-gate and drain-to-drain respectively, and are provided in Table 9 of the datasheet to enable accurate microstrip or lumped-element matching network synthesis without iterative EM simulation.
MRFE6P9220HR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-860C3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 880MHz
- Gain:
- 20dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 1.6 A
- Power - Output:
- 47W
- Voltage - Rated:
- 66 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-860C3
MRFE6P9220HR3 FAQ
1.How can I place an order for MRFE6P9220HR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFE6P9220HR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFE6P9220HR3 reliable?
The price and inventory of MRFE6P9220HR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFE6P9220HR3 is usually 5 days.
3.What payment methods are accepted for MRFE6P9220HR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFE6P9220HR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFE6P9220HR3?
MRFE6P9220HR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFE6P9220HR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFE6P9220HR3?
For technical support, including MRFE6P9220HR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFE6P9220HR3 requirements.
6.How does Aetrix verify that MRFE6P9220HR3 is sourced from the original manufacturer or authorized distributors?
All MRFE6P9220HR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFE6P9220HR3 meets industry standards.
7.What is the process for return or replacement of MRFE6P9220HR3?
All MRFE6P9220HR3 units undergo pre-shipment inspection (PSI). If there is an issue with MRFE6P9220HR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFE6P9220HR3 part is unused and in its original packaging.
Return procedure for MRFE6P9220HR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MRFE6P9220HR3 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
